Provided is a detector that includes a scintillator, a common electrode, a pixel electrode, and a plurality of insulating layers, with a plurality of nano-pillars formed in the plurality of insulating layers, a nano-scale well structure between adjacent nano-pillars, with a-Se separating the adjacent nano-pillars, and a method for operation thereof.

A gas sensor containing counter electrodes and a semiconductor nanowire 4 disposed between the counter electrodes 2, 3, wherein the semiconductor nanowire 4 is in a state where light can be irradiated, which sensor measures changes in the electric current associated with adsorption of a gas to the semiconductor nanowire 4, wherein the electric current is generated by irradiation of light on the semiconductor nanowire with a voltage applied to the counter electrodes 2, 3.

A manufacturing method of a sensing integrated circuit including the following acts. A plurality of transistors are formed. At least one dielectric layer is formed on or above the transistors. A plurality of connecting structures are formed in the dielectric layer. The connecting structures are respectively and electrically connected to the transistors. A plurality of separated conductive wells are respectively formed in electrical contact with the connecting structures.

A radiation detection element includes plural hexagonal pixels arrayed in a honeycomb form and having sensor portions that generate charges due to radiation being irradiated. The radiation detection element includes charge accumulating capacitors that accumulate generated charges, and TFT switches for reading-out the charges accumulated at the capacitors. The radiation detection element includes scan lines disposed parallel in a first direction, to which switching signals that control switching of the TFT switches are outputted; and data lines disposed parallel in a second direction intersecting the first direction, to which charges read-out by the TFT switches are outputted. The TFT switches are disposed to be, in the first direction, connected to the data lines from alternately different sides of the data line, and such that an arrangement of source electrodes and drain electrodes of the TFT switches is the same in the first direction.

A process for preparing alloy products powders is described using a self-sustaining or self-propagating SHS-type combustion process. Binary, ternary and quaternary alloy having cadmium, selenium and optionally a third element X or Y selected from Group VIA (such as S or Te) or from group IIB (such as Zn or Hg). The alloy products may be doped or not with a wide variety of other elements. The process involves heating to ignition, maintaining an elevated temperature less than melting for homogenization, followed by cooling and crushing. An optional de-oxidation process may follow to further purify the alloy and balance the stoichiometry.

An imaging device that has a structure where a transistor is used in common by a plurality of pixels and is capable of imaging with a global shutter system is provided. A transistor that resets the potential of a charge detection portion, a transistor that outputs a signal corresponding to the potential of the charge detection portion, and a transistor that selects a pixel are used in common by the plurality of pixels. A transistor is provided between a power supply line and a photoelectric conversion element. Exposure is performed by turning on the transistor. Imaging data is retained in a charge retention portion by turning off the transistor.

Compound semiconductors, expressed by the following formula: Bi.sub.1-xM.sub.xCu.sub.wO.sub.a-yQ1.sub.yTe.sub.b-zQ2.sub.z. Here, M is at least one element selected from the group consisting of Ba, Sr, Ca, Mg, Cs, K, Na, Cd, Hg, Sn, Pb, Eu, Sm, Mn, Ga, In, Tl, As and Sb; Q1 and Q2 are at least one element selected from the group consisting of S, Se, As and Sb; x, y, z, w, a, and b are 0x<1, 0<w1, 0.2<a<4, 0y<4, 0.2<b<4 and 0z<4. These compound semiconductors may be used for various applications such as solar cells or thermoelectric conversion elements, where they may replace compound semiconductors in common use, or be used along with compound semiconductors in common use.

Methods are provided for controlling the shape of antimony selenide (Sb.sub.2Se.sub.3) synthesized nanostructures. The method dissolves an antimony (III) salt in a first amount of carboxylic acid, forming an antimony precursor. In one aspect, antimony (III) chloride is dissolved in oleic acid. Separately, selenourea is dissolved in oleylamine, forming a selenium precursor. The antimony precursor is combined with the selenium precursor to form a first solution and cause a reaction. The reaction is quenched with a solvent having a low boiling point. In response to quenching the reaction in the first solution, antimony selenide nanorods are formed, having a length in the range of 150-200 nanometers (nm) and a diameter in the range of 20 to 30 nm. Related methods can be used to create, shorter nanorods, nanocrystals, and hollow nanospheres.

In one aspect of the present invention, a photovoltaic device is provided. The photovoltaic device includes a window layer and an absorber layer disposed on the window layer, wherein the absorber layer includes a first region and a second region, the first region disposed adjacent to the window layer. The absorber layer further includes a first additive and a second additive, wherein a concentration of the first additive in the first region is greater than a concentration of the first additive in the second region, and wherein a concentration of the second additive in the second region is greater than a concentration of the second additive in the first region. Method of making a photovoltaic device is also provided.

An imaging device that has a structure where a transistor is used in common by a plurality of pixels and is capable of imaging with a global shutter system is provided. A transistor that resets the potential of a charge detection portion, a transistor that outputs a signal corresponding to the potential of the charge detection portion, and a transistor that selects a pixel are used in common by the plurality of pixels. A node AN (a first charge retention portion), a node FD (a second charge retention portion), and a node FDX (the charge detection portion) are provided. Imaging data obtained in the node AN is transferred to the node FD, and the imaging data is sequentially transferred from the node FD to the node FDX to be read.