Provided is a method of transferring micro light-emitting devices, including providing a first substrate including a first photosensitive layer and a first adhesive layer, providing micro light-emitting devices on the first adhesive layer, patterning the first photosensitive layer and the first adhesive layer to correspond to shapes of the micro light-emitting devices, providing a second substrate, which includes a second photosensitive layer and a second adhesive layer, above the micro light-emitting devices, and irradiating light onto the first photosensitive layer through the first substrate to transfer the micro light-emitting devices onto the second substrate.

Provided is a method of transferring micro light-emitting devices, including providing a first substrate including a first photosensitive layer and a first adhesive layer, providing micro light-emitting devices on the first adhesive layer, patterning the first photosensitive layer and the first adhesive layer to correspond to shapes of the micro light-emitting devices, providing a second substrate, which includes a second photosensitive layer and a second adhesive layer, above the micro light-emitting devices, and irradiating light onto the first photosensitive layer through the first substrate to transfer the micro light-emitting devices onto the second substrate.

An apparatus for manufacturing a display device includes a chamber, a stage supporting a target substrate, an electric field application module disposed at a side of the stage, a heating element overlapping the stage in a plan view, a heat source part that moves in a direction parallel to a plane the stage extends on the stage, and a vacuum pump connected to the chamber.

An apparatus for manufacturing a display device includes a chamber, a stage supporting a target substrate, an electric field application module disposed at a side of the stage, a heating element overlapping the stage in a plan view, a heat source part that moves in a direction parallel to a plane the stage extends on the stage, and a vacuum pump connected to the chamber.

The present embodiment comprises: a substrate chuck on which a substrate is seated; a transfer head having a suction plate to which donor is suctioned and transferring an LED-chip having been transferred to the donor onto the substrate; and a vision sensor disposed under the substrate chuck, wherein a light source for emitting light toward the donor is disposed on the suction plate.

The present embodiment comprises: a substrate chuck on which a substrate is seated; a transfer head having a suction plate to which donor is suctioned and transferring an LED-chip having been transferred to the donor onto the substrate; and a vision sensor disposed under the substrate chuck, wherein a light source for emitting light toward the donor is disposed on the suction plate.

There may be provided a release workstation, processing or panel release system including the release workstation, and methods of operating the same. The processing or panel release system may include a carrier-support deck having a deck surface capable of supporting an intermediate panel-carrier assembly thereon, and a release-heater associated with the deck surface and operable to heat the intermediate panel-carrier assembly to a heat release temperature. The release workstation may include a release unit having a release-head movable towards the deck surface of the carrier-support deck to engage a molded panel of the intermediate panel-carrier assembly on the deck surface. The release-head may include a retaining member configured to releasably retain the molded panel to an engagement surface of the release-head. The release-head may further be movable away from the deck surface of the carrier-support deck, with the retaining member of the release-head releasably retaining the molded panel.

There may be provided a release workstation, processing or panel release system including the release workstation, and methods of operating the same. The processing or panel release system may include a carrier-support deck having a deck surface capable of supporting an intermediate panel-carrier assembly thereon, and a release-heater associated with the deck surface and operable to heat the intermediate panel-carrier assembly to a heat release temperature. The release workstation may include a release unit having a release-head movable towards the deck surface of the carrier-support deck to engage a molded panel of the intermediate panel-carrier assembly on the deck surface. The release-head may include a retaining member configured to releasably retain the molded panel to an engagement surface of the release-head. The release-head may further be movable away from the deck surface of the carrier-support deck, with the retaining member of the release-head releasably retaining the molded panel.

A semiconductor light-emitting element package may include a semiconductor substrate having a first region and a second region, a first semiconductor light-emitting element on the first region of the semiconductor substrate, a pair of assembling wirings on the second region of the semiconductor substrate, and a second semiconductor light-emitting element and a third semiconductor light-emitting element on the pair of assembling wirings.

A a method for manufacturing an optoelectronic device including at least one LED and at least one photodiode, including the following consecutive steps: a) epitaxially forming an active semiconductor emitting and receiving stack common to the LED and photodiode; b) forming trenches extending vertically through the active stack, and laterally delimiting the LED and photodiode, wherein the trenches are arranged so that the lateral dimensions of the LED are smaller than the lateral dimensions of the photodiode.