Patent classifications
H01L41/37
ELECTROACOUSTIC TRANSDUCTION FILM AND MANUFACTURING METHOD OF ELECTROACOUSTIC TRANSDUCTION FILM
Provided are an electroacoustic transduction film in which conversion between a vibration and a voltage is able to be appropriately performed without the occurrence of dielectric breakdown of the air between upper and lower thin film electrodes even when a high voltage is applied therebetween, a user is able to be prevented from coming into contact with a piezoelectric layer, and high productivity is achieved, and a manufacturing method of an electroacoustic transduction film. A piezoelectric layer which stretches and contracts in response to a state of an electric field, an upper thin film electrode formed on one principal surface of the piezoelectric layer, a lower thin film electrode formed on the other principal surface of the piezoelectric layer, an upper protective layer formed on the upper thin film electrode, and a lower protective layer formed on the lower thin film electrode are included, and a groove which penetrates the thin film electrode and the protective layer is formed in at least a portion of an outer peripheral portion in a surface direction of at least one of the upper thin film electrode and the upper protective layer, or the lower thin film electrode and the lower protective layer.
Energy generating device, and method of manufacturing the same
An energy generating device and a method of manufacturing the same are provided. The energy generating device includes a first electrode, a metal layer, including a regular arrangement of a plurality of patterns, disposed on the first electrode, an organic material layer positioned on the metal layer, and a piezoelectric layer interposed between the first electrode and the organic material layer.
SYNCHRONIZED PIEZOELECTRIC AND LUMINESCENCE MATERIAL AND ELEMENT INCLUDING THE SAME
A synchronized piezoelectric and luminescence (SPL) material includes a core layer including light-emitting particles and a shell layer which is attached onto a surface of the core layer and includes ligands having a piezoelectric property. Therefore, a piezoelectric property and a luminescent property can be simultaneously implemented using a single SPL material in which piezoelectric ligands and light-emitting particles are chemically coupled.
IMPACT SENSOR
An impact sensor for a vehicle. The impact sensor includes at least one strain-sensitive sensor element which comprises a sensor material, and at least two terminals, between which the sensor material is electrically connected. The sensor material is a metal-containing carbon material.
Piezoelectric composition and method for producing same, piezoelectric element/non-lead piezoelectric element and method for producing same, ultrasonic probe and diagnostic imaging device
The present invention is a piezoelectric composition and a piezoelectric element using the piezoelectric composition, the composition being characterized by: having a Perovskite structure represented by general formula ABO3; being represented by composition formula x(Bi0.5K0.5)TiO3-yBi(Mg0.5Ti0.5)O3-zBiFeO3, x+y+z=1 in the composition formula above; and in a triangular coordinate using x, y and z in the composition formula above, having a composition represented by a region which is surrounded by a pentagon ABCDE with apexes of point A (1, 0, 0), point B (0.7, 0.3, 0), point C (0.1, 0.3, 0.6), point D (0.1, 0.1, 0.8) and point E (0.2, 0, 0.8) and which does not include the line segment AE that connects point A (1, 0, 0) and point E (0.2, 0, 0.8).
Method for manufacturing a sensor element or an active component of a sensor element
The invention relates to a method for manufacturing a sensor element or an active component of a sensor element. The sensor element is applied in a field device of automation technology. The method comprises the following method steps: predetermining at least two materials with different physical and chemical properties depending on a functionality of the sensor element or the active component of the sensor element; predetermining an outer shape, into which the at least two materials should be formed, the outer shape being divided into a plurality of virtual spatial regions, wherein in each virtual spatial region the material distribution of the at least two materials occurs homogeneously and periodically according to predetermined rules corresponding to a microstructure. The method also includes steps of ascertaining the predetermined rules via a computer supported method depending on the predetermined functionality of the sensor element or the active component of the sensor element.
LEAD-FREE PIEZO COMPOSITES AND METHODS OF MAKING THEREOF
Methods of producing lead-free piezoelectric composites are described. The method can include adding a lead-free piezoelectric additive to a solution that includes a solvent and polymer solubilized therein. The solvent can have i) a boiling point ≤80° C. at 0.1 MPa and ii) a solubility in water of ≥0.1 g/g and/or a dielectric constant ≥20. The solvent can be removed to form a polymeric matrix having the lead-free piezoelectric particles dispersed therein. Electrical treatment of the polymeric matrix can form the piezoelectric component. Lead-free piezoelectric composites and devices that include the lead-free piezoelectric composites are also described.
Shape-controlled ceramic fillers for enhanced piezoelectric properties of structured composites
A lead-free lithium doped potassium sodium niobate piezoelectric ceramic material in powdered form and having a single crystalline phase and uses thereof are described. Methods of making the said piezoelectric ceramic material are also described.
FLEXIBLE AND LOW COST LEAD-FREE PIEZOELECTRIC COMPOSITES WITH HIGH D33 VALUES
Lead-free piezoelectric composites and methods of making and uses thereof are described. The lead-free piezoelectric composites have high flexibility and high piezoelectric properties.
METHOD OF FABRICATING PIEZOELECTRIC COMPOSITE
A technology of fabricating a piezoelectric composite applicable to an ultrasonic transducer is disclosed. According to one aspect of the present disclosure, a support member formed with a plurality of through holes is located on one surface of an electrode plate, and lower surfaces of piezoelectric pillars having shapes respectively corresponding to the through holes are adhered onto the one surface of the electrode plate to form the piezoelectric pillars. Further, according to an additional aspect, the plurality of piezoelectric pillars having shapes corresponding to the through holes of the support member are formed by sintering a piezoelectric pellet molded in a pillar shape.