H10F10/166

SOLAR CELL MODULE

A solar cell module includes: a plurality of solar cells; a front surface encapsulant member which is disposed on a front surface side of the plurality of solar cells and includes a first polyolefin-based material; a back surface encapsulant member which is disposed on a back surface side of the plurality of solar cells and includes a second polyolefin-based material; an intermediate member which is disposed between the front surface encapsulant member and the back surface encapsulant member and includes a polymer material having either one of a higher polarity and a higher water absorbability than the first polyolefin-based material and the second polyolefin-based material; and a front surface protective member and a back surface protective member disposed to place the plurality of solar cells, the front surface encapsulant member, and the back surface encapsulant member between the front surface protective member and the back surface protective member.

Solar cell having doped semiconductor heterojunction contacts
09608131 · 2017-03-28 · ·

A silicon solar cell has doped amorphous silicon contacts formed on a tunnel silicon oxide layer on a surface of a silicon substrate. High temperature processing is unnecessary in fabricating the solar cell.

SOLAR CELL AND METHOD FOR MANUFACTURING THE SAME

A solar cell is discussed. The solar cell includes a silicon substrate; a front passivation layer positioned on a front surface of the silicon substrate; an n-doped layer positioned on the front surface of the silicon substrate; an anti-reflection layer positioned on the n-doped layer; a p-doped region positioned on a rear surface of the silicon substrate; an n-doped region positioned on the rear surface of the silicon substrate and spaced apart from the p-doped region; a rear passivation layer positioned on the rear surface of the silicon substrate, the rear passivation layer including: a first portion positioned between the p-doped region and the silicon substrate; a second portion positioned between the n-doped region and the silicon substrate, the second portion being space apart from the first potion; and a third portion disposed between the first portion and the second portion; a first electrode directly contacted to the p-doped region; and a second electrode directly contacted to the n-doped region.

HIGH EFFICIENCY CONFIGURATION FOR SOLAR CELL STRING

A high efficiency configuration for a string of solar cells comprises series-connected solar cells arranged in an overlapping shingle pattern. Front and back surface metallization patterns may provide further increases in efficiency.

CRYSTALLINE SILICON-BASED SOLAR CELL, CRYSTALLINE-SILICON SOLAR CELL MODULE, AND MANUFACTURING METHODS THEREFOR
20170084772 · 2017-03-23 ·

The crystalline silicon-based solar cell according to the present invention includes a first intrinsic silicon-based thin-film, a p-type silicon-based thin-film, a first transparent electrode layer, and a patterned collecting electrode on a first principal surface of an n-type crystalline silicon substrate; and a second intrinsic silicon-based thin-film, an n-type silicon-based thin-film, a second transparent electrode layer, and a plated metal electrode on a second principal surface of the n-type crystalline-silicon substrate. On a peripheral edge of the first principal surface, an insulating region freed of a short-circuit between the first transparent electrode layer and the second transparent electrode layer is provided. The plated metal electrode is formed on an entire region of the second transparent electrode layer.

ANTI-CORROSION PROTECTION OF PHOTOVOLTAIC STRUCTURES
20170077320 · 2017-03-16 · ·

One embodiment can provide a photovoltaic structure. The photovoltaic structure can include a multilayer structure, which can include a base layer, a surface-field layer positioned on a first side of the base layer, and an emitter layer positioned on a second side of the base layer. The photovoltaic structure can further include a first metallic grid positioned on a first surface of the multilayer structure and a first organic coating covering at least sidewalls of the first metallic grid.

SHINGLED SOLAR CELL MODULE

A high efficiency configuration for a solar cell module comprises solar cells conductively bonded to each other in a shingled manner to form super cells, which may be arranged to efficiently use the area of the solar module, reduce series resistance, and increase module efficiency. The front surface metallization patterns on the solar cells may be configured to enable single step stencil printing, which is facilitated by the overlapping configuration of the solar cells in the super cells. A solar photovoltaic system may comprise two or more such high voltage solar cell modules electrically connected in parallel with each other and to an inverter. Solar cell cleaving tools and solar cell cleaving methods apply a vacuum between bottom surfaces of a solar cell wafer and a curved supporting surface to flex the solar cell wafer against the curved supporting surface and thereby cleave the solar cell wafer along one or more previously prepared scribe lines to provide a plurality of solar cells. An advantage of these cleaving tools and cleaving methods is that they need not require physical contact with the upper surfaces of the solar cell wafer. Solar cells are manufactured with reduced carrier recombination losses at edges of the solar cell, e.g., without cleaved edges that promote carrier recombination. The solar cells may have narrow rectangular geometries and may be advantageously employed in shingled (overlapping) arrangements to form super cells.

SOLAR CELL AND PHOTOVOLTAIC MODULE

Provided is a solar cell including: a silicon substrate, a passivation layer, a first antireflection layer, a second antireflection layer, a third antireflection layer, a tunneling dielectric layer formed over the rear surface, and a doped conductive layer formed over the tunneling dielectric layer. The silicon substrate includes at least one of P, Bi, Sb or As. The passivation layer includes an Al.sub.xO.sub.y material and is formed over the front surface, where 1/3x/y3. The first antireflection layer includes a S.sub.iN.sub.j material and is formed over the passivation layer, where 0.5i/j10. The second antireflection layer includes a SicN.sub.dO.sub.e material and is formed over the first antireflection layer, where 0.5c/d10, and 0.25d/e2. The third antireflection layer includes a Si.sub.aO.sub.b material and is formed over the second antireflection layer, where 0.5a/b3.

SOLAR CELL, SLICED CELL AND MANUFACTURING METHOD THEREOF, PHOTOVOLTAIC MODULE, AND PHOTOVOLTAIC SYSTEM
20250107271 · 2025-03-27 · ·

The present disclosure relates to a solar cell, a sliced cell and a manufacturing method thereof, a photovoltaic module, and a photovoltaic system. The solar cell includes a substrate, a doped conductive layer, a first passivation film layer, and a first dielectric layer; the doped conductive layer being arranged on a first surface of the substrate; the first passivation film layer and the first dielectric layer being sequentially stacked on a side of the doped conductive layer facing away from the substrate; and the doped conductive layer, the first passivation film layer, and the first dielectric layer all covering the first surface of the substrate; wherein the substrate further includes a plurality of first side surfaces adjacent to the first surface, and the first passivation film layer further covers at least part of surfaces of the plurality of first side surfaces. The solar cell, the photovoltaic module, and the photovoltaic system in the present disclosure can reduce recombination losses at side edges of the solar cell and improve efficiency.

SOLAR CELL, METHOD FOR PREPARING SAME AND ELECTRICAL DEVICE

A solar cell, a method for preparing the same and an electrical device are provided. The method for preparing the solar cell includes following steps: providing a substrate, which includes a first surface and a second surface opposite to the first surface; forming a protective material layer on the first surface, and removing part of the protective material layer on a preset first doped region to prepare a protective layer; performing a first doping process in the preset first doped region on the substrate to prepare a substrate including a first doped region. A width of the first doped region is in a range of 10 m to 35 m.