An apparatus comprising a frame and a pressure sensitive adhesive applied to at least a portion of the frame, where the pressure sensitive adhesive is arranged to bond a pre-strained film to the frame is disclosed. A method of making the apparatus also is disclosed. Also disclosed is a method of preparing a stretch frame for manufacturing electroactive polymer devices thereon.

A vibrator includes: a base portion; a vibrating arm including an arm portion which extends from the base portion, and a weight portion which is located on a tip end side of the arm portion and which has a first main surface and a second main surface that are in a front-back relationship; and a weight film disposed at the first main surface of the weight portion. The first main surface includes a planar surface and an inclined surface inclined with respect to the planar surface. A method for manufacturing a vibrator includes: a preparation step of preparing the above-described vibrator; and a removing step of removing a part of the weight film by emitting an energy ray to the weight film. In the removing step, the weight film disposed at the planar surface is removed and the weight film disposed at the inclined surface is not removed by emitting the energy ray to the weight film from a normal direction of the planar surface.

In an array of single crystal acoustic resonators, the effective coupling coefficient of first and second strained single crystal filters are individually tailored in order to achieve desired frequency responses. In a duplexer embodiment, the effective coupling coefficient of a transmit band-pass filter is lower than the effective coupling coefficient of a receive band-pass filter of the same duplexer. The coefficients can be tailored by varying the ratio of the thickness of a piezoelectric layer to the total thickness of electrode layers or by forming a capacitor in parallel with an acoustic resonator within the filter for which the effective coupling coefficient is to be degraded. Further, a strained piezoelectric layer can be formed overlying a nucleation layer characterized by initial surface etching and piezoelectric layer deposition parameters being configured to modulate a strain condition in the strained piezoelectric layer to adjust piezoelectric properties for improved performance in specific applications.

An apparatus 10 for poling piezoelectric material includes a platen 22 which holds a sample 20 of piezoelectric material to be poled and a stage 30 to which the platen is mounted. The stage 30 is arranged to selectively move the platen 22 and thereby the sample 20 which the platen 22 holds. The platen 22 is movable by the stage 30 selectively between a first position and a second position. A corona source 40 generates a corona to which the sample 20 is exposed when the platen 22 is moved to the first position by the stage 30. An electrostatic voltmeter 60 having a probe 62 measures a surface potential of the sample 20 when the platen 22 is moved to the second position by the stage 30.

An electro-holographic light field generator device is disclosed. The light field generator device has an optical substrate with a waveguide face and an exit face. One or more surface acoustic wave (SAW) optical modulator devices are included within each light field generator device. The SAW devices each include a light input, a waveguide, and a SAW transducer, all configured for guided mode confinement of input light within the waveguide. A leaky mode deflection of a portion of the waveguided light, or diffractive light, impinges upon the exit face. Multiple output optics at the exit face are configured for developing from each of the output optics a radiated exit light from the diffracted light for at least one of the waveguides. An RF controller is configured to control the SAW devices to develop the radiated exit light as a three-dimensional output light field with horizontal parallax and compatible with observer vertical motion.

This application provides a piezoelectric component, a piezoelectric apparatus and a method for manufacturing the same, and relates to the field of piezoelectric technologies. In order to solve a problem of a relatively large misalignment between a piezoelectric component and a target transfer position on a glass substrate occurred after the piezoelectric component is transferred in the related transfer methods, and to improve the transfer accuracy of the piezoelectric component. The piezoelectric component includes: a component body and at least one electrode structure arranged on a side of the component body. The at least one electrode structure includes a plurality of strip-shaped electrode pins, and the plurality of electrode pins is arranged at intervals.

There is provided a SAW filter manufacturing method for manufacturing a SAW filter from a piezoelectric substrate having planned dividing lines set on a top surface of the piezoelectric substrate, and having a device including comb-shaped electrodes in regions demarcated by the planned dividing lines. The method includes a structure forming step of forming a structure having projections and depressions on an undersurface side of the piezoelectric substrate by irradiating the piezoelectric substrate with a laser beam of a wavelength absorbable by the piezoelectric substrate from the undersurface side of the piezoelectric substrate, and a dividing step of dividing the piezoelectric substrate along the planned dividing lines after the structure forming step.

A process for fabricating a substrate for a radiofrequency device by joining a piezoelectric layer to a carrier substrate by way of an electrically insulating layer, the piezoelectric layer having a rough surface at its interface with the electrically insulating layer, the process being characterized in that it comprises the following steps: providing a piezoelectric substrate having a rough surface for reflecting a radiofrequency wave, depositing a dielectric layer on the rough surface of the piezoelectric substrate, providing a carrier substrate, depositing a photo-polymerizable adhesive layer on the carrier substrate, bonding the piezoelectric substrate to the carrier substrate by way of the dielectric layer and of the adhesive layer, in order to form an assembled substrate, irradiating the assembled substrate with a light flux in order to polymerize the adhesive layer, the adhesive layer and the dielectric layer together forming the electrically insulating layer.

An actuator assembly includes a primary electrode, a secondary electrode overlapping at least a portion of the primary electrode, and an electroactive polymer layer disposed between the primary electrode and the secondary electrode, where the electroactive polymer layer includes a non-vertical (e.g., sloped) sidewall with respect to a major surface of at least one of the electrodes. The electroactive polymer layer may be characterized by a non-axisymmetric shape with respect to an axis that is oriented orthogonal to an electrode major surface.

A method for manufacturing a piezoelectric device that includes a substrate and a vibration portion that can include a membrane or a beam that is directly or indirectly supported by the substrate and arranged above the substrate. Moreover, the vibration portion includes a piezoelectric layer and the method includes forming the vibration portion and adjusting a resonance frequency of the vibration portion by locally subjecting a region including the vibration portion to heat treatment.