A display may have an array of organic light-emitting diode display pixels. Each display pixel may have a light-emitting diode that emits light under control of a drive transistor. Each display pixel may also have control transistors for compensating and programming operations. The array of display pixels may have rows and columns. Row lines may be used to apply row control signals to rows of the display pixels. Column lines (data lines) may be used to apply display data and other signals to respective columns of display pixels. A bottom conductive shielding structure may be formed below each drive transistor. The bottom conductive shielding structure may serve to shield the drive transistor from any electric field generated from the adjacent row and column lines. The bottom conductive shielding structure may be electrically floating or coupled to a power supply line.

A method for manufacturing an array substrate which includes: depositing a gate metal film on a base substrate, and forming a first pattern including the gate electrode by a first patterning process; depositing a gate insulating film, a first transparent conductive film, a source/drain metal film and a doped a-Si film sequentially, and forming a second pattern including the pixel electrode, the source electrode, the drain electrode and a doped semiconductor layer by a second patterning process; depositing an a-Si film, and forming a third pattern including a TFT channel, the semiconductor layer and a gate insulating layer via-hole by a third patterning process; depositing a passivation layer film, and forming a fourth pattern including a passivation layer via-hole by a fourth patterning process, the passivation layer via-hole being arranged at a position corresponding to the gate insulating layer via-hole; and depositing a second transparent conductive film on the base substrate with the fourth pattern, and forming a fifth pattern including an electrical connector by a fifth patterning process.

A flexible display and method of manufacturing the same are disclosed. In one aspect, the display includes a flexible substrate including first concave bent portion and a pad formed over the first concave bent portion of the flexible substrate and including a second concave bent portion overlapping the first concave bent portion. The display further includes a connection pin electrically connected to the second concave bent portion. The connection pin has a central portion and a boundary portion surrounding the central portion. The height of the central portion is greater than that of the boundary portion.

A method for fabricating a flexible substrate and a flexible substrate prefabricated component are disclosed, the flexible substrate comprises an electronic device and a flexible layer provided with the electronic device. The fabrication method comprises: disposing a single-sided adhesive layer at a central portion of a surface of a support substrate, an adhesive side of the single-sided adhesive layer being in contact with the support substrate; disposing a double-sided adhesive layer at a peripheral region of the support substrate; disposing the flexible layer on surfaces of the single-sided adhesive layer and the double-sided adhesive layer, the flexible layer being bonded to the double-sided adhesive layer; disposing the electronic device in a region of a surface of the flexible layer corresponding to the single-sided adhesive layer; cutting the flexible layer along a boundary of the electronic device and removing the flexible layer from the single-sided adhesive layer.

A display panel is disclosed that includes: a base substrate, at least one via hole penetrating the base substrate, and first laser-induced graphene formed on a first surface of the base substrate adjacent to the at least one via hole.

A semiconductor device having a semiconductor element (a thin film transistor, a thin film diode, a photoelectric conversion element of silicon PIN junction, or a silicon resistor element) which is light-weight, flexible (bendable), and thin as a whole is provided as well as a method of manufacturing the semiconductor device. In the present invention, the element is not formed on a plastic film. Instead, a flat board such as a substrate is used as a form, the space between the substrate (third substrate (17)) and a layer including the element (peeled layer (13)) is filled with coagulant (typically an adhesive) that serves as a second bonding member (16), and the substrate used as a form (third substrate (17)) is peeled off after the adhesive is coagulated to hold the layer including the element (peeled layer (13)) by the coagulated adhesive (second bonding member (16)) alone. In this way, the present invention achieves thinning of the film and reduction in weight.

Embodiments of this disclosure dislcose a display panel and a manufacturing method thereof, as well as a display device. The display panel comprises an upper substrate and a lower substrate arranged opposite to each other and packaged together, and further comprises an electrically controlled deformable film arranged on a surface of the upper substrate facing away from the lower substrate. The electrically controlled deformable film is configured to adjust its curvature based on a voltage applied on the electrically controlled deformable film, and enable a curvature of the upper substrate and a curvature of the lower substrate to be adjusted synchronously.

According to one embodiment, a display device includes an insulating substrate, a first insulating film, a second insulating film, a third insulating film, a fourth insulating film, a fifth insulating film, a sixth insulating film, a color filter layer, a semiconductor layer disposed between the second insulating film and the third insulating film, and a gate electrode disposed between the third insulating film and the fourth insulating film, wherein the first, fourth, and sixth insulating films are formed of a silicon nitride, and the second, third, and fifth insulating films are formed of a silicon oxide.

Embodiments of the disclosure provide an array substrate, a method of manufacturing an array substrate, a liquid crystal display panel, and a display device. The array substrate comprises: a common electrode and a pixel electrode on a base substrate; and a passivation layer between the common electrode and the pixel electrode. The pixel electrode is a grating structure comprising a plurality of sub-pixel electrodes. The sub-pixel electrode comprises a body structure extending in a first direction, and a bending structure extending in a second direction and formed at an end portion of at least one end of the body structure. A protrusion is disposed at a joint of the body structure and the bending structure.

A TFT substrate and a method for manufacturing the TFT substrate are provided. A TFT structure is formed on a substrate. A color resist layer is formed on the substrate, and a first opening area is formed in the color resist layer at a location corresponding to the TFT structure. A first black matrix is formed in the first opening area such that the TFT structure is covered by the first black matrix. A pixel electrode is formed on the color resist layer and the first black matrix and is electrically coupled to the TFT structure through the first black matrix. With such an arrangement, light can be shielded and light transmittance can be reduced when a panel including the TFT substrate is bent. This helps improve contrast of the panel.