Patent classifications
H01L41/313
Attachment System For Attaching a Sensor to a Substrate, Method of Attaching a Sensor to a Substrate
An attachment system for attaching a sensor to a substrate includes a first layer of adhesive attaching to the sensor and a second layer of adhesive attaching to the substrate. The first layer is attached to the second layer and the first layer differs from the second layer in at least one of elasticity and hardness.
Method of manufacturing an oscillator
Provided is a method of manufacturing an oscillator, including: arranging an electrode on a piezoelectric ceramics free from being subjected to polarization treatment, to thereby provide a piezoelectric element; bonding the piezoelectric element and a diaphragm to each other at a temperature T1; bonding the piezoelectric element and a power supply member to each other at a temperature T2; and subjecting the piezoelectric ceramics to polarization treatment at a temperature T3, in which the temperature T1, the temperature T2, and the temperature T3 satisfy a relationship T1>T3 and a relationship T2>T3.
Method for manufacturing a film on a support having a non-flat surface
A method for manufacturing a film on a support having a non-flat surface comprises: providing a donor substrate having a non-flat surface, forming an embrittlement zone in the donor substrate so as to delimit the film to be transferred, forming the support by deposition on the non-flat surface of the film to be transferred, and detaching the donor substrate along the embrittlement zone, so as to transfer the film onto the support.
PIEZOELECTRIC ELEMENT AND METHOD FOR PRODUCING THE SAME
A piezoelectric element includes a piezoelectric layer, a first electrode layer, a second electrode layer, and a coupling electrode. At least a portion of the second electrode layer faces the first electrode layer with the piezoelectric layer interposed therebetween. The second electrode layer includes a coupling area. The coupling area meets a through hole in a region of the second electrode layer not facing the first electrode layer. The coupling electrode is on the coupling area. Between the coupling area and the surface of the second electrode layer on the piezoelectric layer side excluding the coupling area, the difference in position is about 5 nm or less.
Piezoelectric Element for Untact Haptic and Method for Manufacturing the Same
An embodiment piezoelectric element includes a piezoelectric composite layer including a polymer and a piezoelectric ceramic, a backing layer disposed on a rear surface of the piezoelectric composite layer and configured to limit vibration of the piezoelectric composite layer, and an adhesive layer bonding the piezoelectric composite layer and the backing layer.
DIFFUSION BONDING OF PIEZOELECTRIC CRYSTAL TO METAL WEAR PLATE
The disclosed method of diffusion bonding of a lead zirconate titanate piezoelectric crystal to a metal wear plate, for the fabrication of an ultrasonic transducer operable at high temperatures and able to withstand repeated thermal cycling, comprises depositing noble metal coatings on both bonding surfaces, bringing the surfaces into contact, and heating under pressure at a temperature ranging from 270 to 400° C.
Method for manufacturing a hybrid structure
A method for manufacturing a hybrid structure comprising an effective layer of piezoelectric material having an effective thickness and disposed on a supporting substrate having a substrate thickness and a thermal expansion coefficient lower than that of the effective layer includes: a) a step of providing a bonded structure comprising a piezoelectric material donor substrate and the supporting substrate, b) a first step of thinning the donor substrate to form a thinned layer having an intermediate thickness and disposed on the supporting substrate, the assembly forming a thinned structure; c) a step of heat treating the thinned structure at an annealing temperature; and d) a second step, after step c), of thinning the thinned layer to form the effective layer. The method also comprises, prior to step b), a step a′) of determining a range of intermediate thicknesses that prevent the thinned structure from being damaged during step c).
Piezoelectric actuator and piezoelectric actuating plate thereof
A piezoelectric actuator for a miniature fluid transportation device is provided and includes a piezoelectric actuating plate and a piezoelectric element. The piezoelectric actuating plate includes a suspension plate, an outer frame, and brackets. The suspension plate has a first thickness. The outer frame is arranged around the suspension plate and has a third thickness. Each of the brackets is connected between the suspension plate and the outer frame and has a fourth thickness. The third thickness is larger than the first thickness, and the first thickness is larger than the fourth thickness. The suspension plate, the outer frame and the brackets are constructed to form different stepped structures to minimize the thickness of the brackets, enhance the elasticity of the brackets. Thus, displacement of the suspension plate in the vertical direction is enhanced and the transportation efficiency of the miniature fluid transportation device is intensified.
Vibration detection element and method for manufacturing the same
A vibration detection element includes substrates, support members, and an oscillator, and may be used as a biosensor and/or for liquid inspection by analysis of oscillator resonant frequency change. The substrates have a space portion, and the support members protrude from the surfaces of the respective substrates into the space portion. The oscillator is disposed between the support members and is capable of vibrating in the space portion. The support members may each include multiple supports which prevent the oscillator from contacting the substrate surfaces. During manufacturing the oscillator may be transferred from the support member of a glass flow path substrate to a silicon flow path substrate by placement of the silicon substrate support member against the oscillator and subsequent removal of the adhesive from the glass substrate support member.
PIEZOELECTRIC ELEMENT, LIQUID EJECTION HEAD, AND LIQUID EJECTION APPARATUS
A piezoelectric element includes a substrate and a laminate which is provided on the substrate and which includes a first electrode, a seed layer, a piezoelectric layer, and a second electrode in this order, and the seed layer includes a composite oxide containing as a constituent element, lead, iron, and titanium.