A method for forming a light-emitting device, a non-transitory computer storage medium storing instructions for manufacturing and a light-emitting device that improve the reliability of light-emitting diode (LED) systems. The reliability is improved by: attaching a printed circuit board (PCB) to a heat sink, then attaching a top contact LED to the same heat sink, and electrically connecting the PCB to the LED using conductive elements, such as wires that may be bent upwards or downwards. This comprehensive approach not only ensures efficient heat management and electrical connectivity but also protects and isolates the conductive elements, enhancing the durability and performance of the light-emitting device.

In an embodiment a carrier arrangement includes a connection carrier and an insert body, wherein the connection carrier has at least one recess, wherein the insert body has a trench, which is arranged on a cover surface of the insert body, wherein the insert body is arranged in the recess of the connection carrier, wherein the trench does not completely penetrate the insert body in a vertical direction, and wherein the insert body does not extend completely through the connection carrier in the vertical direction.

A light source. The light source includes as components which superimpose one another in this sequence: a first light-emitting semiconductor component; a first carrier element comprising a first carrier surface which faces the first light-emitting semiconductor component and a first cooling surface deliminating at least in part a first fluid path; and a distributor element comprising a first cavity and a further cavity. The first cavity and the further cavity are fluidically connected to one another by the first fluid path. Also disclosed are a printing machine; methods, in particular for producing a printed product, for irradiating a material to be irradiated, and for producing a light source; corresponding method products; an assembly having the light source; and uses of the light source.

A display device according to an embodiment includes a substrate including a plurality of holes including a hole, a metal layer disposed on one side of the substrate, a light-emitting device layer disposed on the metal layer, and a heat radiation layer disposed on another side of the substrate. The heat radiation layer contacts the metal layer in the hole.

In an embodiment a component includes a semiconductor body, a converter layer, a filling layer and an intermediate layer arranged in a vertical direction between the semiconductor body and the converter layer, wherein the semiconductor body has a surface which faces the converter layer, is structured and has vertical recesses, wherein the vertical recesses are filled with a material of the filling layer that has a higher thermal conductivity than silicone, wherein the intermediate layer or the semiconductor body has a higher mechanical hardness than the filling layer, and wherein the structured surface of the semiconductor body has local elevations and local recesses, the structured surface including exclusively the surface of an n-type or a p-type semiconductor layer.

A light emitting diode having an improved heat dissipation effect includes a light source unit emitting a light to a front surface and including a light emitting part, a first electrode pad, and a second electrode pad. The light emitting diode further includes a lead frame unit disposed on a rear surface of the light source unit and including first and second lead terminals respectively connected to the first and second electrode pads. The light emitting diode also includes at least one of the first and second lead terminals includes an upper conductive layer, an intermediate conductive layer, and a lower conductive layer which are disposed on different layers and electrically connected to one another.

A light emitting device including a first light emitting element and an optical member disposed over the first light emitting element. The optical member includes a light transmissive member and a ceramic component. The light transmissive member has a first upper surface, a second upper surface, and a lower surface opposing to the first upper surface and a second upper surface. The ceramic component is disposed on the second upper surface of the light transmissive member. The light transmissive member and the ceramic component each has a portion that overlaps with the first light emitting element when viewed in plan view.

A light-emitting device includes a base member including a first surface, and a first recess on the first surface, a light emitter on a bottom surface of the first recess, and a wavelength converter in the first recess. The wavelength converter covers the light emitter and is in contact with an inner side surface (21c) of the first recess. The wavelength converter includes a plurality of wavelength conversion particles. An aspect ratio obtained by dividing a depth of the first recess by a maximum width of the bottom surface is greater than 1. The wavelength converter includes, on a surface of the wavelength converter opposite to a surface of the wavelength converter facing the bottom surface, a second recess recessed in a depth direction of the first recess.

Exemplary embodiments of the present invention provide a wafer-level light emitting diode (LED) package and a method of fabricating the same. The LED package includes a semiconductor stack including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a plurality of contact holes arranged in the second conductive type semiconductor layer and the active layer, the contact holes exposing the first conductive type semiconductor layer; a first bump arranged on a first side of the semiconductor stack, the first bump being electrically connected to the first conductive type semiconductor layer via the plurality of contact holes; a second bump arranged on the first side of the semiconductor stack, the second bump being electrically connected to the second conductive type semiconductor layer; and a protective insulation layer covering a sidewall of the semiconductor stack.

Provided are a display panel and a display device. The display panel includes a first display region and a second display region. The display panel further includes a pixel circuit, and the pixel circuit is configured to drive a light-emitting element to emit light. The distribution density of the pixel circuit in the first display region is less than the distribution density of the pixel circuit in the second display region. The first display region includes a compensation structure, and the compensation structure includes at least one layer of compensation film. The first display region further includes multiple first light-emitting elements, and the multiple first light-emitting elements each includes an anode. The anode at least partially overlaps the compensation structure in the first direction, and the first direction is perpendicular to a plane in which a substrate is located.