A module assembly for the detection of X-ray radiation includes an X-ray sensor being configured to receive a photon of the X-ray radiation and to provide an electrical signal in response to the received photon. The module assembly further includes a system-in-package structure for processing the electrical signal, the system-in-package structure including an input/output terminal, a first interposer and a second interposer and an integrated circuit which are arranged in a stacked configuration in the system-in-package structure. The package structure can be assembled on all four lateral sides and is thus four-side buttable so that contiguous modules can be mounted on all four sides without a gap between pixels to read out data from large-pixelated detectors of the X-ray sensor.

A disclosed method of manufacturing a semiconductor device includes singulating a bonded substrate including a first substrate provided with an interconnection structure layer and a first bonding layer and a second substrate provided with a second bonding layer opposed to the first bonding layer into a plurality of semiconductor devices. The bonded substrate includes functional element regions and a scribe region in a plan view. The singulating includes forming a groove in the scribe region, and cutting the bonded substrate in a region outside an inner side surface of the groove. The groove is formed penetrating one of the first substrate and the second substrate, the interconnection structure layer, and the first and second bonding layers. The groove extends from the one of the first substrate and the second substrate to a position deeper than all interconnection layers provided between the first and second substrates.

A radiation imaging device includes charge generation chips configured to generate charges, reading chips configured to output a digital value based on the charges, and a circuit board configured to have the reading chips arranged thereon. The charge generation chips each have a charge output surfaces including a first output region facing the reading chip and a second output region facing a different reading chip. The reading chips each have signal input/output electrodes. The charge generation chips each have signal connection wirings extending from the first output region to the second output region and electrically connecting the signal input/output electrodes of the reading chip to the signal input/output electrodes of the different reading chip.

Systems and methods are herein provided for a radiation detector with rectangular pixels. In one example, an x-ray imaging system comprises a pixel array of a flat panel detector comprising a plurality of pixels with a rectangular pixel pitch arranged in pairs, wherein each of the plurality of pixels is configured to generate respective image data signals, wherein in low-dose applications, TFT control lines of pixels in each pixel pair are energized simultaneously to generate signals with an effective pixel pitch of twice the rectangular pixel pitch and in high-dose applications, TFT control lines of pixels in each pixel pair are energized sequentially and the detector is translated during image acquisition for an effective pixel pitch of half the rectangular pixel pitch.