A composition and method for formation of ohmic contacts on a semiconductor structure are provided. The composition includes a TiAl.sub.xN.sub.y material at least partially contiguous with the semiconductor structure. The TiAl.sub.xN.sub.y material can be TiAl.sub.3. The composition can include an aluminum material, the aluminum material being contiguous to at least part of the TiAl.sub.xN.sub.y material, such that the TiAl.sub.xN.sub.y material is between the aluminum material and the semiconductor structure. The method includes annealing the composition to form an ohmic contact on the semiconductor structure.

A drive circuit substrate, LED display panel and method of forming the same and display device are provided, in field of display technologies. The drive circuit substrate includes a base substrate and drive electrodes arranged in an array on a surface of the base substrate, where at least one conductive structure is arranged on a surface of each drive electrode away from the base substrate, the conductive structure is electrically connected to corresponding drive electrode. The driving electrodes include first and second driving electrodes, horizontal height of first driving electrode is greater than horizontal height of second driving electrode. The conductive structure includes first conductive structure on a surface of the first driving electrode away from the base substrate and second conductive structure on a surface of the second driving electrode away from the base substrate, height of second conductive structure is greater than height of first conductive structure.

A method for producing a GaN-based crystal includes forming a Zinc-blend type BP crystal layer on a Si substrate; forming an In-containing layer, on the BP crystal layer, with such a thickness as to keep the Zinc-blend type structure; and forming a Zinc-blend type GaN-based crystal layer on the In-containing layer. The In-containing layer is a metallic In layer having a thickness of 4 atom layers or less, an InGaN layer having a thickness of 2 nm or less, an InAl mixture layer having a thickness of 4 atom layers or less and containing Al at 10% or less, or an AlInGaN layer having a thickness of 2 nm or less and containing Al at 10% or less.

A method of manufacturing a semiconductor substrate may include forming a first semiconductor layer on a growth substrate, forming a second semiconductor layer on the first semiconductor layer, forming a plurality of voids in the first semiconductor layer by removing portions of the first semiconductor layer that are exposed by a plurality of trenches in the second semiconductor layer, forming a third semiconductor layer on the second semiconductor layer and covering the plurality of trenches, and separating the second and third semiconductor layers from the growth substrate. on the first semiconductor layer. The third semiconductor layer are grown from the second semiconductor layer and extend above the second semiconductor layer.

There is herein described light generating electronic components with improved light extraction and a method of manufacturing said electronic components. More particularly, there is described LEDs having improved light extraction and a method of manufacturing said LEDs.

A semiconductor light-emitting device according to an embodiment includes a light-emitting layer, a semiconductor substrate, and a multilayer film part. The semiconductor substrate includes gallium arsenide. The gallium arsenide is a cubic crystal. The semiconductor substrate includes a substrate lower surface and a substrate upper surface. The substrate upper surface is tilted with respect to a (100) plane of the cubic crystal. The multilayer film part is positioned between the substrate upper surface and the light-emitting layer. The multilayer film part includes a first layer and a second layer. The first layer includes a first surface. The second layer is positioned between the first surface and the light-emitting layer. The second layer contacts the first surface. The second layer includes a second surface. An unevenness of the second surface is greater than an unevenness of the first surface.

Improved quantum efficiency of multiple quantum wells. In accordance with an embodiment of the present invention, an article of manufacture includes a p side for supplying holes and an n side for supplying electrons. The article of manufacture also includes a plurality of quantum well periods between the p side and the n side, each of the quantum well periods includes a quantum well layer and a barrier layer, with each of the barrier layers having a barrier height. The plurality of quantum well periods include different barrier heights.

The invention provides semiconductor materials including a gallium nitride material layer formed on a silicon substrate and methods to form the semiconductor materials. The semiconductor materials include a transition layer formed between the silicon substrate and the gallium nitride material layer. The transition layer is compositionally-graded to lower stresses in the gallium nitride material layer which can result from differences in thermal expansion rates between the gallium nitride material and the substrate. The lowering of stresses in the gallium nitride material layer reduces the tendency of cracks to form. Thus, the invention enables the production of semiconductor materials including gallium nitride material layers having few or no cracks. The semiconductor materials may be used in a number of microelectronic and optical applications.

The optoelectronic device (1) comprises a substrate (2), a light-emitting member (3) comprising an elongate element (4) extending in a direction forming an angle with the substrate (2). An intermediate element (5) is interposed between the substrate (2) and a longitudinal end of the elongate element (4) closest to the substrate (2). Furthermore, the substrate (2) is transparent to said light and the intermediate element (5), transparent to said light, comprises at least one nitride of a transition metal, and has a thickness less than or equal to 9 nm.

The present invention provides a Group III nitride semiconductor light-emitting device exhibiting improved emission performance. In a MQW structure light-emitting layer in which a plurality of layer units is repeatedly deposited, each layer unit comprising an InGaN well layer, a GaN protective layer, and an AlGaN barrier layer sequentially deposited, the protective layer is formed as follows. The protective layer is grown at the same temperature as employed for the well layer. The growth rate of the protective layer is larger than 0.5 times and not larger than 1.1 times the growth rate of the well layer. The protective layer is formed so as to have a thickness of 5 to 8 at the start of growth of the barrier layer being formed thereafter.