The disclosure provides a fingerprint recognition module and a display apparatus, including: a base substrate; a photosensitive device layer above the base substrate and including a plurality of photosensitive devices; a bias metal layer and a noise reduction metal layer sequentially on the side of the photosensitive device layer distant from the base substrate; a light guide film layer including at least two light shielding layers arranged in a stacked manner, and a microlens layer on the side of the light guiding film layer facing away from the photosensitive device layer and including a plurality of microlenses. Each of the light shielding layers is provided with light transmitting holes arranged in an array, the light transmitting holes in all the light shielding layers are provided in a one-to-one correspondence manner. An orthogonal projection of the microlens covers the orthogonal projections of the light transmitting holes on the base substrate.

Provided is a semiconductor device capable of quickly and accurately detecting positional shift of a first semiconductor structure and a second semiconductor structure while suppressing an increase in size of the first semiconductor structure and/or the second semiconductor structure. A semiconductor device according to the present technology is a semiconductor device having a stacked structure in which a first semiconductor structure and a second semiconductor structures are stacked and bonded, in which the first semiconductor structure includes a first connection terminal exposed to a first bonding surface that is a bonding surface to the second semiconductor structure, the second semiconductor structure includes a second connection terminal exposed to a second bonding surface that is a bonding surface to the first semiconductor structure, and bonded to the first connection terminal, and the stacked structure includes at least one of a first electrode provided in the first semiconductor structure, and capable of changing an electrical characteristic with respect to the second semiconductor structure according to a positional shift between the first connection terminal and the second connection terminal, or a second electrode provided in the second semiconductor structure, and capable of changing an electrical characteristic with respect to the first semiconductor structure according to the positional shift.

A display device includes a substrate; an emission layer disposed on the substrate, and including emission areas and a pixel defining layer disposed between the emission areas and including a light blocking material; an encapsulation layer disposed on the emission layer, and including a first inorganic encapsulation film, an organic encapsulation film on the first inorganic encapsulation film, and a second inorganic encapsulation film on the organic encapsulation film; a dam surrounding the organic encapsulation film, comprising an organic material, and including a plurality of sub-dams; and a bank disposed to surround at least a portion of the dam, and including a first bank layer, a second bank layer on the first bank layer, a third bank layer on the second bank layer, and a fourth bank layer on the third bank layer, wherein the third bank layer includes the light blocking material.

A display device which exhibits light with high color purity is provided. A display device with low power consumption is provided. An embodiment is a display device which includes a first pixel electrode, a second pixel electrode, a light-emitting layer, a common electrode, a first protective layer, and a semi-transmissive layer. The light-emitting layer includes a first region positioned over the first pixel electrode and a second region positioned over the second pixel electrode. The common electrode is positioned over the light-emitting layer. The first protective layer is positioned over the common electrode. The semi-transmissive layer is positioned over the first protective layer. Reflectivity with respect to visible light of the semi-transmissive layer is higher than reflectivity with respect to visible light of the common electrode. The semi-transmissive layer does not overlap with the first region and overlaps with the second region. For example, the semi-transmissive layer may include an opening in a position overlapping with the first region.

A display device includes: a substrate including a display area and a non-display area; a circuit portion including a first circuit portion and a second circuit portion on the non-display area; a valley portion separating the first circuit portion and the second circuit portion from each other; and a thin film encapsulation layer sealing the display area, the thin film encapsulation layer extending from the display area to the valley portion, and the first circuit portion is between the valley portion and the display area, the second circuit portion is at an outside of the valley portion, an internal layer on the first circuit portion includes a plurality of island portions that are apart from one another in a first direction and a second direction crossing the first direction, and an external layer on the second circuit portion includes at least one groove extending in the first direction.

According to an aspect, a detection device includes: an insulating substrate; a plurality of photoelectric conversion elements that are arranged in a detection area of the insulating substrate, and each of which is configured to receive light and output a signal corresponding to the received light; a first switching element that is provided for each photoelectric conversion element and includes a first semiconductor, a source electrode, and a drain electrode; and an inorganic insulating layer provided between the photoelectric conversion element and the first switching element in a normal direction of the insulating substrate.

Am array-type image detection device including two rows of imaging arrays arranged at intervals along a first direction, each row of the imaging array includes a plurality of imaging modules arranged at intervals along a second direction, each imaging module includes a magnifying lens and an imaging chip arranged in sequence along its optical axis; the image to be detected in a detection area of each imaging module is imaged in an imaging area of each imaging module in a magnified way by each imaging module and is acquired by the imaging chip in the imaging area of each imaging module; and except for the detection areas at the front and back sides in the second direction, each detection area has overlapping portions with other detection areas at two ends along the second direction.

A display device may include a sensor layer, a substrate, a pixel layer, and a black matrix. The sensor layer may include photo sensors. The substrate may be positioned on the sensor layer. The pixel layer may be positioned on the substrate and may include pixels. The substrate may be positioned between the sensor layer and the pixel layer. The pixels may include pixel electrodes. The black matrix may be positioned on the pixel layer, may include first-set openings respectively overlapping with the pixel electrodes, and may include second-set openings not overlapping with any pixel electrodes of the display device in a direction perpendicular to the substrate. The pixel layer may be positioned between the substrate and the black matrix.

A fingerprint sensing device (and associated method of manufacturing) comprises a sensing chip arranged on a substrate with readout circuitry. The sensing chip comprising a plurality of sensing elements having a surface defining a sensing plane, each sensing element being configured to provide a signal indicative of an electromagnetic coupling between a sensing element and a finger placed on the sensing device; bond wires arranged between bond pads located on the sensing chip on the substrate, respectively, to electrically connect the sensing chip to the readout circuitry. A portion of the bond wire protrudes above the chip and an adhesive is arranged on the sensing chip to covering to cover the chip so that the portion of the bond wire protruding above the chip is embedded in the adhesive. A protective plate is attached to the sensing chip by the adhesive and forms an exterior surface of the device.

A chip package included a chip, a first though hole, a laser stop structure, a first isolation layer, a second though hole and a conductive layer. The first though hole is extended from the second surface to the first surface of the chip to expose a conductive pad, and the laser stop structure is disposed on the conductive pad exposed by the first through hole, which an upper surface of the laser stop structure is above the second surface. The first isolation layer covers the second surface and the laser stop structure, and the first isolation layer has a third surface opposite to the second surface. The second though hole is extended from the third surface to the second surface to expose the laser stop structure, and a conductive layer is on the third surface and extended into the second though hole to contact the laser stop structure.