A capacitor structure comprises a first conductive region having a first conductivity type and a second conductive region having a second conductivity type different than the first conductivity type. The first conductive region comprises a first protrusion portion and a second protrusion portion. The second conductive region comprises a protrusion portion. The capacitor structure further comprises a first dielectric overlying the first protrusion portion of the first conductive region, and a first conductor overlying the first dielectric. Additionally, the capacitor structure comprises a terminal of a diode overlying the second protrusion portion of the first conductive region and the protrusion portion of the second conductive region. The terminal of the diode comprises a second conductor isolated from the first conductor.

A bidirectional transient voltage suppressor (TVS) protection circuit includes two sets of steering diodes with a clamp device merged with a steering diode in each set. In one embodiment, the protection circuit includes a first high-side diode integrated with a first silicon controlled rectifier (SCR), a first low-side diode, a second high-side diode integrated with a second SCR, and a second low-side diode. In another embodiment, the protection circuit includes a first high-side diode, a first low-side diode integrated with a first SCR, a second high-side diode, and a second low-side diode integrated with a second SCR. In some embodiments, the TVS protection circuit realizes low capacitance at the protected nodes by fully or almost completely depleting the P-N junction connected to the protected nodes in the operating voltage range.

A bidirectional transient voltage suppressor (TVS) protection circuit includes two sets of steering diodes with a clamp device merged with a steering diode in each set. In one embodiment, the protection circuit includes a first high-side diode integrated with a first silicon controlled rectifier (SCR), a first low-side diode, a second high-side diode integrated with a second SCR, and a second low-side diode. In another embodiment, the protection circuit includes a first high-side diode, a first low-side diode integrated with a first SCR, a second high-side diode, and a second low-side diode integrated with a second SCR. In some embodiments, the TVS protection circuit realizes low capacitance at the protected nodes by fully or almost completely depleting the P-N junction connected to the protected nodes in the operating voltage range.

A semiconductor device according to some implementations includes a main transistor, a peripheral circuit element connected to one end of the main transistor, and a Zener diode connected between the other end of the main transistor and the peripheral circuit element. The main transistor includes a main channel layer, a barrier layer disposed on the main channel layer, a main gate electrode disposed on the barrier layer, a gate semiconductor layer disposed between the barrier layer and the gate electrode, and a main source electrode and a main drain electrode connected to the main channel layer. The peripheral circuit element includes a sub-channel layer connected to the main drain electrode and including a drift region with a two-dimensional electron gas, and a detection electrode disposed on the sub-channel layer, and the Zener diode is electrically connected between the detection electrode and the main source electrode.

A semiconductor device according to some implementations includes a main transistor, a peripheral circuit element connected to one end of the main transistor, and a Zener diode connected between the other end of the main transistor and the peripheral circuit element. The main transistor includes a main channel layer, a barrier layer disposed on the main channel layer, a main gate electrode disposed on the barrier layer, a gate semiconductor layer disposed between the barrier layer and the gate electrode, and a main source electrode and a main drain electrode connected to the main channel layer. The peripheral circuit element includes a sub-channel layer connected to the main drain electrode and including a drift region with a two-dimensional electron gas, and a detection electrode disposed on the sub-channel layer, and the Zener diode is electrically connected between the detection electrode and the main source electrode.

A semiconductor device includes a substrate layer having a floating base region of a first conductivity type. A first well of a second conductivity type and the floating base region form a first pn junction. A first conductive structure is electrically connected to the first well. A barrier region of the second conductivity type and the floating base region form an auxiliary pn junction. A second conductive structure is electrically connected to the floating base region through a rectifying structure. A pull-down structure is configured to produce a voltage drop between the barrier region and the second conductive structure, when charge carriers cross the auxiliary pn junction.

Provided is a semiconductor device including a semiconductor substrate; a transistor portion provided in the semiconductor substrate; a current sensing portion for detecting current flowing through the transistor portion; an emitter electrode set to an emitter potential of the transistor portion; a sense electrode electrically connected to the current sensing portion; and a Zener diode electrically connected between the emitter electrode and the sense electrode. Provided is a semiconductor device fabricating method including providing a transistor portion in a semiconductor substrate; providing a current sensing portion for detecting current flowing through the transistor portion; providing an emitter electrode set to an emitter potential of the transistor portion; providing a sense electrode electrically connected to the current sensing portion; and providing a Zener diode electrically connected between the emitter electrode and the sense electrode.

Provided is a semiconductor device including a semiconductor substrate; a transistor portion provided in the semiconductor substrate; a current sensing portion for detecting current flowing through the transistor portion; an emitter electrode set to an emitter potential of the transistor portion; a sense electrode electrically connected to the current sensing portion; and a Zener diode electrically connected between the emitter electrode and the sense electrode. Provided is a semiconductor device fabricating method including providing a transistor portion in a semiconductor substrate; providing a current sensing portion for detecting current flowing through the transistor portion; providing an emitter electrode set to an emitter potential of the transistor portion; providing a sense electrode electrically connected to the current sensing portion; and providing a Zener diode electrically connected between the emitter electrode and the sense electrode.

A semiconductor device which includes two or more integrated deep trench features configured as a Zener diode. The Zener diode includes a plurality of deep trenches extending into semiconductor material of the substrate and a dielectric deep trench liner that includes a dielectric material. The deep trench further includes a doped sheath contacting the deep trench liner and an electrically conductive deep trench filler material within the deep trench. The doped sheath of adjacent deep trenches overlap and form a region of higher doping concentration which sets the breakdown voltage of the Zener diode. The Zener diode can be used as a triggering diode to limit the voltage on other components in a semiconductor device.

A semiconductor device which includes two or more integrated deep trench features configured as a Zener diode. The Zener diode includes a plurality of deep trenches extending into semiconductor material of the substrate and a dielectric deep trench liner that includes a dielectric material. The deep trench further includes a doped sheath contacting the deep trench liner and an electrically conductive deep trench filler material within the deep trench. The doped sheath of adjacent deep trenches overlap and form a region of higher doping concentration which sets the breakdown voltage of the Zener diode. The Zener diode can be used as a triggering diode to limit the voltage on other components in a semiconductor device.