Embodiments described herein involve methods of forming an interactive card with indicators on a substrate. A plurality of indicators are formed on the substrate by way of a printed electronics process. A plurality of displaceable regions of piezoelectric material are formed on the substrate by way of a printed electronics process. Electrical interconnections are formed on the substrate by way of a printed electronics process, the electrical interconnections connecting an indicator and an associated displaceable region of piezoelectric material such that displacement of the associated displaceable region of piezoelectric material generates a voltage therein that is provided to the indicator in order to actuate the indicator and thereby indicate displacement of the associated displaceable region of piezoelectric material.

A multi-layer, super-planar structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations.

An ultrasonic transducer element package includes a first substrate, a second substrate, a support body, and first and second ultrasonic transducers. The first substrate has first and second openings that are aligned in a first direction. The second substrate has a third and fourth openings that are aligned in the first direction. The support body supports the first and second substrates. The first and second substrates are aligned in a second direction that intersects with the first direction, with a space therebetween. The first and Second ultrasonic transducer elements are configured at the first and second openings respectively.

A mechanical structure comprising a stack including an active substrate and at least one actuator designed to generate vibrations at the active substrate, the stack comprises an elementary structure for amplifying the vibrations: positioned between the actuator and the active substrate, the structure designed to transmit and amplify the vibrations; and comprising at least one trench, located between the actuator and the active substrate. A method for manufacturing the structure comprising the use of a temporary substrate is provided.

A bendable apparatus is provided. The flexible material has a first-surface spanned by a first direction and a second direction. The bendable apparatus also includes a first-constraining surface one of: formed in the first-surface of the flexible material; or attached to the first-surface of the flexible material; and a piezo-electric element including a first-edge surface and a second-edge surface opposing the first-edge surface. The piezo-electric element is fixedly attached on the first-surface of the flexible material, so that: the first-edge surface and the second-edge surface are at least approximately perpendicular to the first-surface of the flexible material, and the first-constraining surface is adjacent to the first-edge surface of the piezo-electric element. When a voltage is applied to the piezo-electric element, the piezo-electric element expands in length, the first-edge surface of the piezo-electric element applies a force on the first-constraining surface, and the flexible material bends.

A design structure for an integrated radio frequency (RF) filter on a backside of a semiconductor substrate includes: a device on a first side of a substrate; a radio frequency (RF) filter on a backside of the substrate; and at least one substrate conductor extending from the front side of the substrate to the backside of the substrate and electrically coupling the RF filter to the device.

To provide a tactile vibration applying device that efficiently outputs vibrations using an electrostatic or piezoelectric actuator. The tactile vibration applying device includes the electrostatic or piezoelectric actuator formed in a flat shape, and expanding and contracting in a thickness direction, a first elastic body having an elastic modulus smaller than an elastic modulus of the actuator in the thickness direction and disposed to contact a surface of the actuator on a side of the first electrode, and a first cover covering a surface of the first elastic body opposite to a surface of the first elastic body contacting the actuator, pressing the actuator and the first elastic body in the thickness direction of the actuator, and holding the first elastic body in a state that the first elastic body is compressed more than the actuator.

An electroactive polymer transducer including a dielectric elastomer material having a first configuration with a first spring constant and a second configuration with a second spring constant and where the second spring constant is lower than the first spring constant.

An ultrasound probe comprises: a backing material; a plurality of inorganic piezoelectric elements arranged on a top surface of the backing material; a first acoustic matching layer separated into a plurality of pieces disposed on the plurality of inorganic piezoelectric elements; and a second acoustic matching layer separated into a plurality of pieces disposed on the first acoustic matching layer, wherein the second acoustic matching layer comprises an upper organic layer constituting a plurality of organic piezoelectric elements, and a lower organic layer for performing, together with the upper organic layer, acoustic matching for the plurality of inorganic piezoelectric elements.

The present disclosure of at least one embodiment provides a method for manufacturing ultrasound probes comprising a machining process, the method including depoling a piezoelectric element as a material for the ultrasonic probes before the machining process.