An ultrasonic sensing device includes a housing, a piezoelectric assembly, a board and a plurality of fixing members. The housing includes a bottom wall, a top wall and a surrounding side wall connected between the top wall and the bottom wall. The piezoelectric assembly includes an encapsulating body and a piezoelectric sheet, wherein at least a portion of the piezoelectric sheet is enclosed by the encapsulating body and has a sensing surface exposed to the encapsulating body and facing the bottom wall. The board is disposed on the top wall of the housing and has a pressing surface facing the encapsulating body and the top wall. The plurality of fixing members is configured to fix the board to the top wall of the housing to press the board to the encapsulating body of the piezoelectric assembly, thereby pressing the sensing surface of the piezoelectric sheet to the bottom wall.

A substrate having a recessed portion, a diaphragm, and a piezoelectric actuator are provided, the diaphragm includes a first layer containing silicon as a constituent element, and a third layer disposed between the first layer and the piezoelectric actuator and containing zirconium as a constituent element, and a laminated side surface of the first layer and the third layer is covered with a moisture-resistant protective film containing at least one selected from the group made of oxide, nitride, metal, and diamond-like carbon.

A plurality of conductive via connections are fabricated on a substrate located at positions where MTJ devices are to be fabricated, wherein a width of each of the conductive via connections is smaller than or equivalent to a width of the MTJ devices. The conductive via connections are surrounded with a dielectric layer having a height sufficient to ensure that at the end of a main MTJ etch, an etch front remains in the dielectric layer surrounding the conductive via connections. Thereafter, a MTJ film stack is deposited on the plurality of conductive via connections surrounded by the dielectric layer. The MTJ film stack is etched using an ion beam etch process (IBE), etching through the MTJ film stack and into the dielectric layer surrounding the conductive via connections to form the MTJ devices wherein by etching into the dielectric layer, re-deposition on sidewalls of the MTJ devices is insulating.

A current introduction terminal includes a board made of resin. The board has a first face and a second face opposite each other. The board hermetically separates environments of different air pressures from each other. A plurality of through via holes corresponding both to a plurality of metal terminals of a first surface-mount connector to be mounted on the first face and to a plurality of metal terminals of a second surface-mount connector to be mounted on the second face are formed to penetrate between the first and second faces, and then hole parts of the through via holes are filled with resin.

A piezoelectric actuator 10 includes: a piezoelectric element 11; an external electrode 12 covering partially a first surface 11a of the piezoelectric element 11 in a first direction; a wiring member 14; and a conductive joining member 20 joining the wiring member 14 to the external electrode 12, wherein the conductive joining member 20 has an air gap 70 formed between the external electrode 12 and the wiring member 14 in a region overlapping with the wiring member 14 as viewed in the first direction, and wherein the conductive joining member 20 extends to an edge 21 of the external electrode 12 or extends to the first surface 11a of the piezoelectric element 11 beyond the edge 21 of the external electrode 12.

Provided is a fluid viscosity measuring device including a support structure having an opening part, the opening part penetrating the support structure in a first direction, a driving resonator fixed to the support structure and extending to overlap the opening part, and a detection resonator fixed to the support structure and extending parallel to the driving resonator, the detection resonator being spaced apart from the driving resonator in the first direction. The driving resonator includes a first piezoelectric body. The detection resonator includes a second piezoelectric body. The first piezoelectric body and the second piezoelectric body have the same shape.

A piezoelectric transducer device includes a support, a piezoelectric element, a first connecting element and a second electrical connecting element, the piezoelectric element being carried by the support and each of the first and second electrical connecting elements being electrically connected, respectively, to a first area and a second area, distinct from the first area, of the piezoelectric element, the piezoelectric element including a lower face opposite the support and an upper face, opposite to the lower face, wherein the upper face is integrally exposed or is covered, partially or not, only with the second electrical connecting element.

A structure for packaging a crystal oscillator includes a package base, at least one glue, a resonant crystal blank, and a top cover. The top of the package base has a recess. The glue is formed in the recess. The resonant crystal blank has at least one opening, at least one border area, at least one connection area, and a resonant area. The opening is arranged between the border area and the resonant area. The border area is connected to the resonant area through the connection area. The border area is formed in the recess through the glue. The top cover is formed on the top of the package base. The top cover closes the recess, the at least one glue, and the resonant crystal blank.

An apparatus includes a vibration member and a first cover disposed at a rear surface of the vibration member. The apparatus also includes a first vibration apparatus disposed at a rear surface of the first cover and configured to vibrate the vibration member. The apparatus includes a first enclosure member disposed at the rear surface of the first cover and at the rear surface of the vibration member. The apparatus also includes a first rear vibration member disposed at the first enclosure member.

A detection apparatus used for detecting an object includes a first platform, a second platform and a plurality of screws. The first platform includes a plurality of first circuit boards that are joggle jointed and combined with each other, at least part of the first circuit boards are electrically connected to each other, and a carrying table for carrying the object to be detected is disposed on the first platform. The second platform includes at least one second circuit board, a detection module being disposed on the second platform for detecting the object, and the detection module is electrically connected to at least a part of the second circuit board. The screws are connected between the first platform and the second platform. The detection apparatus is mainly made by joggle jointing the circuit boards, so that the manufacturing is easy, costs are low, and the detection apparatus is easy to assemble, has small volume and light weight, and is convenient to carry.