A light-emitting device including a first electrically-conductive member and a second electrically-conductive member, solder on upper surfaces of the first and second electrically-conductive members, a light-emitting element bonded to the upper surfaces of the first and second electrically-conductive members with the solder, a light-transmitting member on an upper surface of the light-emitting element, and a cover member covering the upper surfaces of the first and second electrically-conductive members and a lateral surface of the light-emitting element. A lateral surface of the first electrically-conductive member includes a first recessed surface contiguous with the upper surface and a second recessed surface located at a lower level than the first recessed surface. The solder continuously covers the upper surface of the first electrically-conductive member and at least part of the first recessed surface, and the cover member further covers the solder covering the first recessed surface and at least part of the second recessed surface.

According to embodiments of the present disclosure, a semiconductor structure is provided. The semiconductor structure includes a substrate and a light-emitting structure on the substrate. The light-emitting structure includes a first type semiconductor layer, an active layer and a second type semiconductor layer which are sequentially stacked on the substrate. The first type semiconductor layer includes a first portion not covered by the active layer, and a first heat-dissipation module is disposed on the first portion, so that a surface of the first heat-dissipation module facing the first portion can be used to dissipate heat from the surface of the first portion of the first type semiconductor layer, and a side surface of the first heat-dissipation module facing the light-emitting structure can be used to dissipate heat from the sidewall of the light-emitting structure, thereby increasing heat exchange area and obtaining better heat-dissipation effect.

A light emitting display device can include a heat dissipater having a first heat dissipating particle and extending from an outside of a first electrode constituting a light emitting diode disposed in an emission area. Further, optionally, the display device can further include a bank layer disposed in a non-display area and having a light absorbing material and a second heat dissipating particle. Each of the heat dissipater and the bank layer can include the heat dissipating particle so that heat generated in the light emitting diode can be dissipated outwardly. In addition, as the amount of the light absorbing material contents in the bank layer decrease, the credibility of the light emitting display device can be improved.

Lensed optics for a modular linear light emitting device for precisely illuminating vertical and horizontal surfaces where needed at the required light intensity and uniformity ratio/s.

An apparatus for manufacturing a display apparatus includes: a molding unit including a frame including a first surface and a second surface opposite to the first surface and in which a mask opening passing from the second surface to the first surface is defined; and a plate disposed adjacent to the first surface of the frame to define a molding space with the frame. The plate includes: a first plate which is disposed in the mask opening and in which a plurality of holes are defined; and a second plate having a plate shape and disposed on the first surface of the frame to overlap at least the plurality of holes on a plane, and the first plate moves in a direction perpendicular to each of the first surface and the second surface in a space between the first surface and the second surface of the frame.

The present disclosure provides a display module and a vehicle terminal. The display module includes a display panel and a heat-dissipation part. The heat-dissipation part at least includes a main-heat-dissipation portion and a sub-heat-dissipation portion; and along a direction perpendicular to a plane of the display panel, the main-heat-dissipation portion is at least partially overlapped with the display panel; along a direction in parallel with the plane of the display panel, the sub-heat-dissipation portion is at least on a side of the main-heat-dissipation portion; and the sub-heat-dissipation portion includes a blade structure; and the main-heat-dissipation portion is connected to the blade structure of the sub-heat-dissipation portion.

A novel display panel that is highly convenient or reliable is provided. A novel display device that is highly convenient or reliable is provided. A novel input/output device that is highly convenient or reliable is provided. A novel data processing device that is highly convenient or reliable is provided. The display panel includes a pixel, a functional layer, and a heat radiation member, the pixel includes a display element and a pixel circuit, and the pixel circuit is electrically connected to the display element. The functional layer includes the pixel circuit, a terminal, and an intermediate film, and the terminal is connected to the display element. The intermediate film includes an opening, and the heat radiation member is connected to the terminal through the opening.

A light source module is provided. The light source module includes a printed circuit board; a light-emitting device mounted on the printed circuit board, the light-emitting device including a plurality of cell blocks, each of which includes a plurality of light-emitting cells; and a plurality of controllers mounted on the printed circuit board, each of which is configured to drive a cell block corresponding thereto, from among the plurality of cell blocks. The plurality of cell blocks are electrically isolated from each other, the plurality of cell blocks include a first cell block and a second cell block, and a number of first light-emitting cells included in the first cell block is less than a number of second light-emitting cells included in the second cell block.

An optoelectronic device includes a glass carrier, at least one light-scattering layer applied to the glass carrier, and at least one surface-emitting component in a chip size package with an emission surface and a surface facing away from the emission surface having a first and a second contact pad. The emission surface is arranged on the at least one light-scattering layer by way of an adhesive. At least one contact line contacts the second contact pad of the at least one surface-emitting component and extends along a side surface of the at least one surface-emitting component adjacent to the second contact pad in a direction of the glass carrier. A light-shaping structure is arranged on a surface of the glass carrier facing away from the surface-emitting component.

A light-emitting diode with high reverse voltage tolerance includes a holder, a positive pad, a negative pad and a light source. The positive pad is disposed in the holder, and includes a first main body and a first extension portion connected to each other. The negative pad is disposed in the holder, and includes a second main body and two second extension portions connected to the second main body. The light source is disposed in the holder and electrically connected to the positive pad and the negative pad. The second extension portions extend toward the positive pad to form an accommodating space between the second extension portions, and the first extension portion extends toward the accommodating space.