H10H29/02

DISPLAY MODULE AND METHOD OF MANUFACTURING THE SAME
20260020423 · 2026-01-15 ·

A pixel module includes a substrate, a first sub-pixel unit, and a second sub-pixel unit. The first sub-pixel unit is disposed on the substrate, and includes a first light-emitting unit, a second light-emitting unit, and a light-transmitting layer. The first light-emitting unit and the second light-emitting unit are connected in series through the light-transmitting layer and are located on the same side of the light-transmitting layer. The second sub-pixel unit is disposed on the substrate, and the first sub-pixel unit and the second sub-pixel unit can emit different color lights.

DISPLAY MODULE AND METHOD OF MANUFACTURING THE SAME
20260020423 · 2026-01-15 ·

A pixel module includes a substrate, a first sub-pixel unit, and a second sub-pixel unit. The first sub-pixel unit is disposed on the substrate, and includes a first light-emitting unit, a second light-emitting unit, and a light-transmitting layer. The first light-emitting unit and the second light-emitting unit are connected in series through the light-transmitting layer and are located on the same side of the light-transmitting layer. The second sub-pixel unit is disposed on the substrate, and the first sub-pixel unit and the second sub-pixel unit can emit different color lights.

STAMP ASSEMBLY, LIGHT EMITTING ELEMENT TRANSFER DEVICE, AND TRANSFER METHOD THEREOF
20260026146 · 2026-01-22 ·

A stamp assembly includes a stamp member including a stamp layer and a base layer, a magnetic plate which applies a magnetic force on a top surface of the base layer and a plurality of magnetic beads which are attachable and detachable to the stamp layer by the magnetic force of the first magnetic plate.

STAMP ASSEMBLY, LIGHT EMITTING ELEMENT TRANSFER DEVICE, AND TRANSFER METHOD THEREOF
20260026146 · 2026-01-22 ·

A stamp assembly includes a stamp member including a stamp layer and a base layer, a magnetic plate which applies a magnetic force on a top surface of the base layer and a plurality of magnetic beads which are attachable and detachable to the stamp layer by the magnetic force of the first magnetic plate.

DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME
20260033061 · 2026-01-29 · ·

A display panel and a method of manufacturing the same are discussed. The display panel can include a first light-emitting element disposed on a first bank, a second light-emitting element disposed on a second bank, and a third light-emitting element disposed on a third bank. The first light-emitting element, the second light-emitting element, and the third light-emitting element are configured to emit light of different wavelengths. Further, at least one of the first bank, the second bank, and the third bank has a size different from a size of any of the other banks.

DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME
20260033061 · 2026-01-29 · ·

A display panel and a method of manufacturing the same are discussed. The display panel can include a first light-emitting element disposed on a first bank, a second light-emitting element disposed on a second bank, and a third light-emitting element disposed on a third bank. The first light-emitting element, the second light-emitting element, and the third light-emitting element are configured to emit light of different wavelengths. Further, at least one of the first bank, the second bank, and the third bank has a size different from a size of any of the other banks.

MASK MEMBER, LIGHT EMITTING ELEMENT TRANSFER DEVICE, AND METHOD OF TRANSFERRING THE LIGHT EMITTING ELEMENT

A mask member, a light emitting element transfer device, and a transfer method are provided. A mask member includes a first mask including a light blocking pattern layer and a base layer, wherein the light blocking pattern layer of the first mask includes a plurality of opening patterns, and a second mask including a light blocking pattern layer and a base layer, wherein the light blocking pattern layer of the second mask includes a plurality of opening patterns disposed at angles relative to a center of the second mask. The mask member defining a transfer area by overlapping an opening pattern of the plurality of opening patterns of the first mask and an opening pattern of the plurality of opening patterns of the second mask.

MASK MEMBER, LIGHT EMITTING ELEMENT TRANSFER DEVICE, AND METHOD OF TRANSFERRING THE LIGHT EMITTING ELEMENT

A mask member, a light emitting element transfer device, and a transfer method are provided. A mask member includes a first mask including a light blocking pattern layer and a base layer, wherein the light blocking pattern layer of the first mask includes a plurality of opening patterns, and a second mask including a light blocking pattern layer and a base layer, wherein the light blocking pattern layer of the second mask includes a plurality of opening patterns disposed at angles relative to a center of the second mask. The mask member defining a transfer area by overlapping an opening pattern of the plurality of opening patterns of the first mask and an opening pattern of the plurality of opening patterns of the second mask.

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
20260052822 · 2026-02-19 · ·

An electronic device includes a flexible substrate, a circuit layer, a first electronic unit and a second electronic unit. The flexible substrate includes a main portion and a curve portion connected to the main portion. The circuit layer is disposed on the flexible substrate, and includes a first pad disposed on the main portion and a second pad disposed on the curve portion. The first electronic unit is bonded on the first pad. The second electronic unit is bonded on the second pad. An area of the second pad is different from an area of the first pad.

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
20260052822 · 2026-02-19 · ·

An electronic device includes a flexible substrate, a circuit layer, a first electronic unit and a second electronic unit. The flexible substrate includes a main portion and a curve portion connected to the main portion. The circuit layer is disposed on the flexible substrate, and includes a first pad disposed on the main portion and a second pad disposed on the curve portion. The first electronic unit is bonded on the first pad. The second electronic unit is bonded on the second pad. An area of the second pad is different from an area of the first pad.