A semiconductor device has a semiconductor die and an encapsulant deposited over the semiconductor die. A conductive layer can be formed over the encapsulant and the semiconductor die. A transmissive layer can be formed over the semiconductor die. An interconnect structure can be formed through the encapsulant and electrically connected to the conductive layer, whereby the interconnect structure is formed off to only one side of the semiconductor die.

A patterned stack of a first silicon-germanium alloy nanowire, a second silicon-germanium alloy nanowire, and a silicon-containing nanowire is formed on a substrate. After formation of a first dielectric isolation layer around the patterned stack, a disposable gate structure can be formed. End portions of the second silicon-germanium alloy nanowire are removed to form first cavities underlying end portions of the silicon-containing nanowire. Dielectric nanowires are formed in cavities concurrently with formation of a gate spacer. After recessing the first dielectric isolation layer, a second cavity is formed by removing the first silicon-germanium alloy nanowire. The second cavity is filled with a second dielectric isolation layer, and raised active regions can be formed by a selective epitaxy process. After formation of a planarization dielectric layer, the disposable gate structure and the remaining portion of the second silicon-germanium alloy nanowire with a replacement gate structure.

A method for manufacturing a semiconductor device includes providing a substrate containing a front-end device that includes a first gate in a first-type transistor region and a second gate in a second-type transistor region, forming an interlayer dielectric layer on the semiconductor substrate, and planarizing the interlayer dielectric layer to expose the surface of the first and second gates. The method also includes forming a hard mask layer on the second gate, removing the first gate using the hard mask layer as a mask to form a trench, forming sequentially a work function metal layer and a metal gate layer in the trench, and removing a portion of the first work function metal layer and a portion of the metal gate layer that are higher than the interlayer dielectric layer to form a metal gate.

A method of fabricating a replacement gate stack for a semiconductor device includes the following steps after removal of a dummy gate: growing a high-k dielectric layer over the area vacated by the dummy gate; depositing a thin metal layer over the high-k dielectric layer; depositing a sacrificial layer over the thin metal layer; performing a first rapid thermal anneal; removing the sacrificial layer; and depositing a metal layer of low resistivity metal for gap fill.

The present disclosure provides a HEMT device and a manufacturing method thereof. The HEMT device includes: a substrate, a heterojunction structure, a P-type semiconductor layer, a first stress layer and/or a second stress layer, a gate, a source and a drain, where the first stress layer is located on the opposite sidewalls of the P-type semiconductor layer, and is configured to apply compressive stress to the P-type semiconductor layer in the direction parallel to the plane where the substrate is located, and to apply tensile stress to the P-type semiconductor layer in the direction perpendicular to the plane where the substrate is located. The second stress layer is located on the top wall of the P-type semiconductor layer, and is configured to apply compressive stress to the P-type semiconductor layer in the direction parallel to the plane where the substrate is located.

An IGBT device includes an p-type collector region, an n-type semiconductor layer, several p-type body regions located in the n-type semiconductor layer, a gate trench located in the n-type semiconductor layer and between adjacent p-type body regions, a gate trench located in the n-type semiconductor layer and between adjacent p-type body regions, a shielded gate located in a lower part of the gate trench, and a gate located in an upper part of the gate trench. The gate, the shielded gate, and the n-type semiconductor layer are insulated and isolated from each other. Among the several p-type body regions, at least one p-type body region has a first doping concentration and is defined as a first p-type body region, and at least one p-type body region has a second doping concentration and is defined as a second p-type body region.

Provided is a method for manufacturing a power semiconductor device, which includes forming an active layer including a first active layer and a second active layer, which are doped with impurities different from each other, on an SiC substrate. The forming of the active layer includes preparing the SiC substrate comprising a first area and a second area, sequentially injecting a source gas mixed with a first doping gas, a purge gas, a reactant gas, and a purge gas onto the first area of the SiC substrate to form the first active layer, and sequentially injecting a source gas mixed with a second doping gas, a purge gas, a reactant gas, and a purge gas onto the second area of the SiC substrate to form the second active layer. The second doping gas and the first doping gas include elements different from each other, respectively. Thus, in accordance with exemplary embodiments, the active layer may be formed at a low temperature. Thus, the substrate or the thin film formed on the substrate may be prevented from being damaged by the high-temperature heat. In addition, the power or time required for heating the substrate to form the active layer may be saved, and the overall process time may be shortened. In addition, the active layer may be crystallized to be formed. That is, the crystallized active layer may be formed while forming the active layer at the low temperature.

A tunneling field effect transistor having a buried drain structure is provided. The tunneling field effect transistor comprises a semiconductor pattern disposed on a substrate and including a thin part at one end, a thick part at the other end, and a step between the thin part and the thick part. A drain electrode is disposed on the thin part, a source electrode is disposed on the thick part, and a gate electrode is disposed on the thick part between the drain electrode and the source electrode. A gate insulating layer is disposed between the semiconductor pattern and the gate electrode and between a sidewall of the step of the semiconductor pattern and the drain electrode. The semiconductor pattern has a drain region of a first conductivity type induced by generation of a charge plasma of the first conductivity type in an area adjacent to the drain electrode, and a source region of a second conductivity type induced by generation of a charge plasma of the second conductivity type in an area adjacent to the source electrode, and a channel region between the source region and the drain region. A thickness of the drain electrode is lower than a height of the step of the semiconductor pattern.

Provided is a method for operating a program of a three-dimensional flash memory. A program voltage has a value obtained by adding a step voltage to a previous program voltage applied in a previous program operation, and the step voltage is increased as a program operation is repeated. Also, the program operation is performed on a target memory cell by applying a negative voltage to a bit line of a selected cell string and applying the program voltage to a selected word line. In addition, tunneling oxide-charge trap nitride-blocking oxide (ONO) formed surrounding a vertical channel pattern is included, and at least one of a tunneling oxide layer or a blocking oxide layer of the ONO is formed of a ferroelectric material.

A method of fabricating semiconductor fins, including, patterning a film stack to produce one or more sacrificial mandrels having sidewalls, exposing the sidewall on one side of the one or more sacrificial mandrels to an ion beam to make the exposed sidewall more susceptible to oxidation, oxidizing the opposite sidewalls of the one or more sacrificial mandrels to form a plurality of oxide pillars, removing the one or more sacrificial mandrels, forming spacers on opposite sides of each of the plurality of oxide pillars to produce a spacer pattern, removing the plurality of oxide pillars, and transferring the spacer pattern to the substrate to produce a plurality of fins.