Patent classifications
H01L41/25
METHODS AND SYSTEMS FOR A MULTI-FREQUENCY TRANSDUCER ARRAY
Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array includes an element formed of one or more sub-elements, at least one sub-element having a different resonance frequency. A frequency range of the transducer array may thereby be broadened.
METHODS AND SYSTEMS FOR MULTI-FREQUENCY TRANSDUCER ARRAY FABRICATION
Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array is fabricated by forming an interdigitated structure from a first comb structure with a first sub-element and a second comb structure with a second sub-element. The interdigitated structure is coupled to a base package, a matching layer, and a backing layer to form a plurality of multi-frequency transducers.
Manufacturing method for multi-layer PZT microactuator having a poled but inactive PZT constraining layer
A multi-layer piezoelectric microactuator assembly has at least one poled and active piezoelectric layer and one poled but inactive piezoelectric layer. The poled but inactive layer acts as a constraining layer in resisting expansion or contract of the first piezoelectric layer.
Stacked-Die Bulk Acoustic Wave Oscillator Package
A stacked-die oscillator package includes an oscillator circuit die having inner bond pads, and outer bond pads, and a bulk acoustic wave (BAW) resonator die having a piezoelectric transducer with a first and second BAW bond pad on a same side coupled to a top and bottom electrode layer across a piezoelectric layer. A first metal bump is on the first BAW bond pad and a second metal bump is on the second BAW bond pad flip chip bonded to the inner bond pads of the oscillator circuit die. A polymer material is in a portion of a gap between the BAW and oscillator circuit die.
TRANSDUCER WITH IMPROVED PIEZOELECTRIC ARRANGEMENT, MEMS DEVICE COMPRISING THE TRANSDUCER, AND METHODS FOR MANUFACTURING THE TRANSDUCER
A transducer includes a supporting body and a suspended structure mechanically coupled to the supporting body. The suspended structure has a first and a second surface opposite to one another along an axis, and is configured to oscillate in an oscillation direction having at least one component parallel to the axis. A first piezoelectric transducer is disposed on the first surface of the suspended structure, and a second piezoelectric transducer is disposed on the second surface of the suspended structure.
ULTRASONIC PROBE, ULTRASONIC DIAGNOSTIC APPARATUS, AND METHOD FOR MANUFACTURING BACKING MATERIAL
An ultrasonic probe includes: a piezoelectric element; and a backing material including a matrix resin and thermally conductive particles, arranged on one direction side with respect to the piezoelectric element, wherein a ratio of thermal conductivity of the backing material in a thickness direction to the thermal conductivity of the backing material in a horizontal direction is 3 or more.
METHOD OF CONSTRUCTING A JAW MEMBER FOR AN END EFFECTOR ASSEMBLY
An end effector assembly for use with an electrosurgical instrument is provided. The end effector assembly has a pair of opposing jaw members. One or more of the jaw members includes a support base, an electrical jaw lead, and a sealing plate coupled to the electrical jaw lead. The sealing plate has a stainless steel layer and one or more piezo electric sensors. The jaw member also includes an insulative plate disposed between the support base and the sealing plate.
MULTI-CELL TRANSDUCER
The present invention relates to a transducer device having a planar array of electroacoustic cells, each including a piezoelectric bilayer unit. The transducer device achieves high transmission sensitivity across a broad bandwidth. The transducer device may be designed to have a broad or a focused directivity pattern, or may be multi-frequency, depending on the particular application and has a range of applications. For example, the transducer device may be used with an implanted passive ultrasonically excitable resonating sensor, to excite the sensor and/or to interrogate the sensor, for example in conjunction with Doppler-based analysis of the resonance frequency of the sensor, and/or to locate an implanted sensor. The invention also relates to a method of manufacturing the device.
Coupling evaluation geophone and method for eliminating ground-geophone coupling effect
The present disclosure discloses a coupling evaluation geophone, comprising piezoelectric ceramic crystal 1, 2 and 3, a geophone 4 and a relevant supplying circuit. Three piezoelectric ceramic crystals 1, 2 and 3 are respectively provided on the top and two lateral sides of the geophone 4. By processing measurement data derived from the coupling evaluation geophone, a ground-geophone coupling effect is obtained at a corresponding embedment point of the coupling evaluation geophone. An effect of the ground-geophone coupling on an earthquake data can be eliminated by calculation. Data detected by the coupling evaluation geophone is improved in fidelity, Signal/Noise ratio and resolution.
Method of manufacturing an inkjet print head and an inkjet print head with induced crystal phase change actuation
A method for manufacturing an inkjet print head includes determining a misfit strain-electric field crystal phase relation for at least one composition of a piezoelectric material; selecting a misfit strain value and a composition of the piezoelectric material based on the determined misfit strain-electric field crystal phase relation for said at least one composition; and based on the selected misfit strain and the selected composition of the piezoelectric material, forming a base layer and an actuator stack on the base layer, the actuator stack including the piezoelectric material, wherein the base layer and the actuator stack have predetermined properties providing the selected misfit strain value and the selected composition. Thus, an inkjet print head having a piezoelectric actuator that is operated on the basis of a crystal phase change is reliably manufacturable.