Disclosed is a structure of a unit sub-pixel having a size of several microns or tens of microns divided into a plurality of light emitters and connected to each other so that the divided light emitters are diode-connected, and a manufacturing method thereof. By increasing the operating voltage to multiples of voltage values near the turn-on voltage of a single light emitter, power-consumption efficiency is increased, and light efficiency is increased.

A display device is disclosed that includes a substrate, a bank layer disposed on the substrate, and a reflective layer disposed on a side surface of the bank layer and in contact with a light-transmitting layer, a second color quantum dot layer or a third color quantum dot layer, wherein the bank layer and the reflective layer together have a length of 1 m or less in a direction parallel to the substrate.

A display device includes a first electrode above a substrate, a second electrode above the substrate, and spaced apart from the first electrode in a first direction, an inorganic light-emitting element in a first auxiliary pixel area, above the first electrode, and connected to the first electrode, an organic light-emitting layer above the substrate, in a second auxiliary pixel area spaced apart from the first auxiliary pixel area in the first direction, and covering the second electrode, and a third electrode above the organic light-emitting layer.

A display device can include a substrate having a plurality of first sub pixels and a plurality of second sub pixels, a plurality of first light emitting diodes disposed in the plurality of first sub pixels and configured to emit light to one surface of the substrate, and a plurality of second light emitting diodes disposed in the plurality of second sub pixels and configured to emit light to an opposite surface to one surface of the substrate. The plurality of first light emitting diodes and the plurality of second light emitting diodes are alternately disposed on the plane. Accordingly, light is emitted to opposite surfaces of the substrate to display images on the opposite surfaces of the substrate.

The present disclosure discloses a light emitting module including at least one light emitting device, the light emitting device comprising a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer.

A semiconductor device is provided. The semiconductor device includes a semiconductor structure, an outer electrode structure, an inner electrode structure, and an adjustment structure. The semiconductor structure includes a first portion and a second portion, wherein the second portion is on the first portion and includes an active region. The outer electrode structure is on the first portion of the semiconductor structure and has a first top surface. The inner electrode structure is on the second portion of the semiconductor structure and has a second top surface. The adjustment structure covers the semiconductor structure and is in contact with the outer electrode structure and the inner electrode structure, and the adjustment structure has a third top surface. The third top surface is substantially coplanar with either the first top surface, the second top surface, or both.

The present disclosure provides a light-emitting chip, a light-emitting device and a display apparatus. The light-emitting chip includes a pixel circuit layer, a light-emitting unit group located on a side of the pixel circuit layer, and a plurality of conductive pads located on a side of the pixel circuit layer facing away from the light-emitting unit. The pixel circuit layer includes at least a part of the structure of the pixel circuit and a plurality of signal lines. The light-emitting unit group includes at least one light-emitting unit, the light-emitting unit is electrically connected with the pixel circuit. One of the conductive pads is electrically connected with one of the signal lines. The light-emitting device includes the plurality of light-emitting chips and the second drive circuit, the plurality of conductive pads are connected with the second drive circuit. The display apparatus includes a light-emitting device.

Display structures and methods of fabrication are described. In an embodiment, a display structure includes an array of pixel driver chips embedded in an insulation layer, a redistribution layer (RDL) over and in electrical contact with the array of pixel driver chips, and an array of light emitting diodes (LEDs) over and in electrical contact with the RDL, where the array of LEDs includes different groups of LEDs designed for different wavelength emission spectra, and the top surfaces of the LEDs are coplanar.

An optoelectronic device includes a semiconductor stack, including a first semiconductor layer, an active layer, and a second semiconductor layer; a contact electrode formed on the second semiconductor layer; an insulating reflective structure covering the contact electrode and including a plurality of insulating reflective structure openings to expose the contact electrode; a metal reflective structure covering the plurality of insulating reflective structure openings to electrically connect to the contact electrode; and an insulating structure including one or more first insulating structure openings to expose the first semiconductor layer and one or more second insulating structure openings to expose the metal reflective structure.

A display apparatus includes a through hole panel, a mounting module including a plurality of light emitting diodes (LEDs) and disposed to oppose the through hole panel, and a plurality of supporting reinforcement parts including a first portion of one or more supporting reinforcement parts disposed in a first direction and in contact with the through hole panel, and a second portion of one or more supporting reinforcement parts disposed in a second direction and in contact with the mounting module. The first portion and the second are configured to adjust a spacing distance between the through hole panel and the mounting module.