The micro LED array electronic device suggested in one example of the present invention is a micro LED array comprising a plurality of light emitting devices arranged in columns and rows, which comprises two electrodes formed extending in one direction on a substrate; and cured polymers that fill the gap between the electrodes and vertically spaced electronic devices and comprises ferromagnetic particles, wherein the gap between the plurality of electronic devices is 5 m or more and 100 m or less.

The micro LED array electronic device suggested in one example of the present invention is a micro LED array comprising a plurality of light emitting devices arranged in columns and rows, which comprises two electrodes formed extending in one direction on a substrate; and cured polymers that fill the gap between the electrodes and vertically spaced electronic devices and comprises ferromagnetic particles, wherein the gap between the plurality of electronic devices is 5 m or more and 100 m or less.

A self-assembly apparatus can include a fluid chamber for accommodating a fluid and semiconductor light-emitting elements, a conveyor to convey an assembly substrate so one surface of the assembly substrate is immersed in the fluid, the assembly substrate having a plurality of assembly electrodes, a magnet array spaced apart from the fluid chamber to apply a magnetic force to the semiconductor light-emitting elements, a power supply to apply power to the plurality of assembly electrodes disposed on the assembly substrate so that the semiconductor light-emitting elements are seated in a preset region on the assembly substrate, and a repair substrate disposed to face the one surface of the assembly substrate and including a plurality of pair electrodes on which an electric field is generated as power is supplied. The plurality of pair electrodes can be disposed at the same interval as the plurality of assembly electrodes.

A self-assembly apparatus can include a fluid chamber for accommodating a fluid and semiconductor light-emitting elements, a conveyor to convey an assembly substrate so one surface of the assembly substrate is immersed in the fluid, the assembly substrate having a plurality of assembly electrodes, a magnet array spaced apart from the fluid chamber to apply a magnetic force to the semiconductor light-emitting elements, a power supply to apply power to the plurality of assembly electrodes disposed on the assembly substrate so that the semiconductor light-emitting elements are seated in a preset region on the assembly substrate, and a repair substrate disposed to face the one surface of the assembly substrate and including a plurality of pair electrodes on which an electric field is generated as power is supplied. The plurality of pair electrodes can be disposed at the same interval as the plurality of assembly electrodes.

A light emitting element includes a first element rod including a first semiconductor layer and an active layer and having a first inclination angle on a side surface; a second element rod on the first element rod and having a second inclination angle on a side surface; a third element rod on the second element rod and having a third inclination angle on a side surface, the second inclination angle being smaller than the first inclination angle and the third inclination angle; a protective layer around one side and an other side of the first element rod, a side of the second element rod, and a side of the third element rod; and a contact electrode around the protective layer and electrically connected to the first semiconductor layer.

The present disclosure relates to an LED electrode assembly, and more specifically to an ultra-thin LED electrode assembly, a manufacturing method thereof and a light source including the same. According to the present disclosure, even an LED element having a small aspect ratio that is difficult to receive a positive dielectrophoretic force can be easily self-aligned on a target electrode, and the LED element can be self-aligned on an electrode regardless of the distance between two electrodes forming an electric field and the size of the LED element.

The present disclosure relates to an LED electrode assembly, and more specifically to an ultra-thin LED electrode assembly, a manufacturing method thereof and a light source including the same. According to the present disclosure, even an LED element having a small aspect ratio that is difficult to receive a positive dielectrophoretic force can be easily self-aligned on a target electrode, and the LED element can be self-aligned on an electrode regardless of the distance between two electrodes forming an electric field and the size of the LED element.

The present invention relates to a full-color LED display and a method for manufacturing thereof. According to this, LED elements with small aspect ratios that are difficult to receive positive dielectrophoretic force can be easily magnetically aligned on the desired electrode, and LED elements can be magnetically aligned on the electrode regardless of the distance between the two electrodes forming the electric field and the size of the LED element.

The present invention relates to a full-color LED display and a method for manufacturing thereof. According to this, LED elements with small aspect ratios that are difficult to receive positive dielectrophoretic force can be easily magnetically aligned on the desired electrode, and LED elements can be magnetically aligned on the electrode regardless of the distance between the two electrodes forming the electric field and the size of the LED element.

In an embodiment a method includes providing a carrier, applying a plurality of semiconductor chips to the carrier, the semiconductor chips being spaced apart from one another such that cavities are formed between the semiconductor chips, introducing a photo-exposable material, at least the cavities being filled with the photo-exposable material, exposing the photo-exposable material, wherein parts of the photo-exposable material, which are downstream of the semiconductor chips with respect to an exposure remain unexposed, removing unexposed parts of the photo-exposable material, wherein recesses are formed, applying a functional layer to the semiconductor chips, and removing the exposed photo-exposable material.