A micro LED panel having a micro LED array and the system and method to manufacture the micro LED panel are provided by the present disclosure. The micro LED array includes at least one micro LED structure. The micro LED structure at least includes: a mesa structure and a photonic crystal structure array. The photonic crystal structure array formed through the mesa structure from top to bottom, thereby realizing higher directional light emission, simpler structure and lower cost.

The invention relates to an optoelectronic component comprising an optoelectronic semiconductor chip having an emission surface which is located on an upper side and is designed to emit light into an emission space. The emission surface is laterally delimited by a cover which has: a first portion that annularly delimits the emission surface; and a second portion. The cover is designed in such a way that light incident on the second portion of the cover from outside the optoelectronic component is predominantly reflected. Light emitted from the emission surface towards the cover is predominantly deflected by the cover in such a way that it is not specularly reflected into the emission space.

A display manufacturing apparatus includes a foreign substance removal device and an assembly device. The foreign substance removal device removes foreign substances from a plurality of semiconductor light emitting devices. The assembly device assembles the plurality of removed semiconductor light emitting devices on a display substrate. The foreign substance includes magnetic foreign substance and non-magnetic foreign substance. The foreign substance removal device includes a first module for filtering non-magnetic foreign substance among the foreign substance of the plurality of semiconductor light emitting devices, and a second module for filtering magnetic foreign substance among the foreign substances of the plurality of semiconductor light emitting devices.

A method of manufacturing an optoelectronic device including assemblies of light-emitting diodes (LED) having first and second assemblies and first blocks made of a first photoluminescent material, each covering one of the first assemblies. The method includes the forming of a layer covering the first and second assemblies, the delimiting of first openings in the layer to expose the first assemblies, the filling of the first openings with the first material, and the performing of a chemical-mechanical polishing to delimit the first blocks.

A curable silicone-(meth)acrylate pressure sensitive composition is curable via hydrosilylation reaction to form a silicone-(meth)acrylate pressure sensitive adhesive with an initial adhesion. When the silicone-(meth)acrylate pressure sensitive adhesive is exposed to actinic radiation, the resulting silicone-(meth)acrylate adhesive has a subsequent adhesion, which is higher than the initial adhesion.

Provided is a light-emitting element drive system including a leader light-emitting element drive device configured to be capable of driving light-emitting elements, and to include a DC/DC controller configured to be capable of controlling an output stage that can output an output voltage; and a plurality of follower light-emitting element drive devices configured to be capable of driving the light-emitting elements applied with the output voltage. The follower light-emitting element drive device includes at least one signal output terminal capable of outputting an operation information signal related to driving of the light-emitting elements. A plurality of the signal output terminals are connected to the same node, and the same node is connected to a signal input terminal of the leader light-emitting element drive device.

The assembly apparatus comprises: a main frame; a magnet head arranged on the main frame so that a semiconductor light-emitting element is self-assembled on a panel; and a vibration isolator arranged on the main frame to offset vibration of the magnet head, wherein the magnet head comprises a magnet plate assembly, which includes a magnet applying an attractive force to the semiconductor light-emitting element, and the vibration isolator comprises a weight positioned on the magnet plate assembly and may minimize the transmission, to the main frame, of vibration generated by the magnet head.

Provided is a display panel. The display panel includes: a substrate; a first metal drive layer on a side of the substrate, wherein a plurality of conductive pads are arranged on the first metal drive layer; a light-absorbing layer on a side of the first metal drive layer, wherein an orthographic projection of the light-absorbing layer on the substrate is overlapped with an orthographic projection of the first metal drive layer on the substrate, and a plurality of first vias corresponding to the plurality of conductive pads are defined in the light-absorbing layer; a plurality of light-emitting units on a side of the light-absorbing layer, wherein the plurality of light-emitting units are electrically connected to at least part of the plurality of conductive pads through the plurality of first vias; and an auxiliary light-absorbing layer on a side of the plurality of light-emitting units.

A display element includes a light-emitting-layer array and a conversion-layer array. The conversion-layer array includes a plurality of first conversion layers including a first coupling portion optically coupled to a portion of the plurality of light-emitting layers, a first extraction portion, and a first reflection portion. The first extraction portion and the first reflection portion face each other to alternately reflect the light of a first wavelength received through the first coupling portion and guide the light of the first wavelength in a direction away from the first coupling portion.

Embodiments of the present disclosure provide a quantum dot pattern, a quantum dot light-emitting device, a display apparatus and a manufacturing method. The method includes: forming grooves in one side of an original substrate; forming an isolation layer on the side, with the grooves, of the original substrate; forming quantum dot pattern portions in pattern pits; forming a sacrificial layer on sides, facing away from the isolation layer, of the quantum dot pattern portions; attaching an adhesive layer to a side, facing away from the quantum dot pattern portions, of the sacrificial layer; peeling off the adhesive layer to separate the quantum dot pattern portions and the sacrificial layer from the isolation layer together with the adhesive layer; and enabling a surface, exposing the quantum dot pattern portions, of the laminated structure to be in contact with a target substrate, and removing the sacrificial layer and the adhesive layer.