A display substrate and a display device are provided. The display substrate includes a base substrate, multiple sub-pixels, multiple data lines, a test circuit, multiple data leads, at least one test pad, and at least one first test signal line. The multiple data lines are electrically connected to the multiple sub-pixels, and configured to provide data signals to the multiple sub-pixels. The multiple data leads are electrically connected to the multiple data lines and the test circuit. At least one test pad is located on at least one side of the test circuit. The at least one first test signal line is electrically connected to at least one test pad and the test circuit, and includes at least two conductive layers connected in parallel and electrically connected to each other.

An electrostatic discharge (ESD) protection apparatus and method for fabricating the same are disclosed herein. In some embodiments, the ESD protection apparatus, comprises: an internal circuit patterned in a device wafer and electrically coupled between a first node and a second node, an array of electrostatic discharge (ESD) circuits patterned in a carrier wafer, where the ESD circuits are electrically coupled between a first node and a second node and configured to protect the internal circuit from transient ESD events, and where the device wafer is bonded to the carrier wafer.

In an embodiment a silicon substrate includes integrated circuits located on a first surface, a second surface opposite to the first surface, a first via and an ESD protection element, wherein the ESD protection element is fully integrated into the silicon substrate, wherein the ESD protection element is spatially distant from the first via, wherein the ESD protection element is connected to the via by a first rewiring, and wherein the ESD protection element comprises a suppressor diode, a transistor or a thyristor.

A liquid crystal display device and method of manufacturing a liquid crystal display device are provided. The liquid crystal display device includes: a thin film transistor substrate, a color filter substrate on the thin film transistor substrate, a transparent conductive plate on the color filter substrate, a pad portion on the thin film transistor substrate, a static-electricity transmission electrode on a region of the pad portion adjacent to the color filter substrate, a conductive member configured to electrically connect the transparent conductive plate and the static-electricity transmission electrode to each other, and a plurality of lattice patterns on the static-electricity transmission electrode.

Flexible, space-efficient I/O architectures for integrated circuits simplify circuit design and shorten design times. In one aspect, cells for power supply pads are eliminated, in part by locating ESD circuitry for these pads underneath the pads themselves, leaving only signal I/O buffers. Pads coupled to the signal I/O buffers may be defined as either signal I/O pads or power supply pads in accordance with customization circuitry. Customization circuitry also provides for flexible bank architectures, where signal I/O buffers within a bank share power supply requirements that may be different from another bank. The number of banks and the number of signal I/O buffers belonging to each bank is flexibly defined. In other aspects, ESD circuitry is provided at corners of the IC layout and optionally within selected I/O slots. Decap circuitry is provided at an outer edge of the IC layout and is scalable in order to meet different requirements.

A semiconductor device includes a plurality of sets of external drive terminals in a marginal region along one long side of a rectangular semiconductor substrate, a plurality of sets of ESD protection circuits arranged in the marginal region and coupled to corresponding sets of the drive terminals, and a plurality of output circuits coupled to corresponding sets of the drive terminals. Each set of drive terminals in a plurality of n columns along a Y direction is laid out in a staggered arrangement with drive terminals in adjacent columns shifted relative to each other. Each output circuit includes n output units associated with n drive terminals of each set and arranged in one column in an X direction. By the arrangement, the drive terminals can be arranged at a narrower pitch, and the total width for n output units can be compacted into that of one output circuit.

An area of a region arranged on one side out of a display region in a direction in which scanning signal lines extend is reduced. A display apparatus includes: a partial circuit; a plurality of scanning signal lines; and a plurality of scanning signal connection wirings for connecting the partial circuit and each of the plurality of scanning signal lines. Each of the plurality of scanning signal lines extends in an X-axis direction, and is arranged with a pitch in a Y-axis direction. A plurality of ends respectively included in the plurality of scanning signal connection wirings are connected to the partial circuit, and are arranged in the Y-axis direction. A distance in the Y-axis direction between the respective centers of the two ends adjacent to each other is narrower than the pitch.

Provided is an active matrix substrate that can protected from static electricity, with the frame region being narrowed. An active matrix substrate (20a) includes a plurality of first lines (GL), a plurality of second lines (SL), and a protection part (50). The first lines are formed in a display region (30). The second lines are formed in the display region, and intersect with the first lines. The protection part protects the active matrix substrate from static electricity. The protection part includes a plurality of first protection circuits (50A), and a conductive unit (50B). The first protection circuits are connected to each of the first lines in the display region. The conductive unit is connected to each of the first protection circuits in the display region. Each of the first protection circuits, according to a potential of the first line to which the first protection circuit is connected, allows the first line and the conductive unit to be conductive with each other.

An integrated circuit includes a signal transmission block suitable for transmitting signals between a pad and an internal circuit, an electrostatic discharge block suitable for protecting the internal circuit from an electrical shock transmitted through the signal transmission block, and a control block suitable for controlling decoupling/coupling operations of the signal transmission block and the electrostatic discharge block.

Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die.