A light emitting diode (LED) module which includes: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. The plurality of layers includes a second layer that is an uppermost layer and a first layer that is an underlying layer. The second layer that is the uppermost layer includes fluorine as a component.

There is provided a substrate excellent in high reflectance, high heat dissipation, withstand voltage property, and thermal and light stability. A substrate (5) includes an aluminum base (10), a reflective layer (17) which is formed between the aluminum base (10) and an electrode pattern (20) for electrical connection with a light emitting element to contain ceramic and reflects light from the light emitting element, and an intermediate layer (16) containing resin and having high thermal conductibility which is formed to reinforce withstand voltage performance of the reflective layer (17).

A lighting device is provided. The lighting device includes a substrate, integrated circuits (22, 24), embedded passive components (26, 27), and a lighting component (22), the device being arranged in an architecture having three layers: an integrated circuits layer (11) including the integrated circuits (22, 24), wherein the integrated circuits layer (11) is integrated on a first side of the substrate; an embedded passive components layer (12) including the embedded passive components (26, 27), wherein the embedded passive components (26, 27) are embedded in grooves formed in the substrate and wherein the embedded passive components are connected to the integrated circuits (22, 24) through vias (28) in the substrate; and a bonded layer (13), including the lighting component (22), the lighting component (22) being connected to the integrated circuit layer (11) through flip-chip bonding or monolithic integration.

The invention provides a fluorescent strip, which covers a luminous body, wherein the fluorescent strip includes a fluorescent powder layer and at least two protective layers; and the fluorescent powder layer is sandwiched between the two protective layers, so that the falling of fluorescent powder is avoided, a function of protecting and limiting the fluorescent powder is realized, and the fluorescent powder is uniformly laid on a surface of the luminous body. The fluorescent strip further includes a light converging layer, wherein the light converging layer covers the outer protective layer; and light emitted from the luminous body sequentially passes through the inner protective layer, the fluorescent power layer, the outer protective layer and the light converging layer, and is converged into light rays through the light converging layer.

One electrical lead from an LED package is soldered to an inner electrically conductive member positioned and electrically isolated from an outer electrically conductive member by electrically insulating material while a second electrical lead and a neutral lead from the LED are soldered to the outer electrically conductive member so that heat is transferred from an LED die within the LED package to the outer electrically conductive member and then to a thermally conductive outer casing with a thermal path that minimizes thermal resistance.

Solid-state transducers (SSTs) and vertical high voltage SSTs having buried contacts are disclosed herein. An SST die in accordance with a particular embodiment can include a transducer structure having a first semiconductor material at a first side of the transducer structure, and a second semiconductor material at a second side of the transducer structure. The SST can further include a plurality of first contacts at the first side and electrically coupled to the first semiconductor material, and a plurality of second contacts extending from the first side to the second semiconductor material and electrically coupled to the second semiconductor material. An interconnect can be formed between at least one first contact and one second contact. The interconnects can be covered with a plurality of package materials.

A supporting component and a display device are provided. The supporting component is configured to support the display panel. The supporting component includes a hole. The supporting component includes a first support portion and a second support portion. The first support portion is arranged around the hole. The second support portion is arranged around the first support portion. An elasticity modulus of the second support portion is greater than an elasticity modulus of the first support portion.

A light emitting diode package for a directional display may comprise light emitting diodes and a protection diode. The protection diode may be arranged in a well that is at a different location to the well that the light emitting diodes are arranged. The directional display may include a waveguide. The waveguide may include light extraction features arranged to direct light from an array of light sources by total internal reflection to an array of viewing windows and a reflector arranged to direct light from the waveguide by transmission through extraction features of the waveguide to the same array of viewing windows. The brightness of the directional display can be increased. An efficient and bright directional display system can be achieved. Efficient light baffling for light escaping from the edge of the waveguide is achieved through light deflecting extraction films.

A light-emitting diode package includes a package body. The package body includes an upper insulation substrate including upper conductive patterns, a lower insulation substrate including lower conductive patterns, and middle conductive patterns disposed between the upper insulation substrate and the lower insulation substrate. The package body also includes an upper via disposed in the upper insulation substrate, a lower via disposed in the lower insulation substrate, the upper via and the lower via not overlaid with each other.

In order to provide a substrate for light emitting devices having high heat radiating properties, dielectric strength voltage properties, light reflectivity, and excellent mass productivity, a substrate (5) includes an intermediate layer (11) containing ceramic which is formed on the surface of the aluminum base (10) by using an aerosol deposition method.