Embodiments of the present application provide a display screen and a wireless communication device. The display screen includes: a substrate including a modulation circuit; a functional layer provided on the substrate and including a plurality of reflecting units, where the reflecting unit is configured to reflect a wireless signal and is connected to the modulation circuit, and the modulation circuit is configured to adjust at least one of an amplitude and a phase of an electrical signal on the reflecting unit; and a shielding layer provided on a side of the functional layer facing the substrate.

Embodiments of the present application provide a display screen and a wireless communication device. The display screen includes: a substrate including a modulation circuit; a functional layer provided on the substrate and including a plurality of reflecting units, where the reflecting unit is configured to reflect a wireless signal and is connected to the modulation circuit, and the modulation circuit is configured to adjust at least one of an amplitude and a phase of an electrical signal on the reflecting unit; and a shielding layer provided on a side of the functional layer facing the substrate.

A display device and a splicing display device are provided. The display device includes a substrate layer, a capping layer, and a light-emitting element. The capping layer is disposed on the substrate layer and has a light-exiting region. The light-emitting element is disposed on the substrate layer and emits light toward the light-exiting region of the capping layer. A distance from the light-exiting region to the side surface of the capping layer is defined as D. A thickness of the capping layer is defined as T. A refractive index of the capping layer is defined as n1. D, T, and n1 meet the following equation: Tan.sup.1(D/T)>Sin.sup.1(1/n1). The splicing display device includes a plurality of display devices, and the display devices are spliced together. In the display device and the splicing display device, optical defects such as a shining edge, a ghost image, or a shadow effect are reduced.

A manufacturing method of an electronic device includes providing a first substrate, wherein the first substrate includes a circuit layer; cutting the first substrate; forming a wire on a first surface which is exposed after cutting the first substrate and on a second surface of the first substrate, wherein the first surface is adjacent to the second surface, and the wire is electrically connected to the circuit layer; disposing an electronic element on the circuit layer; bonding the first substrate after cutting and a second substrate to form an electronic module; and disposing a driving element on the second surface of the first substrate to be electrically connected to the wire.

A manufacturing method of an electronic device includes providing a first substrate, wherein the first substrate includes a circuit layer; cutting the first substrate; forming a wire on a first surface which is exposed after cutting the first substrate and on a second surface of the first substrate, wherein the first surface is adjacent to the second surface, and the wire is electrically connected to the circuit layer; disposing an electronic element on the circuit layer; bonding the first substrate after cutting and a second substrate to form an electronic module; and disposing a driving element on the second surface of the first substrate to be electrically connected to the wire.

Discussed is a display device and, more specifically, can include a display device capable of preventing or reducing mura defects by including a display panel, a functional member disposed on the display panel, and an adhesive layer disposed between the display panel and the functional member and adjusting the modulus and creep of the adhesive layer.

Discussed is a display device and, more specifically, can include a display device capable of preventing or reducing mura defects by including a display panel, a functional member disposed on the display panel, and an adhesive layer disposed between the display panel and the functional member and adjusting the modulus and creep of the adhesive layer.

An electronic device includes a second substrate disposed relative to a first substrate, a first light-emitting unit disposed between the first substrate and the second substrate, a first microstructure on the first surface of the first light-emitting unit and the first surface away from the first substrate, and an adhesive layer disposed between the second substrate and the first surface of the first light-emitting unit. There is a first gap between the adhesive layer and the first microstructure.

An electronic device includes a second substrate disposed relative to a first substrate, a first light-emitting unit disposed between the first substrate and the second substrate, a first microstructure on the first surface of the first light-emitting unit and the first surface away from the first substrate, and an adhesive layer disposed between the second substrate and the first surface of the first light-emitting unit. There is a first gap between the adhesive layer and the first microstructure.

Provided is a display device including a light emitting element layer disposed on a substrate, a thin-film encapsulation layer disposed on the light emitting element layer, a counter substrate facing the substrate, a color filter layer disposed on a surface of the counter substrate and having light transmitting areas and a light blocking area defined, a wavelength conversion layer disposed on the color filter layer, and a filling layer disposed between the wavelength conversion layer and the thin-film encapsulation layer, wherein the wavelength conversion layer includes, a bank overlapping the light blocking area, light transmitting members disposed between portions of the bank and spaced apart from each other, and organic layers spaced apart from each other with the bank interposed between the organic layers and covering the light transmitting members, and lower surfaces of the organic layers and a lower surface of the bank are disposed on a same layer.