Disclosed are pressure sensors including a die and an application-specific integrated circuit (ASIC) mounted on a top surface of a substrate. The pressure sensor can define an inner volume and a bottom opening configured to abut the substrate. The die and ASIC are mounted on the top surface of the substrate within the inner volume. The substrate defines a first aperture therethrough and the die defines a second aperture therethrough in a direction along an axis perpendicular to the substrate, the first aperture and the second aperture being aligned. Metallic barrier(s) disposed on a bottom surface of the substrate, circumferentially about the first aperture, can be at least partially coated with solder mask to reduce or prevent flow of unwanted materials past the metallic barriers and through the first aperture. The substrate can include electrical connection pads on the bottom surface configured to be in communication with a daughter board.

Provided is an energy conversion film excellent in charge retention performance and suppressed in deterioration of piezoelectricity even if it is exposed to a high temperature environment and an energy conversion element and the like using the film. An energy conversion element comprising: an energy conversion film at least comprises a charged resin film consisting of a resin film at least containing a thermoplastic resin and a metal soap; and an electrode provided on at least one of the two surfaces of the energy conversion film.

A piezo-resistor sensor includes a diffusion of a first conductivity type in a well of an opposite second type, contacts with islands in the diffusion, interconnects with the contacts, and a shield covers the diffusion between the contacts and extends over side walls of the diffusion between the contacts. Each interconnect covers the diffusion at the corresponding contact and extends over edges of the diffusion, and each island is at a side covered by its interconnect. A guard ring of the second type is around the diffusion. The shield covers the well between the diffusion and the ring and the edge of the ring facing the diffusion. If a gap between the shield and the interconnect is present, the ring bridges this gap, and/or the edges of the diffusion are completely covered by the combination of the shield and the interconnects.

Systems and methods of providing power to high-voltage sensors in power-limited environments through environmental energy harvesting are disclosed. The systems and methods are configured to intermittently power high-voltage sensors by repeatedly releasing stored energy in bursts. An environmental energy harvesting device generates a low-voltage power supply and is coupled to one or more capacitors to charge the capacitors to a high-voltage threshold. After such high-voltage threshold has been reached, the capacitors are discharged to provide a high-voltage power burst to a high-voltage sensor configured to inspect a component and generate an inspection result signal. The inspection result signal is received by an output module, which may further store or transmit to an external receiver a data signal indicating the inspection results.

In some embodiments, a piezoelectric biosensor is provided. The piezoelectric biosensor includes a semiconductor substrate. A first electrode is disposed over the semiconductor substrate. A piezoelectric structure is disposed on the first electrode. A second electrode is disposed on the piezoelectric structure. A sensing reservoir is disposed over the piezoelectric structure and exposed to an ambient environment, where the sensing reservoir is configured to collect a fluid comprising a number of bio-entities.

The invention relates to a piezoelectric energy harvesting system (10) configured to be installed on a vehicle (1), characterized in that the system (10) comprises: —an inner panel (12); —an outer panel (14) slidably movable relative to the inner panel (12); —at least one deformable piezoelectric element (16) disposed between the inner panel (12) and the outer panel (14), said piezoelectric element (16) being capable of producing electrical power when it is deformed; —a plurality of impact elements (18) fixedly connected to the outer panel (14) and adapted to apply a compression force on the at least one piezoelectric element (16) when the outer panel (14) and the inner panel (12) are close enough to each other, said compression force causing a mechanical deformation of the at least one piezoelectric element (16); —repulsion means (22) adapted to move the outer panel (14) away from the inner panel (12); —an electrical power storage unit (24); —a one-way electrical circuit (26) connecting the at least one piezoelectric element (16) to the electrical power storage unit (24), said one-way electrical circuit (26) being adapted to charge the electrical power storage unit (24) with the electrical power produced by the at least one piezoelectric element (16) while preventing the application of an electrical charge to the at least one piezoelectric element (16) from the electrical power storage unit (24).

Piezo-optic transducers convert variations in mechanical stress to a change in optical properties by coupling electro-optic and piezo-electric elements in a format suited to a single composite device without needing on-board electronics.

In piezoelectric sensors, conventional amplification factor adjustment methods involving the cutting of a wiring pattern or use of a laser trimmable resistor are unable to adjust the amplification factor when the sensor is in a completed state. As a result, the production process becomes complex and production costs increase. Further, because the amplification factor adjustment is carried out in a different state from that of the finished product, the problem that the amplification factor is not set correctly in the finished product also occurs. A non-volatile memory is incorporated in an integrated circuit in which there are integrated piezoelectric sensor circuit elements. The amplification factor is adjusted by writing data from a writing terminal to change an amplification resistor a.

A grip detection sensor that includes: a piezoelectric film having a first main surface and a second main surface, either one of the first main surface and the second main surface being disposed at least partly on a periphery of a linearly shaped flexible object, a first electrode on the first main surface, a second electrode on the second main surface, and a spacer configured to maintain a space between the object and the piezoelectric film.

An ultrasonic device includes: a substrate provided with a first opening and a second opening; a support film that is provided on the substrate and blocks the first opening and the second opening; a transmitting piezoelectric film that is provided at a position of the support film which overlaps the first opening when viewed in a thickness direction of the substrate, and that is interposed between a pair of electrodes in the thickness direction of the substrate; and a receiving piezoelectric film that is provided at a position of the support film which overlaps the second opening when viewed in the thickness direction of the substrate, and that is interposed between a pair of electrodes in the thickness direction of the substrate. In the thickness direction of the substrate, a thickness dimension of the transmitting piezoelectric film is larger than a thickness dimension of the receiving piezoelectric film.