Patent classifications
H01L27/16
MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SUBSTRATE AND METHOD THEREFOR
A monolithically integrated multi-sensor (MIMS) is disclosed. A MIMs integrated circuit comprises a plurality of sensors. For example, the integrated circuit can comprise three or more sensors where each sensor measures a different parameter. The three or more sensors can share one or more layers to form each sensor structure. In one embodiment, the three or more sensors can comprise MEMs sensor structures. Examples of the sensors that can be formed on a MIMs integrated circuit are an inertial sensor, a pressure sensor, a tactile sensor, a humidity sensor, a temperature sensor, a microphone, a force sensor, a load sensor, a magnetic sensor, a flow sensor, a light sensor, an electric field sensor, an electrical impedance sensor, a galvanic skin response sensor, a chemical sensor, a gas sensor, a liquid sensor, a solids sensor, and a biological sensor.
Thermal pattern sensor with pyroelectric capacitor
Thermal pattern sensor comprising several pixels located on a substrate, each pixel comprising a pyroelectric capacitance, the pyroelectric capacitance comprising, a layer of porous pyroelectric material located between a first electrically conducting electrode and a second electrically conducting electrode, particles made of a first material at least partially filling the pores of the layer of porous pyroelectric material, the first material being electrically insulating and having pyroelectric properties and a layer made of a second material being placed between the layer made of a pyroelectric material and the second electrode, the second material being electrically insulating and having pyroelectric properties.
Thermoelectric conversion material, thermoelectric conversion element, thermoelectric conversion module and optical sensor
A thermoelectric conversion material contains a matrix composed of a semiconductor and nanoparticles disposed in the matrix, and the nanoparticles have a lattice constant distribution Δd/d of 0.0055 or more.
SYSTEMS AND DEVICES POWERED BY AUTONOMOUS ELECTRICAL POWER SOURCES
An electrically-powered device, structure and/or component is provided that includes an attached autonomous electrical power source in a form of a unique, environmentally-friendly structure that is configured to transform thermal energy at any temperature above absolute zero to an electric potential without any external stimulus including physical movement or deformation energy. The autonomous electrical power source component provides a mechanism for generating renewable energy, or a renewable energy supplement, as primary or auxiliary power for the electrically-powered device, structure and/or component. The autonomous electrical power source component is formed of one or more elements, each of which includes a first conductor having a surface with a comparatively low work function, a second conductor having a surface with the comparatively high work function and a dielectric layer on a scale of 200 nm or less interposed between the conductors.
Integrated circuit with thermoelectric power supply
Thermoelectric generator elements and associated circuit elements are simultaneously formed using a common semiconductor device fabrication process to provide an integrated circuit including a dynamically reconfigurable thermoelectric generator array on a common chip or die substrate. A switch logic circuit formed together with the thermoelectric generator elements is configured to control series and parallel connections of the thermoelectric generator elements is the array in response to changes in circuit demand or changes in the available ambient energy source. In an example implementation, the number of generators connected in series may be varied dynamically to provide a stable voltage source, and the number of generators connected in parallel may be varied dynamically to provide a stable current source.
INFRARED SENSOR AND INFRARED SENSOR ARRAY
Each of first and second beams has a connection portion connected to a base substrate and a separated portion away from the base substrate, and is physically joined to an infrared receiver at the separated portion. The infrared receiver is supported by the first and second beams, and includes lower electrode, upper electrode, and a resistance change film. The resistance change film is sandwiched by the lower electrode and upper electrode in a thickness direction, each of the lower and upper electrodes is electrically connected to the resistance change film, the lower and upper electrodes are electrically connected to first wiring and second wiring, respectively, at least one electrode selected from the lower electrode and the upper electrode has a line-and-space structure, and an infrared reflection film is provided at a position on a surface of the base substrate facing the infrared receiver.
Method for generation of electrical power within a three-dimensional integrated structure and corresponding link device
Method for generation of electrical power within a three-dimensional integrated structure comprising several elements electrically intercoupled by a link device, the method comprising the production of a temperature gradient in at least one region of the link device resulting from the operation of at least one of the said elements and the production of electrical power using at least one thermo-electric generator comprising at least one assembly of thermocouples electrically coupled in series and thermally coupled in parallel and contained within the said region subjected to the said temperature gradient.
Metal strip and coil coating process
A metal strip and a coil coating process for multilayer coating of an endless metal strip are disclosed in which a curable polymer primer is applied to a flat side of the metal strip with the aid of a roller application in order to form an electrically insulating primer layer, a curable polymer varnish is applied to this primer layer with the aid of a roller application and cured in order to form an electrically insulating varnish layer, and at least one electric conductor layer is printed at least in some areas between the primer layer and the varnish layer. In order to enable a stable and inexpensive electrical functionalization of a metal strip, it is proposed that an electrically polarizable layer be applied to at least some regions of the electric conductor layer and that the electric conductor layer and electrically polarizable layer be applied by means of a wet-on-wet process.
Power distribution by a working fluid contained in a conduit
A system and method system for conveying power from a heat source is disclosed. The system includes a conduit constructed of a heat conducting material. The conduit defines a passageway containing a primary working fluid, where the conduit is either mounted upon or extends within at least a portion of a barrier. The conduit is configured to conduct thermal energy generated by the heat source and transfer the thermal energy to the primary working fluid flowing within the passageway. The system also includes a thermoelectric generator in thermal communication with the conduit. The thermoelectric generator has a hot side and a cold side. The primary working fluid transfers the thermal energy to the hot side of the thermoelectric generator to heat the hot side of the thermoelectric generator to a temperature greater than the cold side and create electric current.
Selective and Direct Deposition Technique for Streamlined CMOS Processing
Systems, methods, and devices of the various embodiments provide for microfabrication of devices, such as semiconductors, thermoelectric devices, etc. Various embodiments may include a method for fabricating a device, such as a semiconductor (e.g., a silicon (Si)-based complementary metal-oxide-semiconductor (CMOS), etc.), thermoelectric device, etc., using a mask. In some embodiments, the mask may be configured to allow molecules in a deposition plume to pass through one or more holes in the mask. In some embodiments, molecules in a deposition plume may pass around the mask. Various embodiments may provide thermoelectric devices having metallic junctions. Various embodiments may provide thermoelectric devices having metallic junctions rather than junctions formed from semiconductors.