A display apparatus may include a display panel configured to display an image, a plate disposed on a rear surface of the display panel, a heat dissipation member disposed on a rear surface of the plate and having a first hole, and an adhesive member disposed between the plate and the heat dissipation member and having a second hole. The heat dissipation member may include a body part and a pattern part.

A display device includes a first substrate having a first surface and a plurality of LED elements mounted on the first surface of the first substrate. Each of the plurality of LED elements includes a main body portion having a second surface facing the first surface of the first substrate and a third surface on a side opposite to the second surface, an anode electrode and a cathode electrode provided on the second surface of the main body portion, and an organic film bonded to the third surface of the main body portion. The organic film has a fourth surface facing and bonded to the third surface and a fifth surface on a side opposite to the fourth surface. The fifth surface of the organic film has a plurality of depressions.

The present inventive concept relates to an RGB micro-light-emitting diode having a vertically-stacked structure with corner mesa contact structures, and a manufacturing method thereof. The RGB micro-light-emitting diode having a vertically-stacked structure with corner mesa contact structures includes an n-type contact electrode layer, a first light-emitting structure, a common electrode layer, a second light-emitting structure, a tunnel junction layer, and a third light-emitting structure, which are sequentially stacked on a substrate. The RGB micro-light-emitting diode with a reduced unit area can be easily manufactured by forming the corner mesa contact structure on each of the n-type contact electrode layers by etching the vertically-stacked structure, forming contact structures on the n-type contact electrode layers, followed by electrical connection.

An embodiment of the present disclosure provides a semiconductor device arrangement. This semiconductor device arrangement includes a substrate and a plurality of semiconductor devices. The substrate includes an upper surface. The plurality of semiconductor devices is separately and staggered located on the upper surface, and includes a first semiconductor device and a second semiconductor device. Wherein the first semiconductor device includes a first interior angle, the second semiconductor device includes a second interior angle, and there is a minimum distance between the first interior angle and the second interior angle among the plurality of semiconductor devices, wherein the minimum distance is between 3 m 25 m.

In accordance with aspects of the present technology, a unique charge carrier transfer process from c-plane InGaN to semipolar-plane InGaN formed spontaneously in nanowire heterostructures can effectively reduce the instantaneous charge carrier density in the active region, thereby leading to significantly enhanced emission efficiency in the deep red wavelength. Furthermore, the total built-in electric field can be reduced to a few kV/cm by cancelling the piezoelectric polarization with spontaneous polarization in strain-relaxed high indium composition InGaN/GaN heterostructures. An ultra-stable red emission color can be achieved in InGaN over four orders of magnitude of excitation power range. Accordingly, aspects of the present technology advantageously provide a method for addressing some of the fundamental issues in light-emitting devices and advantageously enables the design of high efficiency and high stability optoelectronic devices.

The present disclosure discloses an explosion-proof housing and an electrical device. The explosion-proof housing includes a first housing body, a second housing body, a fastener, and a limit member. The first housing body has a first mounting hole. The second housing body covers the first housing body and has a second mounting hole. The fastener passes through the first mounting hole and the second mounting hole to connect the first housing body to the second housing body. The limit member is disposed between the first mounting hole and the fastener and has a first state and a second state. In the first state, the limit member is adapted to limit a limit head of the fastener outside the first mounting hole. In the second state, at least part of the limit member is disengaged from the limit head to allow the limit head to enter into the first mounting hole.

Disclosed is a mobile terminal provided with a security function. The mobile terminal provided with the security function can include: a casing having a data input portion for inputting data, and an upper casing and a lower casing which can be assembled and disassembled; a circuit board for processing input data, which is electrically connected to the data input portion and is provided with a security unit that requires security; a tamper prevention conductive portion which is arranged between the casing and the circuit board and is electrically connected to the circuit board when the upper casing and the lower casing are assembled; and a control portion for denying access to data in the security unit based on a resistance value of the tamper prevention conductive portion. As a result, access to data in a secure region to which important data is saved is denied when the casing is forcibly opened, thereby effectively preventing important data from being leaked to the outside.

Modular network switches and other computer systems are described herein. A modular network switch can include a latching device for installing and removing computer modules (e.g., line cards) from an associated cabinet or enclosure. The network switch can also include interconnected computer modules (e.g., line cards, fabric cards, control modules, etc.) that include circuit boards oriented parallel to the flow of cooling air through the cabinet in the absence of a backplane or midplane oriented perpendicular to the air flow. The absence of such backplanes and/or midplanes provides a more direct air flow path through the cabinet, thereby enabling a more efficient flow of cooling air and lower operating temperatures. Additionally, the network switch can include an orthogonal arrangement of data planes, control planes, and/or power planes that can be efficiently interconnected to increase operational speed and further facilitate the flow of cooling air through the computer cabinet.

A master recombiner box system includes a plurality of input bus bars that receive power from a corresponding combiner box in a solar field. Each input bus bar is coupled with a current transducer, thereby measuring the current of the associated combiner box. Power feeding into the plurality of input bus bars is combined at a recombiner bus bar, which leads to an output bus bar, and ultimately to an external inverter. The current transducers are linked to a control circuit board which utilizes an antenna to send RF signals to a receiver. In this manner individual combiner boxes in a solar field can be monitored wirelessly.

A plurality of vent perforations are formed on a side face of an electronic apparatus and communicate the inside and the outside of the electronic apparatus with each other therethrough. The electronic apparatus includes a fan which sucks or discharges air through the plurality of vent perforations. A groove is formed on the side face of the electronic apparatus and extends in a forward and rearward direction. The plurality of vent holes are formed on an inner face of the groove of the side face. With the structure, the vent holes can be suppressed from being closed up when the electronic apparatus is placed vertically, and the drop of the ventilation efficiency can be suppressed.