The present invention provides a panel equipped with a photovoltaic device including an even number of columns of photovoltaic modules, the columns being aligned essentially parallel to a longitudinal edge of the panel. Each column includes an electrical pole on each of extremity. The polarity of an electrical pole of one extremity being the inverse of that of the electrical pole of the other extremity, the poles of two adjacent columns being of inverse polarity, the electrical pole being in the form of a male connector when it is of one polarity and in the form of a female connector when it is of the inverse polarity. The male connectors and female connectors arranged so that they interlock with one another when the lower transverse edge of an upper panel overlaps the upper transverse edge of a lower panel. The present invention further provides an assembly of panels, an electrical device connected to a converter including an assembly and a method for the electrical connection to a converter of the panels of the assembly.

A method includes: a first collector electrodes forming step P1; a second collector electrodes forming step P2 of forming a plurality of second collector electrodes by applying a pasty second collector electrode material; a dividing guidelines forming step P3 of forming on the solar cell a plurality of dividing guidelines, each of which is formed between each two adjacent first collector electrodes and between each two adjacent second collector electrodes; a dividing step P4 of cutting the solar cell along the plurality of dividing guidelines to divide the solar cell into the plurality of small cell pieces; an overlapping step P5 of overlapping the plurality of small cell pieces so as to bring the first collector electrodes and the second collector electrodes cell pieces into abutting contact with each other; and a curing step P6 of curing the second collector electrode material.

Disclosed herein are avalanche photodiodes (APDs) particularly useful for high-sensitivity Geiger-mode APDs formed using an array of micro-cells. The photodetector is formed on a semiconductor substrate of indium phosphide (InP) having epitaxial layers, including indium gallium arsenide (InGaAs) as the photodetecting layer, with n-doped InP to one side, and layers of InP incorporating p-doped regions on the opposite side. The p-doped regions may serve to define an array of micro-cells, which may be arranged in a hexagonal pattern. A well may be etched through the epitaxial structures, allowing an electrode that contacts the n-doped InP layer and another that contacts the p-doped InP regions to be patterned on the same side of the detector. Flip-chip bonding techniques can then attach the semiconductor wafer to a stronger support substrate, which may additionally be configured with electronic circuitry positioned to electrically contact the electrodes on the semiconductor wafer surface.

A welding method for a welding strip of a back-contact solar cell chip includes the following steps: firstly, welding small chip assemblies of a back-contact solar cell to be interconnected to form a small cell string through an interconnected bar; then, punching the small cell string into small cell assemblies separated from each other through a cutting or punching process; subsequently, flexibly welding the small cell assemblies by a bus bar to reach a required length of a finished assembly product; and finally, breaking the bus bar through a post cutting or punching process to form cell assemblies with positive and negative electrodes connected in series or in parallel. The method makes the welding surfaces of the solar cell chips be on the same surface through using the back-contact solar cell chips, so that the interconnected bar of the solar cell chips can be welded rapidly and continuously.

A solar panel cutting unit according to an embodiment can separate layers of a solar panel from each other at once. The solar panel cutting unit separates thin layers of a solar panel from each other and includes a frame, a panel transporting mechanism that is provided at the frame and lowers the solar panel in a vertical direction such that adhesion lines of the thin layers are arranged downward, a pair of guide roller units that is positioned below the panel transporting mechanism and guides and lowers the solar panel, and a wire cutting mechanism that includes a pair of support rollers and cutting wires which connect the support rollers to each other and extend in the same direction as the adhesion lines such that the wire cutting mechanism separates the thin layers of the solar panel from each other.

Disclosed herein are approaches to fabricating solar cells, solar cell strings and solar modules using roll-to-roll foil-based metallization approaches. Methods disclosed herein can comprise the steps of providing at least one solar cell wafer on a first roll unit and conveying a metal foil to the first roll unit. The metal foil can be coupled to the solar cell wafer on the first roll unit to produce a unified pairing of the metal foil and the solar cell wafer. We disclose solar energy collection devices and manufacturing methods thereof enabling reduction of manufacturing costs due to simplification of the manufacturing process by a high throughput foil metallization process.

The disclosure is applicable to the technical field of solar cells and provides a solar cell and a method for manufacturing thereof, a cell assembly, and a photovoltaic system. In the solar cell, a P-type silicon substrate is used as a base layer, a first surface of the P-type silicon substrate is not completely covered with P-type doped layers, and a second surface of the P-type silicon substrate is not completely covered with N-type doped layers. Moreover, on the P-type silicon substrate, the P-type doped layers are locally arranged on a light-facing surface. In addition, the N-type doped layers are locally arranged on a light-sheltered surface, and a total area of all third regions is set to be greater than that of all first regions.

A solar cell module and method for manufacturing the same are disclosed. The solar cell module includes a first unit and a second unit. The first unit includes a first solar cell and a first protection element. The first solar cell and the first protection element are electrically coupled in parallel with each other. The second unit includes a second solar cell and a second protection element. The second solar cell and the second protection element are electrically coupled in parallel. The first unit is electrically connected to the second unit.

The invention relates to a method of producing a solar panel curved in two directions. A problem occurs when solar cells are laminated (attached) to a curved surface (such as thetransparentroof of a car) that is, at least locally, curved in two directions. Solar cells can bend in one direction (following a cylindrical surface), but to a much smaller degree in two directions. The invention solves this problem by subdividing the multitude of solar cells (100) in subgroups (302L, 302R, 304L, 304R, 306L, 306R, 308L, 308R), each subgroup associated with an area of the curved surface (202). By choosing these subgroups such, that almost no curvature occurs in one direction, the solar cells can be bend in the perpendicular direction. To optimize the efficiency further solar cells are used where anode and cathode are positioned at one side (the side opposite to the photosensitive side), enabling flexible foil to be used for the interconnection of the solar cells in a subgroup.

A surface-mountable semiconductor component and a method for producing the same are disclosed. In an embodiment the component includes an optoelectronic semiconductor chip, first and second contact elements and a molded body, wherein the chip includes a semiconductor body having a semiconductor layer sequence with an active region provided for producing and/or receiving electromagnetic radiation and arranged between a first semiconductor layer and a second semiconductor layer, wherein the first contact elements are electrically conductively connected to the first semiconductor layer and the second contact elements are electrically conductively connected to the second semiconductor layer, wherein the molded body at least partially encloses the optoelectronic semiconductor chip, wherein the semiconductor component includes a mounting face formed by a surface of the molded body, and wherein the first and second contact elements protrudes through the molded body in a region of the mounting face.