A semiconductor device includes a first device configured to receive a first level voltage through a first terminal, and output a first output voltage through a second terminal when a gate voltage is applied through a gate terminal; a boost device configured to receive a second level voltage through a first terminal, and output a second output voltage having a higher value than the first output voltage when the first output voltage is applied as a gate voltage through a gate terminal; and a second device configured to receive a third level voltage through a first terminal, and output a third output voltage when the second output voltage is applied as a gate voltage through a gate terminal, wherein the second output voltage is greater than a threshold voltage of the second device.

An integrated circuit is formed on a substrate containing a semiconductor material having a first conductivity type. A deep well having a second, opposite, conductivity type is formed in the semiconductor material of the first conductivity type. A deep isolation trench is formed in the substrate through the deep well so as separate an unused portion of the deep well from a functional portion of the deep well. The functional portion of the deep well contains an active circuit element of the integrated circuit. The separated portion of the deep well does not contain an active circuit element. A contact region having the second conductivity type and a higher average doping density than the deep well is formed in the separated portion of the deep well. The contact region is connected to a voltage terminal of the integrated circuit.

In some embodiments, a semiconductor device includes a first transistor and a second transistor. The first transistor includes a first source region in a first bulk region having a first concentration, and a first gate. The second transistor includes a second source region in a second bulk region having a second concentration higher than the first concentration. The second source region is connected with the first source region and the first gate.

Object is to provide a semiconductor device having improved reliability or performance. A high-breakdown-voltage n type transistor has source and drain regions having first, second, and third semiconductor regions, which are formed by ion implantation of a first impurity from the outside of a high-breakdown-voltage gate electrode, a second impurity from the outside of the high-breakdown-voltage gate electrode and a first sidewall insulating film, and a third impurity from the outside of the high-breakdown-voltage gate electrode and the first and second sidewall insulating films, respectively. The first and second impurities are implanted from a direction tilted by 45 relative to the main surface of the semiconductor substrate and the third impurity from a direction perpendicular thereto. The impurity concentration of the first semiconductor region is lower than that of the second one and the ion implantation energy of the first impurity is greater than that of the second impurity.

Provided is a semiconductor and method of manufacturing the same, and a method of forming even doping concentration of respective semiconductor device when manufacturing multiple semiconductor devices. When a concentration balance is disrupted due to an increase in doping region size, doping concentration is still controllable in example by using ion injected blocking pattern. Thus, the examples relate to a semiconductor and manufacture device with even doping, and high breakdown voltage obtainable as a result of such doping.

A method for doping punch through stoppers (PTSs) includes forming fins in a monocrystalline substrate, forming a dielectric layer at a base portion between the fins and forming spacers on sidewalls of the fins down to a top portion of the dielectric layer. The dielectric layer is recessed to form gaps between the top portion of the dielectric layer and the spacer to expose the fins in the gaps. The fins are doped through the gaps to form PTSs in the fins.

The present invention discloses a dual-well complementary metal oxide semiconductor (CMOS) device and a manufacturing method thereof. The dual-well CMOS device includes a PMOS device region and an NMOS device region. Each of the PMOS and NMOS device regions includes a dual-well (which includes a P-well and an N-well), and each of the PMOS and NMOS device regions includes P-type and N-type lightly doped diffusions (PLDD and NLDD) regions respectively in different wells in the dual well. A separation region is located between the PMOS device region and the NMOS device region, for separating the PMOS device region and the NMOS device region. The depth of the separation region is not less than the depth of any of the P-wells and the N-wells in the PMOS device region and the NMOS device region.

First and second transistors with different electrical characteristics are supported by a substrate having a first-type dopant. The first transistor includes a well region within the substrate having the first-type dopant, a first body region within the well region having a second-type dopant and a first source region within the first body region and laterally offset from the well region by a first channel. The second transistor includes a second body region within the semiconductor substrate layer having the second-type dopant and a second source region within the second body region and laterally offset from material of the substrate by a second channel having a length greater than the length of the first channel. A gate region extends over portions of the first and second body regions for the first and second channels, respectively.

A semiconductor device includes an epitaxial layer disposed on a substrate, which both have a first conductivity type. A first well region having a second conductivity type is disposed in the epitaxial layer. A gate is disposed on the first well region. A source contact region and a drain contact region both having the first conductivity type are disposed in the first well region. A second well region having the first conductivity type is disposed in the epitaxial layer, laterally abuts the first well region and is in contact with a portion of the substrate. The second well region and the portion of the substrate constitute a resistor that is electrically coupled to a ground terminal. A heavily doped region having the first conductivity type is disposed in the second well region and electrically connected to the source contact region.

A method includes: etching a trench on a surface of a substrate; filling the trench with a dielectric material to form a first isolation region; depositing a patterned mask layer on the substrate, the patterned mask layer comprising an opening exposing the substrate; implanting oxygen into the substrate through the opening to form an implant region; generating a second isolation region from the implant region; and forming a transistor on the substrate. The transistor includes a channel laterally surrounding the second isolation region.