An apparatus for thermal management for an electric device. In one embodiment the apparatus comprises a primary heat spreader disposed within an enclosure that contains a printed circuit board (PCB) populated with at least one electrical component, wherein the primary heat spreader is thermally conductive and wherein the interior of the enclosure is at least partially filled with an encapsulating material; a secondary heat spreader coupled to an exterior face of a first wall of the enclosure, wherein the secondary heat spreader is thermally conductive; and a thermal interface coupled between the primary head spreader and the PCB, wherein the thermal interface is thermally conductive and electrically insulating.

Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame.

A light source module includes at least one light source emitting light, and a body supporting the light source. The body includes a heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer having electrical insulating properties, the insulating layer being provided on at least one surface of the heat sink, and a conductive layer provided on the insulating layer to enable electric current to flow therein. The conductive layer includes an electrically conductive layer providing a path region in which electric current is applied to the light source, and a heat dissipation conductive layer diffusing generated by the light source. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, and promotion of heat dissipation. Furthermore, it is possible to obtain various effects that can be understood through configurations described in embodiments.

A light source module includes at least one light source emitting light, and a body supporting the light source, wherein the body includes a heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer having electrical insulating properties, the insulating layer being provided on at least one surface of the heat sink, and a conductive layer contacted with the insulating layer, the conductive layer being at least provided in a path region in which electric current is applied to the light source, the conductive layer being contacted with the light source. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, and promotion of heat dissipation. Furthermore, it is possible to obtain various effects that can be understood through configurations described in embodiments.

Exemplary embodiments of the present invention provide a wafer-level light emitting diode (LED) package and a method of fabricating the same. The LED package includes a semiconductor stack including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a plurality of contact holes arranged in the second conductive type semiconductor layer and the active layer, the contact holes exposing the first conductive type semiconductor layer; a first bump arranged on a first side of the semiconductor stack, the first bump being electrically connected to the first conductive type semiconductor layer via the plurality of contact holes; a second bump arranged on the first side of the semiconductor stack, the second bump being electrically connected to the second conductive type semiconductor layer; and a protective insulation layer covering a sidewall of the semiconductor stack.

A light emitting device includes: a first support member having an opening; a second support member disposed in the opening of the first support member; an adhesive member disposed between the first and second support members; a first lead electrode disposed on the second support member; a second lead electrode disposed on at least one of the first and second support members; a light emitting chip disposed on the first lead electrode, the light emitting chip being electrically connected to the second lead electrode; and a conductive layer disposed under the second support member, wherein the first support member includes a resin material, the second support member includes a ceramic material, and the first lead electrode is disposed between the light emitting chip and the second support member.

Solid state lighting apparatuses and related methods are described. In some aspects, a solid state lighting apparatus includes a substrate. The substrate includes a non-metallic body having a first surface and one or more electrical components supported on the first surface of the substrate. At least one electrical component is spaced from the non-metallic body by one or more non-metallic layers. The apparatus can also include an array of solid state light emitters supported by the first surface of the substrate and electrically coupled to the one or more electrical components thereof. The apparatus can further include a receiver supported by the first surface of the substrate, wherein the receiver is adapted to receive alternating current (AC) directly from an AC power source. Related systems and methods are also disclosed.

The invention relates to an optoelectronic semiconductor device comprising a carrier, an optoelectronic semiconductor chip arranged on the carrier and a plurality of columns, wherein the plurality of columns are arranged on a base surface of the carrier opposite to the optoelectronic semiconductor chip, and wherein the plurality of columns cause a thermal heat conduction away from the optoelectronic semiconductor chip and the carrier. The invention further relates to a method for producing an optoelectronic semiconductor device.

A method of manufacturing a display module which is able to present a split-screen display without a black line prominent at the boundary includes: providing a first circuit substrate including a plurality of first pads, providing a second circuit substrate including a plurality of second pads; bonding the first circuit substrate and the second circuit sub state onto a surface of a heat dissipation plate through a first heat conductive adhesive; and mounting a plurality of light emitting diodes onto the first conductive wiring layer and the third conductive wiring layer, where one light emitting diodes is electrically connected to two first pad, one light emitting diode is electrically connected to one first pad and one second pad, and one light emitting diode is electrically connected to two second pads. A display module including light emitting diodes is also disclosed.