An active matrix substrate includes a display region in which a plurality of pixels are provided and a frame region lying outside the display region. The frame region includes a plurality of peripheral circuit TFTs which are supported by a substrate and which are constituents of a driving circuit. Each of the plurality of peripheral circuit TFTs includes a gate electrode, an oxide semiconductor layer arranged so as to at least partially extend over the gate electrode but to be insulated from the gate electrode, and source and drain electrodes connected with the oxide semiconductor layer.

A display may have an array of organic light-emitting diode display pixels. Each display pixel may have a light-emitting diode that emits light under control of a drive transistor. Each display pixel may also have control transistors for compensating and programming operations. The array of display pixels may have rows and columns. Row lines may be used to apply row control signals to rows of the display pixels. Column lines (data lines) may be used to apply display data and other signals to respective columns of display pixels. A bottom conductive shielding structure may be formed below each drive transistor. The bottom conductive shielding structure may serve to shield the drive transistor from any electric field generated from the adjacent row and column lines. The bottom conductive shielding structure may be electrically floating or coupled to a power supply line.

In a semiconductor device including a transistor, the transistor is provided over a first insulating film, and the transistor includes an oxide semiconductor film over the first insulating film, a gate insulating film over the oxide semiconductor film, a gate electrode over the gate insulating film, a second insulating film over the oxide semiconductor film and the gate electrode, and a source and a drain electrodes electrically connected to the oxide semiconductor film. The first insulating film includes oxygen. The second insulating film includes hydrogen. The oxide semiconductor film includes a first region in contact with the gate insulating film and a second region in contact with the second insulating film. The first insulating film includes a third region overlapping with the first region and a fourth region overlapping with the second region. The impurity element concentration of the fourth region is higher than that of the third region.

According to one embodiment, a semiconductor device includes an insulating substrate, a first semiconductor layer formed of silicon and positioned above the insulating substrate, a second semiconductor layer formed of a metal oxide and positioned above the first semiconductor layer, a first insulating film formed of a silicon nitride and positioned between the first semiconductor layer and the second semiconductor layer, and a block layer positioned between the first semiconductor film and the second semiconductor layer, the block layer hydrogen diffusion of which is lower than that of the first insulating film.

Embodiments of the present disclosure generally relate to methods for forming a TFT having a metal oxide layer. The method may include forming a metal oxide layer and treating the metal oxide layer with a fluorine containing gas or plasma. The fluorine treatment of the metal oxide layer helps fill the oxygen vacancies in the metal oxide channel layer, leading to a more stable TFT and preventing a negative threshold voltage in the TFT.

A method for manufacturing a thin-film transistor includes: forming a first metal layer of a pattern including a gate on a substrate through pattern formation operations; forming a gate insulation layer on the substrate and the first metal layer and forming an oxide semiconductor layer, of which an orthogonal projection is cast on the gate, on the gate insulation layer within a thin-film transistor area and an etch stop layer on the oxide semiconductor layer, in which two etching operations are applied to the patternized oxide semiconductor layer and etch stop layer; forming a patternized second metal layer on the thin-film transistor area and an exposed portion of the gate insulation layer, forming a patternized insulation protection layer on the substrate and the patternized second metal layer, and forming a patternized pixel electrode on the insulation protection layer.

The manufacturing method of the thin film transistor includes the following steps. A gate, a first insulating layer, a second insulating layer, a metal oxide semiconductor layer, a first etching stop layer, a second etching stop layer and a photoresist structure are sequentially formed. The second etching stop layer, the first etching stop layer, and the metal oxide semiconductor layer are patterned using the photoresist structure as a mask to form a pre-second etching stop pattern, a pre-first etching stop pattern, and a metal oxide semiconductor pattern. The pre-second etching stop pattern and the pre-first etching stop pattern are patterned using the remaining thick portion of the photoresist structure as a mask to form a second etching stop pattern and a first etching stop pattern, and a portion of the second insulating layer is removed to form an insulating pattern. A source and a drain are formed.

The invention relates to a Radio Frequency System and method. A Radio Frequency (RF) system comprising a RF switch comprising a plurality of transistor switching elements implemented on Silicon on Insulator (SOI) for switching at least one or more RF signals and said SOI comprises a bulk substrate region and a buried oxide region. At least one filter is adapted to isolate the RF signal from the substrate and/or other high frequency signals or control signals present in the RF system. There is also provided a coupling capacitor adapted to cooperate with the filter to improve linearity of the transistor switch elements.

According to one embodiment, a thin-film transistor includes a first insulating film, an oxide semiconductor layer provided on the first insulating film and a second insulating film provided on the oxide semiconductor layer, and at least one of the first insulating film and the second insulating film includes a first region in contact with the oxide semiconductor layer and a second region further distant from the oxide semiconductor layer than the first region, and the second region has an argon concentration higher than that of the first region.

A method of manufacturing a pixel structure is provided. A gate and a gate insulating layer are formed on a substrate. A channel layer is formed on the gate insulating layer, and the material of the channel layer includes a first metal oxide semiconductor material. A source and a drain are formed on opposite sides of the channel layer. An insulating layer has an opening exposing the drain. First and second transparent electrode material layers are formed on the substrate sequentially, the material of the first transparent electrode material layer includes a second metal oxide semiconductor material, and the material of the second transparent electrode material layer includes a metal oxide conductive material. The first and second transparent electrode material layers are patterned using the same mask to form first and second transparent electrode layers, wherein the first transparent electrode layer is in contact with the drain through the opening.