An apparatus for manufacturing a display device includes a chamber, an electrostatic chuck disposed in the chamber, the electrostatic chuck holding a display substrate in close contact with a surface of the electrostatic chuck and including chuck zones, a detection portion including sensors connected to corresponding chuck zones among the chuck zones, a power portion including power sources connected to the chuck zones and applies voltages to the chuck zones, and a control portion connected to the detection portion and the power portion, the control portion detects a defective chuck zone among the chuck zones based on information received from the detection portion, and controls the power portion to adjust a voltage applied to another chuck zone adjacent to the defective chuck zone.

An apparatus for manufacturing a display device includes a chamber, an electrostatic chuck disposed in the chamber, the electrostatic chuck holding a display substrate in close contact with a surface of the electrostatic chuck and including chuck zones, a detection portion including sensors connected to corresponding chuck zones among the chuck zones, a power portion including power sources connected to the chuck zones and applies voltages to the chuck zones, and a control portion connected to the detection portion and the power portion, the control portion detects a defective chuck zone among the chuck zones based on information received from the detection portion, and controls the power portion to adjust a voltage applied to another chuck zone adjacent to the defective chuck zone.

The present embodiment comprises: a substrate chuck on which a substrate is seated; a transfer head having a suction plate to which donor is suctioned and transferring an LED-chip having been transferred to the donor onto the substrate; and a vision sensor disposed under the substrate chuck, wherein a light source for emitting light toward the donor is disposed on the suction plate.

The present embodiment comprises: a substrate chuck on which a substrate is seated; a transfer head having a suction plate to which donor is suctioned and transferring an LED-chip having been transferred to the donor onto the substrate; and a vision sensor disposed under the substrate chuck, wherein a light source for emitting light toward the donor is disposed on the suction plate.

There may be provided a release workstation, processing or panel release system including the release workstation, and methods of operating the same. The processing or panel release system may include a carrier-support deck having a deck surface capable of supporting an intermediate panel-carrier assembly thereon, and a release-heater associated with the deck surface and operable to heat the intermediate panel-carrier assembly to a heat release temperature. The release workstation may include a release unit having a release-head movable towards the deck surface of the carrier-support deck to engage a molded panel of the intermediate panel-carrier assembly on the deck surface. The release-head may include a retaining member configured to releasably retain the molded panel to an engagement surface of the release-head. The release-head may further be movable away from the deck surface of the carrier-support deck, with the retaining member of the release-head releasably retaining the molded panel.

There may be provided a release workstation, processing or panel release system including the release workstation, and methods of operating the same. The processing or panel release system may include a carrier-support deck having a deck surface capable of supporting an intermediate panel-carrier assembly thereon, and a release-heater associated with the deck surface and operable to heat the intermediate panel-carrier assembly to a heat release temperature. The release workstation may include a release unit having a release-head movable towards the deck surface of the carrier-support deck to engage a molded panel of the intermediate panel-carrier assembly on the deck surface. The release-head may include a retaining member configured to releasably retain the molded panel to an engagement surface of the release-head. The release-head may further be movable away from the deck surface of the carrier-support deck, with the retaining member of the release-head releasably retaining the molded panel.

Disclosed are a method of manufacturing a display apparatus and a display apparatus manufactured thereby, wherein the method of manufacturing the display apparatus includes a step of forming a T-shaped light-emitting rod including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, a step of laying and aligning the T-shaped light-emitting rod on a control substrate in a lateral direction (), and a step of forming a first electrode connected to the first conductive semiconductor layer of the aligned T-shaped light-emitting rod, forming a second electrode connected to the second conductive semiconductor layer, and connecting the first electrode and the second electrode to contact electrodes on the control substrate, respectively.

Disclosed are a method of manufacturing a display apparatus and a display apparatus manufactured thereby, wherein the method of manufacturing the display apparatus includes a step of forming a T-shaped light-emitting rod including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, a step of laying and aligning the T-shaped light-emitting rod on a control substrate in a lateral direction (), and a step of forming a first electrode connected to the first conductive semiconductor layer of the aligned T-shaped light-emitting rod, forming a second electrode connected to the second conductive semiconductor layer, and connecting the first electrode and the second electrode to contact electrodes on the control substrate, respectively.

A manufacturing method includes providing a first substrate including a circuit layer and an electronic element disposed on the circuit layer, providing a second substrate, bonding the first substrate and the second substrate to form an electronic module, cutting the electronic module, forming a wire on a first surface exposed after cutting the electronic module and on a second surface of the electronic module, wherein the first surface is adjacent to the second surface and the wire is electrically connected to the circuit layer, and disposing a driving element on the second surface of the electronic module to be electrically connected to the wire.

A manufacturing method includes providing a first substrate including a circuit layer and an electronic element disposed on the circuit layer, providing a second substrate, bonding the first substrate and the second substrate to form an electronic module, cutting the electronic module, forming a wire on a first surface exposed after cutting the electronic module and on a second surface of the electronic module, wherein the first surface is adjacent to the second surface and the wire is electrically connected to the circuit layer, and disposing a driving element on the second surface of the electronic module to be electrically connected to the wire.