The present disclosure discloses a fingerprint sensor and a fingerprint identification module. The fingerprint sensor comprises a substrate and an ultrasonic transducer. The upper surface of the substrate is provided with a plurality of first connecting electrodes, wherein the lower surface of the substrate is provided with a plurality of second connecting electrodes, and wherein the first connecting electrodes are configured to electrically connect with the second electrodes. The ultrasonic transducer is provided on the upper surface, wherein the ultrasonic transducer comprises a plurality of third connecting electrodes, and wherein the third connecting electrodes are configured to electrically connect with the first connecting electrodes.

A multilayer component is disclosed. In an embodiment, a multilayer component includes a fully active stack comprising a plurality of dielectric layers, internal electrodes and two external electrodes arranged on opposite sides of the stack, wherein at least one portion of the internal electrode layers are coated.

A manufacturing method of an electronic component includes forming a body including first and second internal electrodes respectively exposed from first and second end surfaces of the body and dielectric layers disposed between the first and second internal electrodes; applying, on the first and second end surfaces of the body, a paste containing a metal powder and first glass; and sintering the body and the paste to convert the paste to first and second external electrodes including crystalline metal particles having a polyhedral shape and second glass and respectively connected to the first internal electrodes and the second internal electrodes

A multilayer component is disclosed. In an embodiment, a multilayer component includes a main body having a plurality of alternately arranged ceramic layers and inner electrodes and at least two outer electrodes for electrically contacting the inner electrodes, wherein the at least two outer electrodes have a different polarity, and wherein the outer electrodes have a different geometric shape and/or a different size and/or a different arrangement at an outer surface of the main body for identifying the different polarity.

A ceramic electronic component includes a rectangular or substantially rectangular parallelepiped-shaped stack in which a ceramic layer and an internal electrode are alternately stacked and an external electrode provided on a portion of a surface of the stack and electrically connected to the internal electrode. The external electrode includes an inner external electrode covering a portion of the surface of the stack and including a mixture of a resin component and a metal component and an outer external electrode covering the inner external electrode and including a metal component. A volume occupied by the resin component in the inner external electrode is within a prescribed range.

A method of producing a fully active multilayer element including producing a fully active stack, and optionally sintering of the fully active stack or a green precursor thereof; applying outer electrodes onto sides A and C of the fully active stack and contacting of the uncoated inner electrodes so that the two outer electrodes electrically connect to the uncoated inner electrode layers.

An electronic device includes a piezoelectric module, a sensing module and a buffer element. The piezoelectric module includes a substrate and a piezoelectric element. The substrate defines an opening penetrating the substrate. The piezoelectric element is disposed on the substrate and across the opening of the substrate. The sensing module is disposed over the piezoelectric module. The buffer element is disposed between the piezoelectric module and the sensing module.

There is provided a method of manufacturing a piezoelectric vibrator element capable of preventing the piezoelectric vibrator element from being damaged when segmentallizing the piezoelectric vibrator element. The method of manufacturing a piezoelectric vibrator element includes the steps of providing the wafer with the piezoelectric plate and a frame part adapted to support the piezoelectric plate via a connection part, providing a pair of excitation electrodes to the piezoelectric plate, and forming a pair of extending electrodes extending from the piezoelectric plate to the frame part through the connection part and electrically connected respectively to the pair of excitation electrodes, and segmentallizing the piezoelectric plate by cutting the connection part. In the step of providing the pair of excitation electrodes, the pair of extending electrodes are formed on a side surface of the connection part.

A multi-layer piezoelectric element includes: a stacked body in which piezoelectric layers and internal electrode layers are laminated; a conductor layer disposed on a side face of the stacked body; a conductive joining material layer disposed on a surface of the conductor layer; and an external electrode joined to the conductor layer via the conductive joining material layer, the conductive joining material layer comprising solder and a conductive adhesive, the solder constituting an end of the conductive joining material layer which end confronts an end of the external electrode to be connected to an external circuit. There is provided a multi-layer piezoelectric element which suppresses separation of an end on an input/output side of the external electrode and is driven stably for a long period of time, an injection device and a fuel injection system which are provided with the multi-layer piezoelectric element.

A film transducer has a holding part and an electroactive multilayer composite structure including at least two deformable carriers which are each coated on at least one side with a planar electrode. The multilayer composite structure has an elongated basic shape and being clamped on its shorter sides in a fixing section in the holding part while its longer sides are free, the electrodes of the multilayer composite structure being alternately connected at the ends clamped in the holding part to a contact element which is arranged in the fixing section.