Imagers and associated devices and systems are disclosed herein. In one embodiment, an imager includes a pixel array and control circuitry operably coupled to the pixel array. The pixel array includes an imaging pixel configured to produce a reset signal and a non-imaging pixel configured to produce a nominal reset signal. The control circuitry is configured to produce an output signal based at least in part on one of (a) the nominal reset signal when distortion at the imaging pixel exceeds a threshold and (b) the reset signal when distortion does not exceed the threshold.

A method of correcting errors in the output of an image detector is disclosed. The method comprises measuring an output signal (V.sub.m) of a capacitor (C.sub.sh) holding a voltage corresponding to a signal detected by the image detector; comparing the value of output signal (V.sub.m) to the value of the previously measured output signal (V.sub.m−1) of the capacitor (C.sub.sh); calculating the error in the output signal (V.sub.m) using a predetermined correction factor and the difference between the value of the output signal (V.sub.m) and the value of the previously measured output signal (V.sub.m−1); and providing a corrected output value (V.sub.crt) in accordance with the calculated error. Detectors, methods of calibrating detectors, image correction apparatus and guidance systems comprising the detectors are also disclosed.

A photoelectric conversion apparatus includes a semiconductor substrate including recessed portions and insulators disposed on the respective recessed portions. The semiconductor substrate includes a first-conductivity-type first semiconductor region, a second-conductivity-type second semiconductor region that is of a conductivity type different from the first-conductivity-type and that is formed in the first semiconductor region, a second-conductivity-type third semiconductor region in contact with the second semiconductor region on a surface of the semiconductor substrate, and a first-conductivity-type fourth semiconductor region that includes the recessed portions. The second semiconductor region and the third semiconductor region are surrounded by the fourth semiconductor region on the surface of the semiconductor substrate. The insulators on the recessed portions extend through the fourth semiconductor region and are in contact with the first semiconductor region.

A solid-state imaging device includes: a pixel region in which a plurality of pixels composed of a photoelectric conversion section and a pixel transistor is arranged; an on-chip color filter; an on-chip microlens; and a multilayer interconnection layer in which a plurality of layers of interconnections is formed through an interlayer insulating film. The solid-state imaging device further includes a light-shielding film formed through an insulating layer in a pixel boundary of a light receiving surface in which the photoelectric conversion section is arranged.

A high dynamic range imaging pixel may include a photodiode that generates charge in response to incident light. When the generated charge exceeds a first charge level, the charge may overflow through a first transistor to a first storage capacitor. When the generated charge exceeds a second charge level that is higher than the first charge level, the charge may overflow through a second transistor. The charge that overflows through the second transistor may alternately be coupled to a voltage supply and drained or transferred to a second storage capacitor for subsequent readout. Diverting more overflow charge to the voltage supply may increase the dynamic range of the pixel. The amount of charge diverted to the voltage supply may therefore be updated to control the dynamic range of the imaging pixel.

An apparatus includes a bloom transistor frontend configured to receive an integrator output voltage and generate a comparator input voltage. The apparatus also includes a comparator configured to generate an output signal based on whether the comparator input voltage meets or exceeds a reference voltage. The bloom transistor frontend includes a first transistor configured to charge an input capacitance associated with the comparator in order to change the comparator input voltage. The bloom transistor frontend also includes a second transistor configured to discharge the input capacitance associated with the comparator in order to reset the comparator input voltage.

In a photoelectric conversion apparatus, a pixel transistor and a differential transistor form a differential pair. A clamp circuit clamps a gate voltage of the differential transistor. An output circuit performs a first operation in which a voltage based on the voltage at the gate of a pixel transistor is output to the gate of the differential transistor. The output circuit also performs a second operation in which in response to receiving a current from the differential transistor, a signal based on a result of a comparison between the gate voltage of the pixel transistor and the gate voltage of the differential transistor is output to the output node. In the second operation, a control unit in the output circuit controls a change in the drain voltage of the differential transistor to be smaller than a change in the voltage at the output node.

The present technology relates to a solid-state imaging device and an electronic device capable of improving a saturation characteristic. A photo diode is formed on a substrate, and a floating diffusion accumulates a signal charge read from the photo diode. A plurality of vertical gate electrodes is formed from a surface of the substrate in a depth direction in a region between the photo diode and the floating diffusion, and an overflow path is formed in a region interposed between a plurality of vertical gate electrodes. The present technology may be applied to a CMOS image sensor.

The present technology relates to an imaging device capable of preventing a decrease of sensitivity of the imaging device in a case where a capacitance element is provided in a pixel, a method of manufacturing an imaging device, and an electronic device. The imaging device includes, in a pixel, a photoelectric conversion element and a capacitance element accumulating an electric charge generated by the photoelectric conversion element. The capacitance element includes a first electrode including a plurality of trenches, a plurality of second electrodes each having a cross-sectional area smaller than a contact connected to a gate electrode of a transistor in the pixel, and buried in each of the trenches, and a first insulating film disposed between the first electrode and the second electrode in each of the trenches. The present technology can be applied, for example, to a backside irradiation-type CMOS image sensor.

A solid-state imaging device comprises a first pixel group includes a first photoelectric conversion unit that converts into electric charges reflection light pulses from an object irradiated with an irradiation light pulse, a first electric charge accumulation unit accumulating the electric charges in synchrony with turning on the irradiation light pulses, and a first reset unit resetting the electric charges; and a second pixel group includes a second photoelectric conversion unit that converts the reflection light into electric charges, a second electric charge accumulation unit that accumulates the electric charges synchronously with a switching the irradiation light pulses from on to off, and a second reset unit that releases a reset of the electric charges converted by the second photoelectric conversion unit.