An array of piezoelectric micromachined ultrasonic transducers (PMUTs) includes a first piezoelectric layer and a second piezoelectric layer, a dielectric layer positioned between the first piezoelectric layer and the second piezoelectric layer, and a plurality of conductive layers positioned on opposing surfaces of the first piezoelectric layer and opposing surfaces of the second piezoelectric layer. A plurality of isolation trenches extend through the dielectric layer and at least a portion of conductive layers of the plurality of conductive layers, where the plurality of isolation trenches are positioned between neighboring PMUTs of the array of PMUTs such that the neighboring PMUTs are electrically isolated, and wherein the plurality of isolation trenches relieve stress in the dielectric layer.

A method for manufacturing an electronic component is provided where resin adhesive rarely spreads before curing. The method includes providing a first sealing member and forming a frame-shaped glass layer on a principal surface of the first sealing member. Moreover, the first sealing member is cut into multiple first sealing members and second sealing members are bonded with resin adhesive to inner frame regions on the principal surface of the first sealing member defined by the glass layer.

An electronic component has a main body. The main body includes a porous material having surface pores at a surface of the main body. A passivation liquid is arranged in the surface pores. A method of forming an electronic component is also disclosed as is a method of passivating a body.

A method for the quality inspection of an ultrasonic transducer and an ultrasonic sensor comprising an ultrasonic transducer and carrying out the quality inspection method are described. The ultrasonic transducer comprises a housing having an electrically conductive layer extending at least over an inner surface of a housing wall of the housing, and a piezoelectric transducer arranged in the housing, the end face of which equipped with an electrode is connected to the electrically conductive layer by means of a dielectric coupling layer. According to the method, at least one quality inspection of the ultrasonic transducer is carried out, in which a capacitance of a capacitor comprising the electrode, the electrically conductive layer serving as the counter electrode, and the dielectric coupling layer as a dielectric is measured and a quality defect of the ultrasonic transducer is determined if the measured capacitance is outside a specified capacitance range.

A backing includes a plurality of backing plates that are laminated. Each backing plate includes a lead row and a backing material. Each lead includes a lead wire and an insulating coating. The insulating coating is integrated with the backing material, and an adhesive layer between them does not exist. Short-circuit between the leads may be prevented or reduced by the insulating coating. The backing plate is manufactured by a screen printing method.

An ultrasonic element includes an element substrate including a first surface, a second surface having a front-back relation with the first surface, an opening section piercing through the element substrate from the first surface to the second surface, and a partition wall section surrounding the opening section, a supporting film provided on the first surface of the element substrate to cover the opening section and including a third surface facing the opening section and a fourth surface having a front-back relation with the third surface, a piezoelectric element provided on the fourth surface of the supporting film and disposed in a region overlapping the opening section of the supporting film in a plan view from a film thickness direction extending from the third surface to the fourth surface, a sealing plate provided to be opposed to the fourth surface of the supporting film and joined to the supporting film by an adhesive member via a beam section projecting toward the supporting film, and a wall section provided on the fourth surface of the supporting film and provided to project toward the sealing plate between the beam section and the piezoelectric element.

Chemical sensors include a functionalized electrode configured to change surface potential in the presence of an analyte. A piezoelectric element is connected to the functionalized electrode. A piezoresistive element is in contact with the piezoelectric element.

A SAW device includes a SAW element, a conductor connected to the SAW element, an LT substrate including the SAW element, and a case for housing the LT substrate including the SAW element. The case includes a cover part, a lateral part, and a bottom part. The bottom part is including a sapphire substrate, the LT substrate is positioned on a first surface of the sapphire substrate, the first surface serving as an inner surface of the case, and a second surface opposite to the first surface serves as an outer surface of the case. The conductor includes a via conductor provided in a through-hole continuously penetrating through the sapphire substrate and the LT substrate.

A piezoelectric/electrostrictive (“PE”) actuator includes a PE element including a laminated object having a PE layer and a pair of electrodes arranged respectively on both sides of the PE layer, and having an operating part corresponding to the portion in which the PE layer is sandwiched between the pair of electrodes and a non-operating part corresponding to the portion in which the PE layer is not sandwiched between the pair of electrodes, and a moisture-proof film covering at least the vicinity of a boundary between the operating part and the non-operating part, consisting of a liquid with a saturated moisture content at 25 degree Celsius of 300 ppm or less and a withstand voltage at the saturated moisture content of not less than 6 kV/mm. The liquid contains hydrocarbon system organic compound having a main backbone of carbon-carbon bond and consisting only of carbon and hydrogen.

Provided is a piezoelectric element capable of reliably performing an electrical connection to an electrode layer. A piezoelectric element includes a piezoelectric layer, electrode layers formed on both sides of the piezoelectric layer, and a protective layer laminated on a surface of the electrode layer opposite to a surface on the polymer composite piezoelectric body side. The protective layer has a hole that penetrates from the surface to the electrode layer. The piezoelectric element further includes a filling member consisting of a conductive material, which is formed from the inside of the hole to a part of a surface of the protective layer and is electrically connected to the electrode layer, a conductive member which covers at least a part of the filling member and is electrically connected to the filling member, and a fixing member for fixing the conductive member.