A piezoelectric adjustment apparatus has a piezo element whose movement is transmitted via a lever to a plunger. The plunger can be set against an abutment that is arranged at one side of the lever and a second abutment is provided at the other side of the lever.

In a method for printing a three dimensional structure, a continuous length of fiber that includes, interior to a surface of the fiber, a plurality of different materials arranged as an in-fiber functional domain, with at least two electrical conductors disposed in the functional domain in electrical contact with at least one functional domain material, is dispensed through a single heated nozzle. After sections of the length of fiber are dispensed from the heated nozzle, the sections are fused together in an arrangement of a three dimensional structure. The structure can thereby include a continuous length of fiber of least three different materials arranged as an in-fiber functional device, with the continuous length of fiber disposed as a plurality of fiber sections that are each in a state of material fusion with another fiber section in a spatial arrangement of the structure.

A method of fabricating an ultrasonic medical device is presented. The method includes machining a surgical tool from a flat metal stock, contacting a face of a first transducer with a first face of the surgical tool, and contacting a face of a second transducer with an opposing face of the surgical tool opposite the first transducer. The first and second transducers are configured to operate in a D31 mode with respect to the longitudinal portion of the surgical tool. Upon activation, the first transducer and the second transducer are configured to induce a standing wave in the surgical tool and the induced standing wave comprises a node at a node location in the surgical tool and an antinode at an antinode location in the surgical tool.

A method and structure for a transfer process for an acoustic resonator device. In an example, a bulk acoustic wave resonator (BAWR) with an air reflection cavity is formed. A piezoelectric thin film is grown on a crystalline substrate. One or more patterned electrodes are deposited on the surface of the piezoelectric film. An etched sacrificial layer is deposited over the one or more electrodes and a planarized support layer is deposited over the sacrificial layer. The support layer is etched to form one or more cavities overlying the electrodes to expose the sacrificial layer. The sacrificial layer is etched to release the cavities around the electrodes. Then, a cap layer is fusion bonded to the support layer to enclose the electrodes in the support layer cavities.

The present invention provides a switch which allows a communication module to be made waterproof while maintaining a switch function. A wireless switch device which functions as a rocker switch includes a cover member and an elastic waterproof member both of which seal an opening of a casing member in a state in which a wireless switch module is housed in the casing member. The wireless switch device further includes a seesaw-shaped member which is arranged on an outer side of the cover member and the waterproof member which outer side is opposite to a side on which the wireless switch module is sealed with the cover member and the waterproof member.

A crystal blank includes a vibrating arm which extends in a direction intersecting the polarization direction. In at least one of the upper surface and lower surface which are parallel to the direction of extension of the vibrating arm and run along polarization direction, the vibrating arm is provided with two recesses (grooves) in the width direction of the surface thereby having a pair of outer walls which are positioned on the two sides of the two recesses and a middle wall which is positioned between the two recesses. In the middle wall, the apex part is located at a position lower than the apex part of each of the pair of outer walls and is thinner than each of the pair of outer walls at the same heights.

A piezoelectric actuator is provided which acts as a micromechanical actuating element. Thus, the piezoelectric actuator has a piezoelectric element and an electrode structure, wherein said electrode structure is arranged with the electrodes thereof exclusively on one side of the piezoelectric element. Furthermore, the piezoelectric actuator has at least one attachment element, wherein the attachment element is fitted on the piezoelectric element and on the side of the electrode structure of the piezoelectric element, and the attachment element at least partially encompasses the electrode structure of the piezoelectric actuator. The attachment element in the process, by virtue of encompassing the electrode structure, provides a physical limit for the expansion of the piezoelectric element.

A circuit module includes a mounting substrate including a conductor wiring, an elastic wave element provided in or on a main surface of the mounting substrate, an electric element provided in or on the main surface, the electric element being different from the elastic wave element, and an insulating resin portion provided in or on the main surface to cover the elastic wave element and the electric element. The elastic wave element and the electric element are connected to each other by the conductor wiring. A height of the elastic wave element is about 0.28 mm or less, which is less than that of the electric element. The thickness of the resin portion in a region in which the resin portion covers the elastic wave element is greater than the thickness of the resin portion in a region in which the resin portion covers the electric element.

There is provided an ultrasound probe capable of efficiently discharging heat generated in a plurality of piezoelectric elements to the outside. A heat collecting portion that includes at least one heat conducting path and is formed of a material having a higher thermal conductivity than a backing member collects heat from a plurality of piezoelectric elements, and a heat exhausting portion connected to the heat collecting portion discharges the heat collected in the heat collecting portion to the outside. The heat conducting path extends in a thickness direction within the backing member and has a distal end exposed from the top surface of the backing member facing the bottom surface of each of the plurality of piezoelectric elements.

An elastic wave device is configured such that a first surface acoustic wave chip including a piezoelectric substrate is mounted on a package board, a center of the first surface acoustic wave chip is shifted from a center of the package board when viewed from above, and a crystal Z-axis orientation of the piezoelectric substrate of the first surface acoustic wave chip is slanted to extend toward an outer side portion from a central portion of the package board as it progresses toward an upper surface from a lower surface of the piezoelectric substrate.