A method includes transferring a first subset of the first LEDs from a first substrate to a first backplane to form first subpixels in pixel regions, transferring a first subset of the second LEDs to a second backplane and separating the first subset of the second LEDs from a second substrate to leave first vacancies on the second substrate, forming an additional electrically conductive material on a second subset of second LEDs located on the second substrate after transferring the first subset of the second LEDs to the second backplane, positioning the second substrate over the first backplane, such that the first subpixels are disposed in the first vacancies, and transferring the second subset of the second LEDs to a second subset of bonding structures on the first backplane to form second subpixels in the pixel regions, while a gap exists between the first subpixels and the second substrate.

Disclosed herein is a method for removing an electronic component from a substrate. The electronic component is fixed on the substrate via an adhesive force generated by a solder. The method includes applying an energy to the electronic component to reduce the adhesive force, and applying an adhesion removal force to the electronic component. The adhesion removal force is sufficient to overcome the adhesive force of the solder after the adhesive force is reduce by the energy, so as to remove the electronic component from the substrate. Also, disclosed herein is a method for manufacturing light emitting diode display, including using the method as mentioned previously to repair a light emitting diode on the substrate.

Disclosed herein is a method for removing an electronic component from a substrate. The electronic component is fixed on the substrate via an adhesive force generated by a solder. The method includes applying an energy to the electronic component to reduce the adhesive force, and applying an adhesion removal force to the electronic component. The adhesion removal force is sufficient to overcome the adhesive force of the solder after the adhesive force is reduce by the energy, so as to remove the electronic component from the substrate. Also, disclosed herein is a method for manufacturing light emitting diode display, including using the method as mentioned previously to repair a light emitting diode on the substrate.

A method for transferring one or more clusters of micro-LEDs to a display panel includes fabricating or loading a plurality of micro-LED clusters comprising two or more micro-LEDs onto a substrate, and positioning the substrate in a first position. At least a first micro-LED cluster is aligned with at least a first electrical connector on a display panel. The method also includes lowering the substrate toward the display panel such that the first micro-LED cluster contacts the first electrical connector, and releasing the first micro-LED cluster from the substrate.

A display device includes a first pixel and a second pixel disposed on a substrate and having different structures from each other. Each of the first and second pixels includes a light emitting element including a first element electrode and a second element electrode, an anode electrode disposed on the substrate, a cathode electrode disposed on the substrate, a first connection electrode electrically connecting the anode electrode and the light emitting element, and a second connection electrode electrically connecting the cathode electrode and the light emitting element. The second pixel further includes a first connection metal portion that electrically connects the anode electrode and the first element electrode and a second connection metal portion that electrically connects the cathode electrode and the second element electrode.

A display device includes a first pixel and a second pixel disposed on a substrate and having different structures from each other. Each of the first and second pixels includes a light emitting element including a first element electrode and a second element electrode, an anode electrode disposed on the substrate, a cathode electrode disposed on the substrate, a first connection electrode electrically connecting the anode electrode and the light emitting element, and a second connection electrode electrically connecting the cathode electrode and the light emitting element. The second pixel further includes a first connection metal portion that electrically connects the anode electrode and the first element electrode and a second connection metal portion that electrically connects the cathode electrode and the second element electrode.

An object of the present invention is to provide a water-soluble adhesive composition for component capture and a water-soluble adhesive sheet for component capture which are superior in the impact absorption and the stickiness and adhesiveness and suitable for capturing components, and provide a method which allows high-precision, efficient production of electronic components, by using the composition and the sheet. To achieve the object, a composition and a sheet including the composition are provided, the composition containing an (A) water-soluble adhesive and a (B) water-soluble plasticizer (excluding the component (A)), wherein the (B) water-soluble plasticizer has 50000 mPa.Math.s or less at normal temperature (25 C.), and a ratio of a content of the (B) water-soluble plasticizer to a content of the (A) water-soluble adhesive ((B)/(A)) is greater than 0.5 and 3.0 or less. According to the present invention, impact absorption and the stickiness and adhesiveness are improved, and particularly in the production of a semiconductor element, damage or misalignment of a component (element) is reduced. Particularly the sheet of the present invention is easy to handle in attachment and peeling.

A circuit board includes a base having a plurality of interconnections on an upper surface thereof, a first photosensitive solder resist (PSR) covering the interconnections and defining a pad open region exposing portions of the interconnections, a second PSR covering the first PSR and having an opening exposing the pad open region. The opening of the second PSR is larger than the pad open region of the first PSR.

A method for manufacturing a display module includes the steps of: transferring LEDs of a substrate to a first relay substrate; transferring the LEDs of the first relay substrate to a second relay substrate in a primary stretch array such that a gap between adjacent LEDs on the second relay substrate is greater than a gap between adjacent LEDs on the first relay substrate in one direction from among a row direction and a column direction; and transferring the LEDs of the second relay substrate to a target substrate in a secondary stretch array such that a gap between adjacent LEDs on the target substrate is greater than a gap between adjacent LEDs on the second relay substrate in a remaining direction from among the row direction and the column direction.

A method for manufacturing a display module includes the steps of: transferring LEDs of a substrate to a first relay substrate; transferring the LEDs of the first relay substrate to a second relay substrate in a primary stretch array such that a gap between adjacent LEDs on the second relay substrate is greater than a gap between adjacent LEDs on the first relay substrate in one direction from among a row direction and a column direction; and transferring the LEDs of the second relay substrate to a target substrate in a secondary stretch array such that a gap between adjacent LEDs on the target substrate is greater than a gap between adjacent LEDs on the second relay substrate in a remaining direction from among the row direction and the column direction.