Disclosed example gas control methods include: detecting an oxygen concentration in said furnace chamber wherein said detected oxygen concentration reflects an actual detection value (D.sub.V); setting a regulation set value (R.sub.V) greater than a target set value (T.sub.V) of an oxygen concentration; when D.sub.V is greater than said R.sub.V, increasing the opening extent of a first intake valve device and that of a second intake valve device until D.sub.V is smaller than R.sub.V, wherein said first intake valve device establishes fluid communication between a preheating zone and said working gas source, and said second intake valve device establishes fluid communication between said cooling zone and said working gas source; and when D.sub.V is smaller than R.sub.V, keeping the opening extent of said first intake valve device at a preset value and decreasing the opening extent of said second intake valve device until D.sub.V is equal to T.sub.V.

A solder composition contains: a flux composition containing an (A) rosin resin, a (B) activator, a (C) thixotropic agent, and a (D) solvent; and (E) solder powder, in which the (B) component contains a (B1) dicarboxylic acid having 3 to 8 carbon atoms, the (C) component contains at least one selected from the group consisting of a (C1) amide thixotropic agent having a hydroxy group in one molecule and a (C2) glycerol thixotropic agent having a hydroxy group in one molecule, and the solder composition satisfies a condition represented by Numerical Formula (F1) below provided that a total of contents of the (C1) component and the (C2) component is defined as X and a content of the (B1) component is defined as Y,
X/2Y5X(F1).

A method of determining a cutter height on a wedge bonding machine is provided. The method includes the steps of: (a) lowering a wedge bonding tool toward a surface on the wedge bonding machine; (b) determining a first height measurement when the wedge bonding tool contacts the surface; (c) lowering a cutter of the wedge bonding machine, relative to the wedge bonding tool; (d) determining a second height measurement when the cutter contacts the surface; and (e) determining a cutter height using the first height measurement and the second height measurement.

The present application provides a position detection apparatus, comprising a bottom plate, an abutting member, a trigger member, a trigger member, and a distance sensor. The abutting member is movably disposed on the bottom plate. The trigger member is connected to the abutting member. The induction member is disposed on the trigger member. The distance sensor is disposed on the bottom plate. The induction member and the distance sensor are disposed such that: the distance sensor is capable of detecting a movement distance of the induction member when the abutting member drives the induction member to move, and wherein the trigger member bypasses the distance sensor. The position detection apparatus of the present application has a higher detection accuracy of relative movement of the induction member to the distance sensor.

A circuit board clamp includes a clamp frame having a first and second frame supports. The clamp frame also includes a top plate arranged between the first and second frame supports. The top plate supports a piston via a threaded fastener engaging a top plate aperture. The piston may be displaced relative to the top plate in accordance with adjustment of the threaded fastener. A pressure plate assembly has a pressure plate and a stem attached to the pressure plate. The stem is positioned within a tubular section of the piston, and the pressure plate is positioned opposite the circuit board from the heat sink. The pressure plate contacts a surface mounted integrated circuit between the circuit board and the pressure plate. A bias member is seated on the bias seat and applies a biasing force on the pressure plate.

A heating device suitable for heating at least one soldered joint between an electronic component including at least a first contact mound and a printed circuit board. The soldered joint on the one hand securing the electronic component to the printed circuit board and on the other hand, while providing electrical continuity, the electronic component also having an electronic-component width, and an electronic-component thickness, wherein it includes an electrical-connection suitable for being coupled to an electrical power supply and a heater suitable for reaching a temperature at least equal to the melting point of the solder.

A method for a heating device suitable for heating at least one soldered joint between an electronic component including at least a first contact mound and a printed circuit board. The soldered joint on the one hand securing the electronic component to the printed circuit board and on the other hand, while providing electrical continuity, the electronic component also having an electronic-component width, and an electronic-component thickness, wherein it includes an electrical-connection suitable for being coupled to an electrical power supply and a heater suitable for reaching a temperature at least equal to the melting point of the solder.

The invention discloses a single-headed tin ball implantation spray head, which comprises a spray head body, wherein a longitudinal blanking channel and a feeding channel communicated with the longitudinal blanking channel are respectively formed in the spray head body, and a feeding channel communicated with the feeding channel is formed on the spray head body; A blanking control mechanism is arranged on the main body of the spray head, and the blanking control mechanism corresponds to the position where the feed channel is communicated with the longitudinal blanking channel. The single-head solder ball implantation spray head can control the solder balls to move quickly in the spray head body and spray out from the nozzle one by one in an orderly manner, can accurately implant the solder balls on the surface of a circuit board, a wafer or a chip, can accurately control the solder balls with a particle size of more than 0.06 mm for ball implantation, and has high ball implantation efficiency, yield and accuracy, and is suitable for ball implantation of components with various shapes, models and sizes, with low processing cost and good operation stability.

Provided is a method of bonding column type deposits, and more specifically, a method of bonding, to a substrate, column type deposits which are formed in a column shape and connect a substrate and electrodes of a semiconductor chip so as to connect the semiconductor chip to the substrate. The method of bonding the column type deposits to the substrate enables bonding the column type deposits having a high aspect ratio to accurate positions while being kept aligned vertically on the substrate.

A method of fabricating an electronic component includes: controlling a laser cutting tool at a first pulse rate to form a first cut portion in a feature of the electronic component, the feature having opposite first and second sides spaced apart from one another along a first direction, and third and fourth sides spaced apart from one another along a second direction, the first cut portion extending from the third side toward the fourth side; controlling the laser cutting tool at a higher second pulse rate and to form a second cut portion extending from the first cut portion toward the fourth side; and controlling the laser cutting tool at a third pulse rate to form a final cut portion extending from the second cut portion toward the fourth side, the third pulse rate less than the second pulse rate.