Patent classifications
H10F39/10
Optimizing geometric fill factor in prism-coupled waveguide-fed solar collector
A prism coupled waveguide-fed solar collector array optimized for geometric fill factor. An integrated linear array of prisms is arranged with their input faces in a common plane. The exit faces of the prisms each feds a corresponding optical waveguide and detector.
Sense circuit and method of operation thereof and photoelectric conversion array connected to inverting input of sense circuit
A sense circuit includes a differential amplifier circuit including an inverting input section, a non-inverting input section and an output section, an electrical capacitor connected between the inverting input section and the output section, and a field effect transistor including a source, a drain, and a gate. One of the source and the drain is connected to the inverting input section, and the other of the source and the drain is connected to the output section. A reference potential is supplied to the non-inverting input section, and an output section of a photoelectric conversion cell having an added switching function is connected to the inverting input section.
Infrared sensor
Provided is an infrared sensor which is capable of measuring a temperature of an object to be measured with high accuracy even when lead wires are connected to one side thereof. The infrared sensor includes an insulating film; a first and a second heat sensitive element which are provided on one face of the insulating film; a first and a second wiring film that are respectively connected to the first and the second heat sensitive element; an infrared reflecting film; a plurality of terminal electrodes; and a thermal resistance adjusting film which is provided on the other face of the insulating film, is in opposition to at least a portion of the longer one of the first or the second wiring film in wiring distance from the terminal electrodes, and is formed of a material with greater heat dissipation than the insulating film.
DISPLAY PANEL HAVING HEALTH MONITORING FUNCTION, MANUFACTURE METHOD THEREOF AND DISPLAY DEVICE
A display panel having health monitoring function, including a first substrate; a second substrate; and a monitoring unit. The monitoring unit is configured to monitor a change in human physiological information and is disposed on the first substrate or the second substrate through a patterning process. Such display panel having health monitoring function solves the technical problem that existing display panels having health monitoring function are poor in level of integration with incompact structures.
Sensor module and method of manufacturing the same
The opto-electronic module (1) comprises a first substrate member (P); a third substrate member (B); a second substrate member (O) arranged between said first and third substrate members and comprising one or more transparent portions (ta, tb) through which light can pass, said at least one transparent portion comprising at least a first optical structure (5a;5a;5b;5b); a first spacer member (S1) comprised in said first substrate member (P) or comprised in said second substrate member (O) or distinct from and located between these, which comprises at least one opening (4a;4b); a second spacer member (S2) comprised in said second substrate member (O) or comprised in said third substrate member (B) or distinct from and located between these, which comprises at least one opening (3); a light detecting element (D) arranged on and electrically connected to said first substrate member (P); a light emission element (E) arranged on and electrically connected to said first substrate member (P); and a sensing element (8) comprised in or arranged at said third substrate member (B). Such modules (1) are particularly suitable as sensor modules for sensing a magnitude such as a pressure.
SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC CHIP
A semiconductor package includes a package substrate, an electronic integrated circuit chip mounted on the package substrate, a first photonic integrated circuit chip mounted on the electronic integrated circuit chip, the first photonic integrated circuit chip including a first groove recessed from a top surface and a side surface of the first photonic integrated circuit chip, and a second photonic integrated circuit chip mounted on the first photonic integrated circuit chip, the second photonic integrated circuit chip including a second groove recessed from a top surface and a side surface of the second photonic integrated circuit chip, wherein the second photonic integrated circuit chip is offset-stacked on the first photonic integrated circuit chip, wherein at least a portion of a bottom surface of the first groove of the first photonic integrated circuit chip is exposed to the outside.
OPTICAL SENSING DEVICE
An optical sensing device including a substrate, a light-sensing element, a light-shielding layer, an insulating layer and a light-collecting element is disclosed. The light-sensing element is disposed on the substrate. The light-shielding layer is disposed on the light-sensing element and includes a first opening overlapping the light-sensing element. The insulating layer is disposed on the light-shielding layer and includes a second opening overlapping the first opening. The light-collecting element is disposed on the insulating layer and overlaps the second opening and includes a focus distance F and a first refractive index N1. A second refractive index N3 of an external medium, the first refractive index N1, the focus distance F, and a radius R of curvature of the light-collecting element meet the following equation: N1/N3=F/(FR).
Semiconductor chip having tampering feature
Silicon-based or other electronic circuitry is dissolved or otherwise disabled by reactive materials within a semiconductor chip should the chip or a device containing the chip be subjected to tampering. Triggering circuits containing normally-OFF heterojunction field-effect photo-transistors are configured to cause reactions of the reactive materials within the chips upon exposure to light. The normally-OFF heterojunction field-effect photo-transistors can be fabricated during back-end-of-line processing through the use of polysilicon channel material, amorphous hydrogenated silicon gate contacts, hydrogenated crystalline silicon source/drain contacts, or other materials that allow processing at low temperatures.
Image capturing and display apparatus and wearable device
An image capturing and display apparatus comprises a plurality of photoelectric conversion elements for converting incident light from the outside of the image capturing and display apparatus to electrical charge signals, and a plurality of light-emitting elements for emitting light of an intensity corresponding to the electrical charge signals acquired by the plurality of photoelectric conversion elements. A pixel region is defined as a region in which the plurality of photoelectric conversion elements are arranged in an array. Signal paths for transmitting signals from the plurality of photoelectric conversion elements to the plurality of light-emitting elements lie within the pixel region.
Image capturing and display apparatus and wearable device
An image capturing and display apparatus comprises a plurality of photoelectric conversion elements for converting incident light from the outside of the image capturing and display apparatus to electrical charge signals, and a plurality of light-emitting elements for emitting light of an intensity corresponding to the electrical charge signals acquired by the plurality of photoelectric conversion elements. A pixel region is defined as a region in which the plurality of photoelectric conversion elements are arranged in an array. Signal paths for transmitting signals from the plurality of photoelectric conversion elements to the plurality of light-emitting elements lie within the pixel region.