According to an embodiment of the disclosure, a flexible display device includes a display part including a light emitting element disposed on a base layer, and a panel cover disposed on a rear surface of the display part and including a heat dissipation layer. The heat dissipation layer includes a base heat dissipation layer, and a heat dissipation pattern patterned on the base heat dissipation layer.

A light emitting diode having an improved heat dissipation effect includes a light source unit emitting a light to a front surface and including a light emitting part, a first electrode pad, and a second electrode pad. The light emitting diode further includes a lead frame unit disposed on a rear surface of the light source unit and including first and second lead terminals respectively connected to the first and second electrode pads. The light emitting diode also includes at least one of the first and second lead terminals includes an upper conductive layer, an intermediate conductive layer, and a lower conductive layer which are disposed on different layers and electrically connected to one another.

Disclosed are an LED light and a heat dissipation device thereof. The LED light comprises at least one LED light bead disposed on the heat dissipation device. The heat dissipation device comprises a circuit board having a first metal layer and a second metal layer located on two opposite sides respectively; and a heat sink. The LED light bead is welded to the first metal layer. The second metal layer is welded to the heat sink. The circuit board has heat conductive holes, so that a heat energy generated by the LED light bead can be transferred to the heat sink through the heat conductive holes. Some of the heat conductive holes can be optionally filled with heat conductive material columns, so that the heat energy generated by LED light bead can be conducted to the heat sink through the heat conductive material columns in the heat conductive holes.

A display device according to an embodiment includes a substrate including a plurality of holes including a hole, a metal layer disposed on one side of the substrate, a light-emitting device layer disposed on the metal layer, and a heat radiation layer disposed on another side of the substrate. The heat radiation layer contacts the metal layer in the hole.

A light emitting device includes light emitting element(s). A light transmissive member is on an upper surface of the light emitting element(s). An upper surface area of the light transmissive member is smaller than a lower surface area of the light transmissive member. The upper surface area of the light transmissive member is smaller than a sum of upper surface areas of each light emitting element(s). The lower surface area of the light transmissive member is larger than the sum of the upper surface areas of each light emitting element(s). A light reflective member is provided having a first light reflective member and an underfill. The first light reflective member covers surfaces of the light transmissive member and lateral surfaces of the light emitting element(s) to expose the upper surface of the light transmissive member. The underfill covers the lateral and lower surfaces of each light emitting element(s).

A display device according to an example embodiment comprises: a light source package comprising light sources disposed on the mounting surface of a printed circuit board and a display panel and configured to irradiate light toward the display panel. The light source package comprises: a light conversion member configured to convert the wavelength of the light emitted from the light sources; a transparent member configured to transmit the light emitted from the light sources, and to support the light conversion member; a first package substantially surrounding the light sources and the transparent member; and a second package covering the outside of the first package, wherein the thermal conductivity of the second package is greater than the thermal conductivity of the first package.

A light emitting device including a substrate, a semiconductor layer disposed on the substrate, first and second electrodes disposed on the semiconductor layer, a first insulation layer covering the first and second electrodes and disposed on the semiconductor layer, a first electrode pad electrically connected to the first electrode through a first opening provided in the first insulation layer, and a second electrode pad electrically connected to the second electrode through a second opening provided in the first insulation layer, in which, in the first opening, a distance between an upper surface of the semiconductor layer and an upper surface of the first electrode pad is longer than a maximum distance between the upper surface and a lower surface of the semiconductor layer.

Disclosed are an LED light and a heat dissipation device thereof. The LED light comprises at least one LED light bead disposed on the heat dissipation device. The heat dissipation device comprises a circuit board having a first metal layer and a second metal layer located on two opposite sides respectively; and a heat sink. The LED light bead is welded to the first metal layer. The second metal layer is welded to the heat sink. The circuit board has heat conductive holes, so that a heat energy generated by the LED light bead can be transferred to the heat sink through the heat conductive holes. Some of the heat conductive holes can be optionally filled with heat conductive material columns, so that the heat energy generated by LED light bead can be conducted to the heat sink through the heat conductive material columns in the heat conductive holes.

A light emitting device includes: an insulating base; a first upper metal part located on an upper surface of the base; a first light emitting element that is disposed on the upper surface of the base with the first upper metal part being interposed between the first light emitting element and the base, and is configured to emit light laterally from a first emission end surface of the first light emitting element; a first reflective member that is disposed on the upper surface of the base without the first upper metal part being interposed between the first reflective member and the base, faces the first light emitting element, and has a first reflective surface configured to reflect the light upward; and one or more lower metal parts located on the lower surface of the base.

A display device includes a first substrate including a first surface and a second surface opposite to the first surface, a first LED chip included in a first pixel, a first FPC, and a first wiring connected to the first LED chip and the first FPC being arranged on the second surface, and a second substrate including a third surface and a fourth surface opposite to the third surface, a second LED chip included in a second pixel, a second FPC, and a second wiring connected to the second LED chip and the second FPC being arranged on the fourth surface. The second surface faces the third surface, the second wiring overlaps the first wiring, and the second LED chip and the first LED chip are arranged side-by-side in a plan view.