A display includes a first housing portion having graphic openings and a second housing portion spaced apart from the first housing portion. A first circuit board has LEDs and is disposed between the first and second housing portions. A first side wall and a second side wall define photon recycling cavities in a sequence wherein adjacent photon recycling cavities have a shared end wall an LED. The first side wall has a first angular surface and the second side wall has a second angular surface. The first angular surface and the second angular surface redirecting light from an associated LED of the plurality of LEDs so that light from the plurality of light emitting diode is indirectly communicated through the graphic openings after reflecting from the first angular surface and the second angular surface.

Provided is a display panel. The display panel includes a base substrate, a light-emitting layer, a package layer, and a light conversion layer that are successively stacked. The light conversion layer includes a plurality of light conversion units arranged in an array and a plurality of micro-mirror structures. The plurality of light conversion units include a plurality of first light conversion units, and the plurality of micro-mirror structures include a plurality of first micro-mirror structures surrounding the first light conversion units. Each of the first micro-mirror structures is configured to reflect at least a portion of light from an interior of each of the first light conversion units.

Provided is a display panel. The display panel includes a base substrate, a light-emitting layer, a package layer, and a light conversion layer that are successively stacked. The light conversion layer includes a plurality of light conversion units arranged in an array and a plurality of micro-mirror structures. The plurality of light conversion units include a plurality of first light conversion units, and the plurality of micro-mirror structures include a plurality of first micro-mirror structures surrounding the first light conversion units. Each of the first micro-mirror structures is configured to reflect at least a portion of light from an interior of each of the first light conversion units.

Disclosed are a Micro LED micro-display chip and a manufacturing method thereof. The Micro LED micro-display chip includes a driver panel; multiple LED units arranged on the driver panel, wherein the multiple LED units includes multiple LED mesas in a one-to-one correspondence with the multiple LED units, and each of the LED units is independently drivable by the driver panel; a grid structure having multiple grid holes, wherein the multiple grid holes are respectively provided around the multiple LED mesas, and recess areas are formed between the LED mesas and the respective grid holes; a wavelength conversion layer provided on the grid structure, including multiple first wavelength conversion units filling the corresponding recess areas and configured to convert the first color light emitted by the LED units into second color light.

A display device including a substrate including a pixel circuit, a pixel electrode connected to the pixel circuit, an insulating layer disposed on the pixel electrode, a through electrode penetrating the insulating layer and connecting to the pixel electrode, a bottom bonding electrode and an upper bonding electrode sequentially disposed on the through electrode and the insulating layer, and a light emitting element disposed on the upper bonding electrode. The through electrode has a groove whose upper surface is concave downward. A lower surface of the bottom bonding electrode follows the surface profile of the insulating layer and the through electrode disposed below, and an upper surface is flat. The bottom bonding electrode includes an oxide layer.

A display device including a substrate including a pixel circuit, a pixel electrode connected to the pixel circuit, an insulating layer disposed on the pixel electrode, a through electrode penetrating the insulating layer and connecting to the pixel electrode, a bottom bonding electrode and an upper bonding electrode sequentially disposed on the through electrode and the insulating layer, and a light emitting element disposed on the upper bonding electrode. The through electrode has a groove whose upper surface is concave downward. A lower surface of the bottom bonding electrode follows the surface profile of the insulating layer and the through electrode disposed below, and an upper surface is flat. The bottom bonding electrode includes an oxide layer.

A display device includes a pixel electrode disposed on a substrate, light emitting elements disposed on the pixel electrode, the light emitting elements including a first semiconductor layer, an active layer, a second semiconductor layer, and a third semiconductor layer, a first via layer disposed on the substrate, and having a higher height than a height of the active layer and having a lower height than a height of the third semiconductor layer and a common electrode disposed on the first via layer and surrounding the side surfaces of the light emitting elements, the light emitting elements include two or more heterogeneous insulating layers having different refractive indices, and the heterogeneous insulating layers surround top and side surfaces of the first semiconductor layer and side surfaces of the first semiconductor layer and further surround at least a portion of a side surface of the second semiconductor layer.

A display device includes a pixel electrode disposed on a substrate, light emitting elements disposed on the pixel electrode, the light emitting elements including a first semiconductor layer, an active layer, a second semiconductor layer, and a third semiconductor layer, a first via layer disposed on the substrate, and having a higher height than a height of the active layer and having a lower height than a height of the third semiconductor layer and a common electrode disposed on the first via layer and surrounding the side surfaces of the light emitting elements, the light emitting elements include two or more heterogeneous insulating layers having different refractive indices, and the heterogeneous insulating layers surround top and side surfaces of the first semiconductor layer and side surfaces of the first semiconductor layer and further surround at least a portion of a side surface of the second semiconductor layer.

The present invention relates to a vertically-laminated microdisplay panel requiring no color filter, the panel comprising: a back wafer, the top surface of which has multiple CMOS electrode pads aligned thereon; multiple LED laminates, each of which includes multiple light emitting units and multiple bonding layers vertically laminated on the back wafer, and which are aligned on the multiple CMOS electrode pads, respectively; and a common electrode formed on the multiple LED laminates, wherein each of the multiple LED laminates emits only a particular color by blocking the light generated from at least one light emitting unit among the multiple light emitting units, or having a short passage formed through at least one light emitting unit among the multiple light emitting units to bypass current so as to prevent the current from being injected into the light emitting unit.

The present invention relates to a vertically-laminated microdisplay panel requiring no color filter, the panel comprising: a back wafer, the top surface of which has multiple CMOS electrode pads aligned thereon; multiple LED laminates, each of which includes multiple light emitting units and multiple bonding layers vertically laminated on the back wafer, and which are aligned on the multiple CMOS electrode pads, respectively; and a common electrode formed on the multiple LED laminates, wherein each of the multiple LED laminates emits only a particular color by blocking the light generated from at least one light emitting unit among the multiple light emitting units, or having a short passage formed through at least one light emitting unit among the multiple light emitting units to bypass current so as to prevent the current from being injected into the light emitting unit.