An optical sensor, an optical examination device, and a method of detecting optical properties. The optical sensor includes an irradiation system including light irradiator to irradiate a test object with light, and a detection system to detect the light that is emitted from the irradiation system to the test object and has propagated through the test object. The light irradiator includes a multilayered structure having an active layer, and the multilayered structure includes a surface-emitting laser element and a photo-sensing element optically connected to the surface-emitting laser element. The optical examination device includes the optical sensor, and a controller to calculate optical properties of the test object based on a detection result of the optical sensor. The method includes performing optical simulation to obtain a detection light quantity distribution for an optical model and performing inverse problem estimation.

A photoelectric converting module includes a circuit board, at least one light emitting/receiving unit and an optical coupler both mounted on the circuit board. Each light emitting/receiving unit includes a light emitter and a light receiver, the light emitter and the light receiver each include at least one positioning projection. The optical coupler includes positioning parts to engage with the positioning projections for aligning the optical coupler with the light emitting/receiving unit precisely.

An optical sensor arrangement, in particular an optical proximity sensor arrangement comprises a three-dimensional integrated circuit further comprising a first layer comprising a light-emitting device, a second layer comprising a light-detector and a driver circuit. The driver circuit is electrically connected to the light-emitting device and to the light-detector to control the operation of the light-emitting device and the light-detector. A mold layer comprising a first light-barrier between the light-emitting device and the light-detector configured to block light from being transmitted directly from the light-emitting device to the light-detector.

A packaged semiconductor device includes a substrate, a die, at least one electrical connector, a first mold compound formed of translucent material, and a second mold compound. A first face of the die is electrically and mechanically coupled to the substrate. The at least one electrical connector electrically couples at least one electrical contact on a second face of the die with at least one conductive path of the substrate. The first mold compound formed of a translucent material at least partially encapsulates the die and the at least one electrical connector. The second mold compound at least partially encapsulates the first mold compound and forms a window through which the first mold compound is exposed. In implementations the second mold compound is opaque and the first mold compound is transparent. In implementations the substrate includes a lead frame having a die flag and a plurality of lead frame fingers.

An optical sensor includes a substrate including a substrate main surface intersecting a thickness-wise direction, a light emitting element disposed on the substrate main surface, a light receiving element disposed on the substrate main surface, a transparent first cover disposed on the substrate main surface to cover the light emitting element, and a transparent second cover disposed on the substrate main surface to cover the light receiving element. The first cover and the second cover are spaced apart by a gap.

An optical smoke detection unit for a danger alarm includes a light-emitting diode (LED) including at least one LED chip in an LED housing and connection contacts contacting the LED chip and running out of the LED housing. The smoke detection unit may include a photo-detector spectrally sensitive to emitted light for detecting smoke and a control unit for controlling the LED and for evaluating a sensor signal of the photo-detector for characteristic fire magnitudes. The LED may include a photosensor spectrally sensitive to the emitted light. The control unit may detect an electrical characteristic magnitude of the photosensor while providing electrical control of the LED, and based on the detected electrical characteristic magnitude, (a) derive and output ageing information about the LED and/or (b) determine a reduction of light current of the LED and modify the electrical control of LED to correct such reduction.

An optical sensor is installed in a device, and includes a light-emitting element, and a light-receiving element for receiving light emitted from the light-emitting element and traveling through a space. The optical sensor detects an object present in the space, based on a change of the light impinging upon the object. A first optical waveguide is connected to the light-emitting element so as to be capable of light propagation. The first optical waveguide has a front end portion serving as a light exit portion for exiting light emitted from the light-emitting element. A second optical waveguide is connected to the light-receiving element so as to be capable of light propagation. The second optical waveguide has a front end portion serving as a light entrance portion for receiving light exiting from the light exit portion of the first optical waveguide and traveling through the space.

Embodiments provide a light emitting device package including a package body having a top-opened cavity disposed in at least a portion thereof, a first electrode layer and a second electrode layer electrically isolated from the package body with an insulating layer interposed therebetween, the first electrode layer and the second electrode layer being electrically isolated from each other at a bottom surface of the cavity, a light emitting device placed on the bottom surface of the cavity configured to emit light through the open region of the cavity, and a sensor placed on at least a portion of the package body at the outside of the cavity configured to measure output of the light emitting device.

The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a substrate, a sensor chip, a light-emitting device, a non-transparent isolation structure and a non-transparent molding material, wherein the sensor chip is located on the substrate and electrically coupled to the substrate; the light-emitting device is located on the sensor chip and electrically coupled to the sensor chip; the non-transparent isolation structure is located on the sensor chip and isolates the light-emitting device from a sensor region of the sensor chip; and the non-transparent molding material at least partially covers the substrate, the sensor chip and the non-transparent isolation structure, such that a portion of the proximity sensor which is located right above the sensor region and the light-emitting device is not covered by the non-transparent molding material.

The semiconductor device comprises a semiconductor substrate (1), a photosensor (2) integrated in the substrate (1) at a main surface (10), an emitter (12) of radiation mounted above the main surface (10), and a cover (6), which is at least partially transmissive for the radiation, arranged above the main surface (10). The cover (6) comprises a cavity (7), and the emitter (12) is arranged in the cavity (7). A radiation barrier (9) can be provided on a lateral surface of the cavity (7) to inhibit cross-talk between the emitter (12) and the photosensor (2).