A display panel includes an integrated circuit substrate, a light-emitting device layer and a second electrode. The light-emitting device layer includes light-emitting devices disposed respectively in light-emitting areas and insulating layers disposed respectively in insulating barrier areas, and each insulating barrier area is disposed between two adjacent light-emitting areas. Each insulating layer has opposite ends respectively connected to the second electrode and the integrated circuit substrate and each light-emitting device is surrounded by several insulating layers, so that the several insulating layers, the second electrode and the integrated circuit substrate together form a closed accommodating chamber for accommodating the light-emitting device.

Disclosed are a micro-display chip and a preparation method thereof. The micro-display chip includes: a self-luminescence layer, a wavelength conversion layer, and a first transmitting-and-reflecting layer and/or a second transmitting-and-reflecting layer; the first transmitting-and-reflecting layer is disposed between the self-luminescence layer and the wavelength conversion layer; the second transmitting-and-reflecting layer is disposed on another surface of the wavelength conversion layer; the first transmitting-and-reflecting layer has low reflectivity and high transmissivity for the first color light and high reflectivity and low transmissivity for the second color light, and the second transmitting-and-reflecting layer has high reflectivity and low transmissivity for the first color light and low reflectivity and high transmissivity for the second color light. The micro-display chip of the present disclosure can effectively improve the absorbance and color purity of conversion light, thereby obtaining a brighter and purer conversion spectrum.

Disclosed are a display panel and a display device. The display panel is provided with an display region and a peripheral region, and includes a display substrate and at least one alignment mark disposed in the peripheral region. The display substrate is sequentially provided with a first packaging layer, a light-shielding layer, and a second packaging layer at a side, distal to the base substrate, of a second electrode layer. The light-shielding layer is provided with an opening hole, and a distance between a medial edge of the opening hole and a first end of the light-shielding layer is greater than a distance between a lateral edge of the opening hole and a second end of the light-shielding layer.

A splicing display device is provided. The splicing display device includes at least two first display units and a second display unit. The first display units are spliced and connected. Each of the first display units includes a non-display area. The second display unit is disposed on a light-emitting side of the first display units, and attached and fixed to a splicing position of the non-display areas of the two adjacent first display units.

Provided is a display panel. The display panel includes a base substrate, a light-emitting layer, a package layer, and a light conversion layer that are successively stacked. The light conversion layer includes a plurality of light conversion units arranged in an array and a plurality of micro-mirror structures. The plurality of light conversion units include a plurality of first light conversion units, and the plurality of micro-mirror structures include a plurality of first micro-mirror structures surrounding the first light conversion units. Each of the first micro-mirror structures is configured to reflect at least a portion of light from an interior of each of the first light conversion units.

A light-emitting diode module includes a casing, a lead frame, a plurality of light-emitting diodes, a control circuit, a first external power supply, a second external power supply, a first power supply pin, and a second power supply pin. The lead frame is disposed in the casing, and the lead frame has a first surface and a second surface. The second surface is opposite to the first surface. The light-emitting diodes include a first light-emitting diode, a second light-emitting diode and a third light-emitting diode, which are disposed on the first surface of the lead frame. At least one of the first light-emitting diode, the second light-emitting diode and the third light-emitting diode is electrically connected to the first external power supply through the first power supply pin, and the control circuit is electrically connected to the second external power supply through the second power supply pin.

A light-emitting unit and a light-emitting device are provided. The light-emitting unit includes a light-emitting chip and an optical encapsulant. The light-emitting unit has a top surface and a bottom surface opposite to each other in the thickness direction, and a surrounding side surface. The top surface and the bottom surface are surrounded by the surrounding side surface, and the light-emitting chip includes a connection pad located on the bottom surface and a wire bonding point that is located on the top surface. The surrounding side surface of the light-emitting chip is surrounded by the optical encapsulant, and the top surface and the bottom surface of the light-emitting chip are exposed outside of the optical encapsulant.

In accordance with one or more aspects of the present disclosure, an apparatus incorporating micro-LEDs is provided. The apparatus may include a first plurality of light-emitting devices for emitting light of a first color, a second light-emitting device for emitting light of a second color, and a light-conversion structure that converts light emitted by at least one of the first plurality of light-emitting devices into light of a third color. The first plurality of light-emitting devices may be fabricated on a substrate. The second light-emitting device is fabricated on a conductive via that is fabricated on the substrate. The light-conversion structure may include a plurality of quantum dots.

A light emitting element containing a Group III nitride semiconductor has a first light emitting region and a second light emitting region having different emission wavelengths, the first light emitting region has a plurality of first regions, the second light emitting region has a plurality of second regions, a planar pattern of the first light emitting region and the second light emitting region is a pattern in which a plurality of units are arranged in a predetermined direction, each of the units being a pattern including one or more of the first regions and one or more of the second regions, and the plurality of first regions are electrically connected to each other in parallel, and the plurality of second regions are electrically connected to each other in parallel.

This specification discloses a light emitting devices with electrical pads improving performance. The electrical pads are disposed under the dies to prevent hot spots from occurring, particularly under the peak luminance areas of shaped luminance dies. The electrical pads may have asymmetric n and p areas, with the larger of the areas being disposed under the peak luminance area while the gap between the n and p areas do not overlap the peak luminance area. The electrical pads of different dies are bridged by horizontal or diagonal connections between the dies.