An imaging element of the present disclosure includes a photoelectric conversion section including a first electrode 21, a photoelectric conversion layer 23A, and a second electrode 22 that are stacked, in which a protection layer 23B including an inorganic oxide, and an inorganic oxide semiconductor material layer 23C are formed from side of the photoelectric conversion layer directly below the photoelectric conversion layer 23A.

Reflected light from a back-illuminated photoelectric conversion element is to be reduced. The photoelectric conversion element includes an on-chip lens, a substrate, a front-surface-side reflective film, and a back-surface-side reflective film. The on-chip lens condenses incident light. A photoelectric conversion unit that performs photoelectric conversion on the condensed incident light is disposed in the substrate, and the back surface side of the substrate is irradiated with the condensed incident light. The front-surface-side reflective film is disposed on the front surface side that is a different side from the back surface side of the substrate, and reflects transmitted light that is the incident light having passed through the photoelectric conversion unit. The back-surface-side reflective film is disposed on the back surface side of the substrate, has an opening of substantially the same size as the condensing size of the condensed incident light, and further reflects the reflected transmitted light.

An integrated circuit including a first circuit module and a second circuit module is provided. A layer stack may include one or multiple metal layers with a power segment and a ground segment connected to the first circuit module and the second circuit module, which form a resonant current loop. A pickup loop may be inductively coupled to the resonant current loop to dampen its resonance, thereby making the IC compliant with its EMC requirements or removing functional errors such as problems in the signal or power integrity.

According to one embodiment, a biometric authentication device includes a resin substrate, an optical sensor and an illumination device. The resin substrate has flexibility. The optical sensor is disposed on the resin substrate. The illumination device is disposed on the resin substrate. The optical sensor and the illumination device are disposed on the resin substrate so as to face each other with a detection target interposed therebetween when the biometric authentication device is mounted on the detection target. The optical sensor detects light emitted from the illumination device and transmitted through the detection target.

A solid-state imaging element of the present disclosure a pixel. The pixel includes a charge accumulation unit that accumulates a charge photoelectrically converted by a photoelectric conversion unit, a reset transistor that selectively applies a reset voltage to the charge accumulation unit, an amplification transistor having a gate electrode electrically connected to the charge accumulation unit, and a selection transistor connected in series to the amplification transistor. Additionally, the solid-state imaging element includes a first wiring electrically connecting the charge accumulation unit and the gate electrode of the amplification transistor, a second wiring electrically connected to a common connection node of the amplification transistor and the selection transistor and formed along the first wiring, and a third wiring electrically connecting the amplification transistor and the selection transistor.

The present disclosure provides a display panel, a manufacturing method thereof and a display device. The display panel includes a substrate, a pixel structure layer on the substrate, and a sensor layer on a side of the pixel structure layer away from the substrate. The pixel structure layer includes a plurality of sub-pixels. At least one of the plurality of sub-pixels is configured to emit a first light. The sensor layer includes a photoelectric conversion device. The photoelectric conversion device is configured to receive a second light produced after the first light is reflected by an external object, and convert the second light into an electrical signal.

The present disclosure provides an optical-sensing device, a manufacturing method thereof, and a display panel. The optical-sensing device includes a sensor TFT disposed on a substrate and a switch TFT connected with the sensor TFT. The sensor TFT and the switch TFT include a first active layer and a second active layer, the first active layer comprises a first IGZO layer and a perovskite layer disposed on the first IGZO layer, and the second active layer comprises a second IGZO layer.

An imaging device according to an embodiment of the present disclosure includes: a first semiconductor substrate (100) provided with pixels including a photoelectric conversion element (PD) and floating diffusion (FD) that temporarily holds a charge output from the photoelectric conversion element (PD); and a semiconductor layer (200Y) provided on the first semiconductor substrate (100) via an insulating film (123), the semiconductor layer (200Y) including a readout circuit unit (539) that reads out the charge held in the floating diffusion (FD) and outputs a pixel signal, in which the semiconductor layer (200Y) is formed of an organic semiconductor material.

Example embodiments generally relate to a detector for electromagnetic radiation such as a detector comprising a first, pixelated electrode layer comprising a plurality of electrode pixels, a first layer comprising a plurality of tiles comprising a material configured to absorb and convert the electromagnetic radiation, and a second electrode layer, as well as a method of producing a detector for electromagnetic radiation, comprising providing a first, pixelated electrode layer comprising a plurality of electrode pixels, applying a plurality of tiles comprising a material configured to absorb and convert the electromagnetic radiation on the first, pixelated electrode layer, and applying a second electrode layer on the first layer.

According to one embodiment, a sensor device includes an insulating base including a meandering strip-shaped portion and an island-shaped portion, a first inorganic insulating film on the island-shaped portion, a first wiring layer on the first inorganic insulating film, a second inorganic insulating film on the first wiring layer, a second wiring layer on the second inorganic insulating film, an organic insulating film on the second wiring layer, a barrier film covering the organic insulating film, a sensor element on the barrier film, and a sealing film covering the sensor element. The barrier film covers side surfaces of the organic insulating film, and the sealing film is in contact with the barrier film and the second inorganic insulating film.