Provided is a portable, thermoelectrically powered device, such as a flashlight or headlamp. The device comprises at least one thermoelectric generator for extracting body heat from a user, the Thermoelectric generator located on and extending through an elongated open ended outer shell, a heat sink in contact with an inner surface of the thermoelectric generator and configured to provide an elongated first cooling channel therethrough, circuitry in electrical communication with the thermoelectric generator, the circuitry comprising a transistor oscillator, a step-up transformer and a decoupling capacitor, the circuitry in electrical communication with a power sink, such that in use, a temperature gradient across the thermoelectric generator is sufficient to result in generation of at least about 25 μW of power.

A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.

In described examples, an integrated circuit containing CMOS transistors and an embedded thermoelectric device may be formed by forming active areas which provide transistor active areas for an NMOS transistor and a PMOS transistor of the CMOS transistors and provide n-type thermoelectric elements and p-type thermoelectric elements of the embedded thermoelectric device. Stretch contacts with lateral aspect ratios greater than 4:1 are formed over the n-type thermoelectric elements and p-type thermoelectric elements to provide electrical and thermal connections through metal interconnects to a thermal node of the embedded thermoelectric device. The stretch contacts are formed by forming contact trenches in a dielectric layer, filling the contact trenches with contact metal and subsequently removing the contact metal from over the dielectric layer. The stretch contacts are formed concurrently with contacts to the NMOS and PMOS transistors.

A method of forming a thermoelectric device structure and the resultant thermoelectric device structure. The method forms a first pattern of epitaxial thermoelectric elements of a first conductivity type on a first semiconductor substrate, forms a second pattern of epitaxial thermoelectric elements of a second conductivity type on a second semiconductor substrate, separates the epitaxial thermoelectric elements of the first conductivity type and places the epitaxial thermoelectric elements of the first conductivity type and the epitaxial thermoelectric elements of the second conductivity type on a heat sink, and integrates the heat sink to a device substrate including an electronic device to be cooled.

The disclosure provides a thermoelectric conversion structure and its use in heat dissipation device. The thermoelectric conversion structure includes a thermoelectric element, a first electrode and an electrically conductive heat-blocking layer. The thermoelectric element includes a first end and a second end opposite to each other. The first electrode is located at the first end of the thermoelectric element. The electrically conductive heat-blocking layer is between the thermoelectric element and the first electrode.

A thermoelectric conversion device for cooling an object includes a thermoelectric converter and a structure. The thermoelectric converter has a cooling surface and a heat generating surface. The cooling surface is for cooling the object. The heat generating surface is on a side opposite to the cooling surface. The structure removes heat from the heat generating surface. The structure includes a heat transfer member, a pipe through which water flows, and a heat radiation member. The heat transfer member is joined to the heat generating surface. The pipe is disposed on the heat transfer member. The heat radiation member extends inside the pipe from the heat transfer member. A kitchen unit includes a thermoelectric conversion device, a main body, and a cooling plate. The cooling plate is disposed on an upper surface of the main body, and is cooled by the thermoelectric converter.

In one embodiment, a system is disclosed that includes a thermoelectric generator (TEG) layer that comprises a thermoelectric nanostructure. The system also includes a thermal conductance layer coupling the TEG layer to a catalytic converter and provides heat from an exhaust gas passing through the catalytic converter to the TEG layer. The system additionally includes a cooling layer coupled to the TEG layer opposite the thermal conductance layer that provides cooling to the TEG layer.

There is provided an energy management method, comprising steps of conducting (304) electric energy from an energy production plant (110, 112, 114, 140) to an energy storage facility (120, 220), applying, in the energy storage facility (120, 220), the received electric energy on a chemical compound (222) to separate the chemical compound to a first component (224) and a second component (226), and storing (306), in the energy storage facility (120, 220), the first component and the second component separately.

A self-powered thermal fan for circulating air for use in cooperation with a heat source, such as a wood stove, and which relies on a thermoelectric generator to provide electrical current to power a motor. The motor is used to move fan blades which create a warm air flow away for the heat source, and a cooler air flow towards the fan assembly. In the present invention, the fan assembly includes at least two thermoelectric generator modules that are separate by a gap which allows for increase module surface area, without creating a risk of module damage caused by heat expansion. The improved design also preferably includes the use of angled module mounting lands, which aid in increasing heat gradient across the module. Additionally, the present device provides the ability to have larger heat exchange surfaces that can provide increased cooling to the opposite surfaces of the thermoelectric generator module. Improved output and efficiencies of the self-powered thermal fan assembly are achieved.

A thermoelectric module according to an embodiment of the present invention may comprise: a cold sink; a thermoelectric element having a heat absorption surface coupled to the cold sink; a heat sink coupled to a heating surface of the thermoelectric element to dissipate heat transferred from the cold sink to the outside of the thermoelectric element; and a sealing cover for connecting the edge of the cold sink and the edge of the heat sink to surround the thermoelectric element, wherein the cold sink, the heat sink, and the thermoelectric element may be integrally formed by the sealing cover.

In addition, the thermoelectric element may be a cascade type thermoelectric element in which two thermoelectric elements having the same or different specifications are coupled to each other.