A back side illumination (BSI) image sensor with stacked grid shifting is provided. A pixel sensor is arranged within a semiconductor substrate. A metallic grid segment is arranged over the pixel sensor and has a metallic grid opening therein. A center of the metallic grid opening is laterally shifted from a center of the pixel sensor. A dielectric grid segment is arranged over the metallic grid and has a dielectric grid opening therein. A center of the dielectric grid opening is laterally shifted from the center of the pixel sensor. A method for manufacturing the BSI image sensor is also provided.

A method of controlling pixels (134) of at least one spatial light modulator (114) is disclosed. The spatial light modulator (114) has a matrix of pixels (132). Each pixel (134) is individually controllable. The method comprises the following steps: receiving at least one image (331), (342); defining at least one image segment (333) within the image (331),(344); assigning at least one gray scale value to each image segment (333),(348); assigning at least one pixel (134) of the matrix of pixels (132) to each image segment (333),(350); assigning a unique modulation frequency to each gray scale value assigned to the at least one image segment (333),(352); controlling the at least one pixel (134) of the matrix of pixels (132) assigned to the at least one image segment (333) with the unique modulation frequency assigned to the respective image segment (333),(354).

A solid-state imaging device includes a first chip including a plurality of pixels, each pixel including a light sensing unit generating a signal charge responsive to an amount of received light, and a plurality of MOS transistors reading the signal charge generated by the light sensing unit and outputting the read signal charge as a pixel signal, a second chip including a plurality of pixel drive circuits supplying desired drive pulses to pixels, the second chip being laminated beneath the first chip in a manner such that the pixel drive circuits are arranged beneath the pixels formed in the first chip to drive the pixels, and a connection unit for electrically connecting the pixels to the pixel drive circuits arranged beneath the pixels.

In one embodiment of the invention, an apparatus is disclosed including an image sensor, a color filter array, and an image processor. The image sensor has an active area with a matrix of camera pixels. The color filter array is in optical alignment over the matrix of the camera pixels. The color filter array assigns alternating single colors to each camera pixel. The image processor receives the camera pixels and includes a correlation detector to detect spatial correlation of color information between pairs of colors in the pixel data captured by the camera pixels. The correlation detector further controls demosaicing of the camera pixels into full color pixels with improved resolution. The apparatus may further include demosaicing logic to demosaic the camera pixels into the full color pixels with improved resolution in response to the spatial correlation of the color information between pairs of colors.

A solid-state imaging device includes a photodetecting section, a vertical shift register section, first row selection lines, and second row selection lines. The vertical shift register section provides the row selection lines of the m-th row with common row selection signals.

Various embodiments of the present technology may comprise a method and apparatus for a pixel array. Each pixel may include multiple storage regions capable of storing pixel signals during integration. The method and apparatus may utilize the floating diffusion region as a storage region during both an integration period and readout period. The method and apparatus may store pixel signals corresponding to a first exposure periods in the floating diffusion region and pixel signals corresponding to a second exposure periods in a separate storage region.

An image acquiring device, according to one embodiment, comprises: an optical image stabilization unit which compensates for hand trembling; and optical unit which is controlled in accordance with the result value compensated in the optical image stabilization unit; an image sensor unit which converts optical information output from the optical unit into an electric signal; and image information processing unit which image processes the electric signal in accordance with the compensated result value; and an image information output unit which displays the image-processed result, wherein the image sensor unit comprises a plurality of phase difference detection pixels, and a plurality of image detection pixels disposed in a grid pattern along with the plurality of phase difference detection pixels, and the plurality of phase difference detection pixels comprise a first pixel group having a certain area shielded, the certain area being among an area separated by being partitioned in the vertical direction, and a second pixel group having a certain area shielded, the certain area being among an area separated by being partitioned in the horizontal direction, and thus the accuracy of focus may be increased by using a phase difference detection auto focus (AF) method even when an optical image stabilizer (OIS) is being driven.

An image pickup apparatus according to the present invention includes a plurality of pixels arranged in rows and columns, and each of the pixels includes a photoelectric conversion unit that accumulates signal charge generated by photoelectric conversion of irradiated light, a first holding unit and a second holding unit that hold the signal charge transferred from the photoelectric conversion unit, and an output unit that outputs, to a column signal line, a signal based on an amount of the signal charge held by the first holding unit or the second holding unit. The first holding unit and the second holding unit alternately hold the signal charge generated in the photoelectric conversion unit for each frame period, and in a period in which the signal charge is not transferred from the photoelectric conversion unit, the first holding unit and the second holding unit output the signal charge to the output unit.

Provided are an electronic component mounting package and an electronic device capable of making heat distribution of a curved electronic component mounting portion uniform. The electronic component mounting package (1) includes: a substrate (2) including a first main surface and a second main surface, and one of a recessed portion (2d) and a convex portion (2e) that is arc-shaped in a vertical cross-sectional view and that is provided in the first main surface; and a curved electronic component mounting portion (11), which is provided in the one of the recessed portion (2d) and the convex portion (2e) and on which the bent curved electronic component (10) is mounted. The substrate (2) has a notch (4) in the second main surface such that the notch (4) overlaps with the curved electronic component mounting portion (11) when the substrate (2) is viewed in a plane perspective from the first main surface side.

Respective first signal holding units of a plurality of sets are commonly connected to an input node of an amplification unit of one set via a second transfer unit of a set to which the first signal holding unit corresponds, and respective second signal holding units of the plurality of sets are commonly connected to the input node of the amplification unit of one set via a fourth transfer unit of a set to which the second signal holding unit corresponds.