A backing includes a plurality of backing plates that are laminated. Each backing plate includes a lead row and a backing material. Each lead includes a lead wire and an insulating coating. The insulating coating is integrated with the backing material, and an adhesive layer between them does not exist. Short-circuit between the leads may be prevented or reduced by the insulating coating. The backing plate is manufactured by a screen printing method.

A vibration device that includes a first elastic plate having a first end portion and a second end portion, and a first surface and a second surface facing each other and connecting the first and second end portions. A second elastic plate is laminated to the second end portion of the first elastic plate, and a piezoelectric vibration element is provided on at least one of the first surface and the second surface of the first elastic plate. On a portion where the first elastic plate and the second elastic plate are laminated, a first bonding portion and a second bonding portion that bond the first elastic plate and the second elastic plate to each other are provided. The second bonding portion is located closer to the first end portion than the first bonding portion.

Provided is a method of manufacturing an ultrasound probe. The method includes: preparing a backing layer having first and second surfaces with different heights due to forming a groove in the backing layer, wherein first and second electrodes are exposed on the first and second surfaces, respectively; forming a third electrode that is in contact with the first electrode; forming a base piezoelectric unit on the third electrode, the base piezoelectric unit including a piezoelectric layer; forming a piezoelectric unit by removing an upper region of the base piezoelectric unit; and forming a fourth electrode on the backing layer and the piezoelectric unit.

An embodiment piezoelectric element includes a piezoelectric composite layer including a polymer and a piezoelectric ceramic, a backing layer disposed on a rear surface of the piezoelectric composite layer and configured to limit vibration of the piezoelectric composite layer, and an adhesive layer bonding the piezoelectric composite layer and the backing layer.

An ultrasonic sensor, which is installed on a test device, includes a shell, one end is open, the other end is closed surface; a cover sheet, bonded to the open end of the shell; a copper foil, a lower surface of the copper foil is bonded to an inner bottom surface of the closed surface of the shell; a piezoelectric chip, a lower surface of the piezoelectric chip is bonded to a upper surface of the copper foil, and when the test device vibrates, the piezoelectric chip converts a vibration signal into a voltage response signal; a cable, a positive electrode is welded on a upper surface of the piezoelectric chip, and a negative electrode is welded on the upper surface of the copper foil, configured to connect to an external detection device and transmit the voltage response signal to the external detection device.

A sensor device includes a microelectromechanical system (MEMS) force sensor, and a capacitive acceleration sensor. In the method of manufacturing the sensor device, a sensor portion of the MEMS force sensor is prepared over a front surface of a first substrate. The sensor portion includes a piezo-resistive element and a front electrode. A bottom electrode and a first electrode are formed on a back surface of the first substrate. A second substrate having an electrode pad and a second electrode to the bottom of the first substrate are attached such that the bottom electrode is connected to the electrode pad and the first electrode faces the second electrode with a space therebetween.

An ultrasonic transducer that includes a delay line, an active piezoelectric element, and interposing metal conductive layer between the delay line and active piezoelectric element. The delay line and active piezoelectric element are joined so that ultrasonic waves may be coupled from the active piezoelectric element into the delay line or from the delay line into the active piezoelectric element. A via is formed, using a milling operation, in the active piezoelectric element to expose the edge of the interposing metal conductive layer between the delay line and active piezoelectric element. A conductive layer makes electrical contact between the interposing metal conductive layer and the surface of the active piezoelectric element to allow an electrical connection to be made from the surface of the active piezoelectric element to the interposing metal conductive layer.

A method for designing a piezoelectric element unit, a ultrasonic element having the piezoelectric element manufactured using the method, a method for manufacturing the ultrasonic element, and an acoustic pressure focusing device having the ultrasonic element are provided. In the method for designing a piezoelectric element unit, a target position and a target distance are selected. A basic information of a piezoelectric element base material is inputted. Each of a plurality of grids is grouped into a unit grid group. A size of an output acoustic pressure outputted at each unit grid group is calculated. The unit grid group outputting the output acoustic pressure included in a range of a reference acoustic pressure among a plurality of the unit groups is decided. The plurality of ring patterns being concentric is determined based on a pattern shape information.

A backing includes a plurality of backing plates that are laminated. Each backing plate includes a lead row and a backing material. Each lead includes a lead wire and an insulating coating. The insulating coating is integrated with the backing material, and an adhesive layer between them does not exist. Short-circuit between the leads may be prevented or reduced by the insulating coating. The backing plate is manufactured by a screen printing method.

A piezoelectric transducer includes a transducer unit disposed within a watertight and gas-tight housing and having at least one piezoelectric element contacted by at least two electrodes. A signal lead-through is electrically connected to the electrodes and configured conducting polarization charges as signals from the piezoelectric element through the housing to an environment outside of the housing. A signal cable arranged outside of the housing includes at least two signal conductors. The signal lead-through includes a support element having at least two conducting paths in electrical contact with one of the signal conductors.