The present disclosure relates to a charge output device, an assembly method and a piezoelectric acceleration sensor. The charge output device includes a base, including a polygonal connecting member including a plurality of sides; a piezoelectric assembly, including at least two piezoelectric units distributed along a circumferential direction of the connecting member and spaced apart from each other, the at least two piezoelectric units are disposed corresponding to at least two of the plurality of sides of the connecting member, and each piezoelectric unit includes at least one piezoelectric crystal, wherein the respective piezoelectric crystals of the at least two piezoelectric units are connected in parallel; and a mass assembly, disposed on an outer circumferential side of the piezoelectric assembly such that the piezoelectric assembly is located between the connecting member and the mass assembly, the connecting member, the piezoelectric assembly and the mass assembly are interference-fitted with each other.

A piezoelectric thin-film element includes a diaphragm plate on a substrate; a lower electrode on the diaphragm plate; a piezoelectric film on the lower electrode, the piezoelectric film containing Pb; and an upper electrode on the piezoelectric film. The diaphragm plate is a laminate in which a silicon oxide layer, a silicon nitride layer, and an amorphous layer containing a metal oxide to trap Pb of the piezoelectric film are laminated in turn on the substrate. The amorphous layer has a thickness of preventing Pb of the piezoelectric film from reaching the silicon nitride layer.

The present invention relates to a piezoelectric fiber having excellent flexibility, the piezoelectric fiber employs a conductive fiber member as an inner electrode, on which a piezoelectric polymer layer, an outer electrode and a coating layer are sequentially formed, thereby having excellent flexibility and sufficient elasticity to be sewed, woven, knotted or braided. Therefore, the piezoelectric fiber can be applied in power supplies for a variety of sizes and types of wearable electronic devices, portable devices, clothing, etc. In addition, since the piezoelectric fiber has excellent piezoelectricity and durability because of the above-described structure, it can effectively convert deformation or vibration caused by external physical force into electric energy, and thus can replace existing ceramic-based and polymer piezoelectric bodies, etc. Furthermore, an economical and simple method of manufacturing a piezoelectric fiber having excellent piezoelectricity is provided.

A piezoelectric generator is specified, comprising a deformation body, which spans a projection surface and is embodied with a setpoint pressure surface situated opposite the projection surface, wherein the projection surface can be converted from a smaller projection surface when not loaded under pressure into a larger projection surface when pressure is applied to the setpoint pressure surface substantially perpendicular to the projection surface, and a spring effect is provided which counteracts an application of pressure to the setpoint pressure surface, wherein an electromechanical transducer element comprising a piezoelectric material wholly or partly spans the projection surface, such that the transducer element is embodied in an expandable fashion upon pressure being applied to the deformation body, and electrical microenergy can be generated by means of the piezoelectric material.

A method of fabricating pre-structured functional wafers, pre-structured functional cuboid or wafer stack, and a method of fabricating an array of functional multilayer stack actuators made of relaxor ferroelectric single crystal piezoelectric thin layers comprising sequentially repeated steps of wafer dicing and trench refilling into relatively thick wafer(s). A bulk-micromachined dimensioned deformable mirror device comprising a base supporting substrate, a plurality of stack actuators that is made by segmenting a pre-structured relaxor ferroelectric single crystal piezoelectric cuboid or wafer stack, a plurality of pedestals disposed on the plurality of stack actuators; a deformable membrane mirror mounted on said pedestals; and a plurality of addressable electrode contacts.

A semiconductor device includes a buffer layer formed with a semiconductor adapted to produce piezoelectric polarization, and a channel layer stacked on the buffer layer, wherein a two-dimensional hole gas, generated in the channel layer by piezoelectric polarization of the buffer layer, is used as a carrier of the channel layer. On a complementary semiconductor device, the semiconductor device described above and an n-type field effect transistor are formed on the same compound semiconductor substrate. Also, a level shift circuit is manufactured by using the semiconductor device. Further, a semiconductor device manufacturing method includes forming a compound semiconductor base portion, forming a buffer layer on the base portion, forming a channel layer on the buffer layer, forming a gate on the channel layer, and forming a drain and source with the gate therebetween on the channel layer.

Systems and methods described herein generally relate to forming a conductive layer of an ultrasound probe. The systems and methods form an ultrasound probe that includes a piezoelectric layer, and first and second matching layers. The first matching layer is interposed between the second matching layer and the piezoelectric layer. The second matching layer formed from a material having a select acoustic impedance from a laser activated molded interconnect device (MID) or a three-dimensional printer. The second matching layer being electrically coupled to the piezoelectric layer.

A display device includes a casing (11) an operation plate, a piezoelectric sensor, a controller, and a display. The piezoelectric sensor includes a piezoelectric film, an optically clear adhesive, a plurality of first electrodes, a plurality of first wiring lines, a plurality of second electrodes, a second wiring line, a pair of substrates and a reception circuit. The piezoelectric sensor is bonded to a surface of the operation plate on a side opposite to an operation surface. The plurality of first wiring lines includes a region, which overlaps one of the piezoelectric film and the plurality of second electrodes but does not overlap either the piezoelectric film or the plurality of second electrodes at the same time when a first surface is viewed from a front. The region is provided between the second electrodes when the first surface is viewed from the front.

A device structure comprises a patterned substrate comprising a substrate surface and a substrate post protruding from the substrate surface. The substrate post comprises a substrate post material. A component has a component top side and a component bottom side opposite the component top side. The component bottom side is disposed on the substrate post and extends over at least one edge of the substrate post. The component comprises a component material different from the substrate post material and the component comprises a broken (e.g., fractured) or separated component tether.

The described architecture and techniques may provide for ultrasonic sensing using transmit and receive beamforming using an ultrasonic sensor with a continuous (e.g., non-segmented) blanket layer of piezo-sensitive material between a common electrode and an array of electrodes. For example, an ultrasonic biometric sensor may utilize a continuous blanket layer of piezo-sensitive material (e.g., such as a continuous copolymer, in lieu of an array of piezoelectric elements) between a common electrode and an electrode array for transmit and receive beamforming. The electrode array may employ individual transmission cycle control for each electrode to perform aspects of ultrasonic transmit and receive beamforming for biometric sensing/imaging. The continuous copolymer (e.g., or other blanket layer of piezo-sensitive material) may provide for a thin layer, between the common electrode and the electrode array, with desirable material properties to isolate each pixel from neighboring pixels and enable effective ultrasonic transmit and receive beamforming.