Patent classifications
G01R31/04
Semiconductor chip and method for detecting disconnection of wire bonded to semiconductor chip
A semiconductor chip is provided with first and second electrode pads, a first current detector, and a third electrode pad. The first and second electrode pads are both to be wire-bonded to a first lead terminal. The first current detector is connected between the first and second electrode pads. The third electrode pad is wire-bonded to a second lead terminal. A first closed circuit is configured by the first lead terminal, the first electrode pad, the first current detector, and the second electrode pad. An induced current flows through the first closed circuit when a current generating an induced electromotive force is applied to the third electrode pad. The first current detector is configured to output different values depending on whether the induced current exceeds a threshold value or not.
Driving integrated circuit, display device including the same, and method of measuring bonding resistance
A driving integrated circuit bonded to a mounting area of a display panel, the circuit including a plurality of connection contact pads electrically coupled to a plurality of signal pads in the mounting area, at least one test contact pad electrically coupled to at least one test pad in the mounting area, and a resistance measuring unit configured to charge an external capacitor electrically coupled to a bonding part of the test pad and the test contact pad and to measure a bonding resistance of the bonding part based on a magnitude or a discharging time of a charging voltage of the external capacitor.
Handler apparatus, device holder, and test apparatus
Provided is a handler apparatus that conveys a device under test to a test socket, including: an actuator that, prior to fitting of a device holder to the test socket, fits the device holder, and adjusts a position of the device under test on the device holder; and a conveyer that conveys the device holder in which a position of the device under test has been adjusted, to fit the test socket, where the device holder includes: an inner unit to mount the device under test; an outer unit to retain the inner unit to be movable; and a release button to release a lock of movement of the inner unit, in response to being pressed from a side to which the device under test is mounted, and the actuator sets the inner unit to be movable by pressing the release button and adjusts a position of the inner unit.
Load connection detection
An apparatus comprises an output port to be connected to a load; a first input port to receive a first input signal; and a second input port coupled between the first input port and the output port, to receive a second input signal. The apparatus further comprises a coupling circuit to couple the second input signal to the output port and a frequency isolation circuit that has a frequency response to propagate the first input signal to the output port but prevent the second input signal from propagating to the first input port. The apparatus also comprises a detection circuit to determine a voltage of an output signal at the output port, the output signal having a first amplitude range with a load absent at the output port and having a second amplitude range lower than the first amplitude range with the load present at the output port.
Electrical margining of multi-parameter high-speed interconnect links with multi-sample probing
Methods and apparatus relating to electrical margining of multi-parameter high-speed interconnect links with multi-sample probing are described. In one embodiment, logic is provided to generate one or more parameter values, corresponding to an electrical operating margin of an interconnect. The one or more parameter values are generated based on a plurality of eye observation sets to be detected in response to operation of the interconnect in accordance with a plurality of parameter sets (e.g., by using quantitative optimization techniques). In turn, the interconnect is to be operated at the one or more parameter values if it is determined that the one or more parameter values cause the interconnect to operate at an optimum level relative to an operation of the interconnect in accordance with one or more less optimum parameter levels. Other embodiments are also disclosed and claimed.
Device and procedure for the monitoring of a trailer connection box
A device for the monitoring of a trailer connection box of a vehicle to which the electrical system of a trailer can be connected. The device may include a circuit having a first connection (VBB) for the connection with a positive potential of a voltage of an electric system of the vehicle. The device may include second connections (Brkl, POSLL, POS LR, TurnSL, TurnSR, RevL, FogL) for the connection with contacts of the trailer connection box. The device may include a current and/or voltage sensor (SI), with first controllable switches (S11, . . . , S17), being connected in series to one of the second connections (Brkl, POSLL, POS LR, TurnSL, TurnSR, RevL, FogL) each. In a closed state of the first switch (S11, . . . , S17) is connected in series to the second connection (Brkl, POSLL, POS LR, TurnSL, TurnSR, RevL, FogL), each of the second connections (Brkl, POSLL, POS LR, TurnSL, TurnSR, RevL, FogL) is connected via this first switch (S11, . . . , S17) with a first node (K). The first node (K) is connected to the first connection (VBB) via the current and/or voltage sensor (SI).
Testing apparatus for testing electrical circuit board having electrical connectors thereon
A testing apparatus for testing a circuit board is disclosed, which includes an upper plate, a lower plate, and an adaptor circuit board. A plurality of positioning units is received in the lower plate. Each positioning unit has a plurality of length-variable test probes secured therein. Each test probe has a shell and upper and lower probe ends at opposite ends of the shell. In test, the circuit board is put on the lower plate and the upper plate is lowered to push the circuit board and the lower plate toward the adaptor circuit board. The upper ends of the test probes engage with electrical connectors of the circuit board and the lower ends thereof engage with the adaptor circuit board whereby test of the circuit board can be automatically performed by the testing apparatus.
METHOD AND DEVICE FOR TESTING THE CONNECTIONS OF BATTERIES
For testing the connections (13) of batteries (8) that are connected in a battery module (5) to several bus bars (6, 7) that are electrically in parallel with their battery electrodes (10, 11) by a resistance measurer (16) comprising a pair of contact pins (17, 18), during a measurement a first batten′ electrode (10) is contacted by a first contact pin (17) and a point on the conductor arrangement (13, 6, 13, 10) connected to the first battery electrode (10) is contacted by the second contact pin.
TYPE-C FACTORY AND SPECIAL OPERATING MODE SUPPORT
Systems, methods, and apparatus for testing devices adapted for connection to other devices using universal serial bus (USB) are disclosed. Devices to be tested are caused to enter a special mode of operation when a resistance measured across two terminals of a USB Type-C connector has a value associated with the special mode of operation. One or more operations of the device are automatically initiated when the resistance between the two terminals has a measured value that matches one of a set of resistance values maintained by the device. The one or more operations may include configuring a power management circuit based on the measured value, and entering a special or factory boot mode that controls startup of at least one processor on the device based on the measured value. Each of the set of resistance values exceeds a minimum open-circuit resistance value specified for the connector.
METHOD AND APARATUS FOR MONITORING A JUNCTION BETWEEN ELECTRICAL DEVICES
A method and a test fixture for evaluating a junction between an electrical lead trace and a busbar are described, and include an electric power supply disposed to supply electric power to the electrical lead trace and an electric monitoring device disposed to monitor electrical potential across the junction. A mechanical stress-inducing device is disposed to apply mechanical stress proximal to the junction. The electric monitoring device monitors the electrical potential across the junction of the electrical lead trace coincident with the mechanical stress-inducing device applying mechanical stress proximal to the junction when the electric power supply is supplying electric power to the electrical lead trace. Electrical integrity of the junction is evaluated based upon the monitored electrical potential across the junction.