An ultrasonic sensing device includes a circuit board, a piezoelectric material layer on the circuit board, a first electrode, and a second electrode on the circuit board. The circuit board is configured to dispose a circuit. The first electrode is formed on a surface of the piezoelectric material layer away from the circuit board. The piezoelectric material layer is between the first electrode and the second electrode; the first electrode has a thickness in a range from 0.005 m to 1 m.

Microelectromechanical System (MEMS) devices and related fabrication methods. A piezoelectric stack is formed on a substrate and is separated from the substrate by a dielectric layer. The piezoelectric stack is formed that includes first and second piezoelectric layers with a first electrode below the first piezoelectric layer, as well as a contact pad and a second electrode between the first and second piezoelectric layers. A first contact is formed that extends through the piezoelectric layers and contact pad to the first electrode. A second contact is formed that extends through the second piezoelectric layer to the second electrode. The contact pad prevents an interface to form between the first and second piezoelectric layers in the contact opening, thus preventing corrosion of the piezoelectric layers during contact formation process.

A grid of phased array transducers includes a piezoelectric layer and a plurality of ground contact traces. The piezoelectric layer includes a first side and a second side. The plurality of ground contact traces is disposed on the first side of the piezoelectric layer along an elevational direction, where each ground contact trace of the plurality of ground contact traces extends along an azimuthal direction. Further, each phased array transducer of the grid of phased array transducers is disposed between an adjacently disposed pair of ground contact traces of the plurality of ground contact traces. Moreover, each phased array transducer includes at least a portion of at least one ground contact trace of a corresponding pair of ground contact traces, and where each phased array transducer includes a plurality of transducer elements.

Vertical packaging configurations for ultrasound chips are described. Vertical packaging may involve use of integrated interconnects other than wires for wire bonding. Examples of such integrated interconnects include edge-contact vias, through silicon vias and conductive pillars. Edge-contact vias are vias defined in a trench formed in the ultrasound chip. Multiple vias may be provided for each trench, thus increasing the density of vias. Such vias enable electric access to the ultrasound transducers. Through silicon vias are formed through the silicon handle and provide access from the bottom surface of the ultrasound chip. Conductive pillars, including copper pillars, are disposed around the perimeter of an ultrasound chip and provide access to the ultrasound transducers from the top surface of the chip. Use of these types of packaging techniques can enable a substantial reduction in the dimensions of an ultrasound device.

A piezoelectric device and method of manufacturing the same and an inkjet head are described. In one embodiment, the inkjet print head comprises a plurality of jets, wherein each of the plurality of jets comprises a nozzle, a pressure chamber connected with the nozzle, a piezoelectric body coupled to the pressure chamber, and an electrode coupled to the piezoelectric body to cause displacement of the piezoelectric body to apply pressure to the pressure chamber in response to a voltage applied to the electrode; and wherein electrodes of two or more of the plurality of jets have different sizes to cause their associated piezoelectric bodies to have a uniform displacement amount when the voltage is applied to the electrodes.

Formation of a boron nitride nanotube nanocomposite film by combining a boron nitride nanotube solution with a matrix such as a polymer or a ceramic to form a boron nitride nanotube/polyimide mixture and synthesizing a boron nitride nanotube/polyimide nanocomposite film as an electroactive layer.

A multilayer ultrasonic transducer of an embodiment includes: a plurality of stacked oscillators; external electrodes disposed on outer exposed surfaces of two oscillators disposed in the outermost layers out of the plurality of oscillators; and a plurality of internal electrodes each disposed between two of the plurality of oscillators. There are provided electrode regions in which the plurality of internal electrodes are arranged such that the number of layers of the internal electrodes in a direction in which the oscillators are stacked gradiently increases from an inner region toward an outer peripheral region of the plurality of oscillators, and ultrasonic waves emitted from the plurality of oscillators are focused toward at least the inner region.

In an electronic component, a first outer electrode includes a first conductive layer provided on a first end surface. A second outer electrode includes a second conductive layer provided on a second end surface. A first inner electrode passes through the first conductive layer. A second inner electrode passes through the second conductive layer.

Devices and methods described herein provide electrode pair access from a single side of a device by using one or more via holes through the device. The via hole can pass through or near the center of the device. By creating a conductive path through the via hole of the device, devices and methods of the present disclosure advantageously provide access to a pair of electrodes, each of which contacts a different side of a device layer, on a single side of the device while enabling a greater active device area than is possible using conventional techniques. In addition, the central location of the via hole provides favorable mechanical properties by avoiding radial constriction of the device layers in applications such as piezoelectric devices.

A method for producing a liquid discharge apparatus includes: forming a first electrode on a film formed on a substrate, forming a piezoelectric part on the first electrode, forming a second electrode on the piezoelectric part, forming a metal part on the film by a metal material except for gold, and forming a gold trace on the metal part to connect to the first electrode.